RU2691007C1 - Титаново-медный материал для электронных компонентов - Google Patents

Титаново-медный материал для электронных компонентов Download PDF

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Publication number
RU2691007C1
RU2691007C1 RU2018133244A RU2018133244A RU2691007C1 RU 2691007 C1 RU2691007 C1 RU 2691007C1 RU 2018133244 A RU2018133244 A RU 2018133244A RU 2018133244 A RU2018133244 A RU 2018133244A RU 2691007 C1 RU2691007 C1 RU 2691007C1
Authority
RU
Russia
Prior art keywords
titanium
copper material
crystals
copper
rolling
Prior art date
Application number
RU2018133244A
Other languages
English (en)
Russian (ru)
Inventor
Хироясу ХОРИЭ
Original Assignee
ДжейЭкс НИППОН МАЙНИНГ ЭНД МЕТАЛЗ КОРПОРЕЙШН
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ДжейЭкс НИППОН МАЙНИНГ ЭНД МЕТАЛЗ КОРПОРЕЙШН filed Critical ДжейЭкс НИППОН МАЙНИНГ ЭНД МЕТАЛЗ КОРПОРЕЙШН
Application granted granted Critical
Publication of RU2691007C1 publication Critical patent/RU2691007C1/ru

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Classifications

    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C9/00Alloys based on copper
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22FCHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026Alloys based on copper
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22FCHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/02Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working in inert or controlled atmosphere or vacuum

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Conductive Materials (AREA)
RU2018133244A 2017-09-22 2018-09-20 Титаново-медный материал для электронных компонентов RU2691007C1 (ru)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-182738 2017-09-22
JP2017182738A JP6310130B1 (ja) 2017-09-22 2017-09-22 電子部品用チタン銅

Publications (1)

Publication Number Publication Date
RU2691007C1 true RU2691007C1 (ru) 2019-06-07

Family

ID=61902014

Family Applications (1)

Application Number Title Priority Date Filing Date
RU2018133244A RU2691007C1 (ru) 2017-09-22 2018-09-20 Титаново-медный материал для электронных компонентов

Country Status (3)

Country Link
EP (1) EP3460081B1 (fr)
JP (1) JP6310130B1 (fr)
RU (1) RU2691007C1 (fr)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU454751A3 (ru) * 1969-05-05 1974-12-25 Феб Мансфельд Комбинат "Вильгельм Пик" Вальверк Хетштедт (Инопредприятие) Меднохромотитанова лигатура
RU2104139C1 (ru) * 1996-09-20 1998-02-10 Товарищество с ограниченной ответственностью Научно-техническая фирма "Техма" Дисперсно-упрочненный материал для электродов контактной сварки
US8097102B2 (en) * 2008-12-08 2012-01-17 Dowa Metaltech Co., Ltd. Cu-Ti-based copper alloy sheet material and method of manufacturing same
EP2610358A1 (fr) * 2010-08-27 2013-07-03 Furukawa Electric Co., Ltd. Feuille d'alliage de cuivre et procédé de fabrication de celle-ci
EP3088541A1 (fr) * 2013-12-27 2016-11-02 JX Nippon Mining & Metals Corporation Alliage de cuivre-titane pour composant électronique
EP2784167B1 (fr) * 2013-03-25 2017-07-26 Dowa Metaltech Co., Ltd. Feuille d'alliage de cuivre à base de cu-ti, son procédé de fabrication et composant portant de courant électrique

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60114558A (ja) * 1983-11-22 1985-06-21 Ngk Insulators Ltd 時効硬化性チタニウム銅合金展伸材の製造法
JP3942505B2 (ja) 2002-07-16 2007-07-11 ヤマハメタニクス株式会社 チタン銅合金材及びその製造方法
JP4439003B2 (ja) * 2005-03-28 2010-03-24 日鉱金属株式会社 強度と曲げ加工性に優れたチタン銅合金及びその製造方法
EP2196548B1 (fr) * 2008-12-02 2012-05-16 Dowa Metaltech Co., Ltd. Matériau de feuille d'alliage de cuivre à base de Cu-Ti et son procédé de fabrication
EP2612934A1 (fr) 2010-08-31 2013-07-10 Furukawa Electric Co., Ltd. Matériau en feuille d'alliage de cuivre et son procédé de fabrication
JP2013100586A (ja) 2011-11-09 2013-05-23 Jx Nippon Mining & Metals Corp チタン銅及びその製造方法
JP6196435B2 (ja) * 2012-10-02 2017-09-13 Jx金属株式会社 チタン銅及びその製造方法
JP6368518B2 (ja) 2014-03-28 2018-08-01 Dowaメタルテック株式会社 Cu−Ti系銅合金板材およびその製造方法並びに通電部品

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU454751A3 (ru) * 1969-05-05 1974-12-25 Феб Мансфельд Комбинат "Вильгельм Пик" Вальверк Хетштедт (Инопредприятие) Меднохромотитанова лигатура
RU2104139C1 (ru) * 1996-09-20 1998-02-10 Товарищество с ограниченной ответственностью Научно-техническая фирма "Техма" Дисперсно-упрочненный материал для электродов контактной сварки
US8097102B2 (en) * 2008-12-08 2012-01-17 Dowa Metaltech Co., Ltd. Cu-Ti-based copper alloy sheet material and method of manufacturing same
EP2610358A1 (fr) * 2010-08-27 2013-07-03 Furukawa Electric Co., Ltd. Feuille d'alliage de cuivre et procédé de fabrication de celle-ci
EP2784167B1 (fr) * 2013-03-25 2017-07-26 Dowa Metaltech Co., Ltd. Feuille d'alliage de cuivre à base de cu-ti, son procédé de fabrication et composant portant de courant électrique
EP3088541A1 (fr) * 2013-12-27 2016-11-02 JX Nippon Mining & Metals Corporation Alliage de cuivre-titane pour composant électronique

Also Published As

Publication number Publication date
JP6310130B1 (ja) 2018-04-11
EP3460081A2 (fr) 2019-03-27
JP2019056166A (ja) 2019-04-11
EP3460081B1 (fr) 2020-05-13
EP3460081A3 (fr) 2019-05-15

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