RU2017109679A - Имидазольное соединение, жидкость для обработки металлической поверхности, способ отбработки металлической поверхности и способ изготовления ламината - Google Patents

Имидазольное соединение, жидкость для обработки металлической поверхности, способ отбработки металлической поверхности и способ изготовления ламината Download PDF

Info

Publication number
RU2017109679A
RU2017109679A RU2017109679A RU2017109679A RU2017109679A RU 2017109679 A RU2017109679 A RU 2017109679A RU 2017109679 A RU2017109679 A RU 2017109679A RU 2017109679 A RU2017109679 A RU 2017109679A RU 2017109679 A RU2017109679 A RU 2017109679A
Authority
RU
Russia
Prior art keywords
group
imidazole compound
hydrogen atom
surface treatment
metal surface
Prior art date
Application number
RU2017109679A
Other languages
English (en)
Other versions
RU2692774C2 (ru
RU2017109679A3 (ru
Inventor
Тацуро ИСИКАВА
Кунихиро НОДА
Ясухиде ОХУТИ
Хироки ТИСАКА
Дай СИОТА
Юкицугу МАЕДА
Такафуми Имото
Коухей ФУДЗИТА
Ясуюки АКАИ
Original Assignee
Токио Ока Когио Ко., Лтд.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Токио Ока Когио Ко., Лтд. filed Critical Токио Ока Когио Ко., Лтд.
Publication of RU2017109679A3 publication Critical patent/RU2017109679A3/ru
Publication of RU2017109679A publication Critical patent/RU2017109679A/ru
Application granted granted Critical
Publication of RU2692774C2 publication Critical patent/RU2692774C2/ru

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D233/00—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings
    • C07D233/54—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having two double bonds between ring members or between ring members and non-ring members
    • C07D233/56—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having two double bonds between ring members or between ring members and non-ring members with only hydrogen atoms or radicals containing only hydrogen and carbon atoms, attached to ring carbon atoms
    • C07D233/60—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having two double bonds between ring members or between ring members and non-ring members with only hydrogen atoms or radicals containing only hydrogen and carbon atoms, attached to ring carbon atoms with hydrocarbon radicals, substituted by oxygen or sulfur atoms, attached to ring nitrogen atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3442—Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
    • C08K5/3445—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/02—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using non-aqueous solutions
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
    • C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
    • C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
    • C23F11/14—Nitrogen-containing compounds
    • C23F11/149—Heterocyclic compounds containing nitrogen as hetero atom
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/32—Liquid compositions therefor, e.g. developers
    • G03F7/322—Aqueous alkaline compositions
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials

Claims (12)

1. Имидазольное соединение, представленное следующей формулой (1a):
Figure 00000001
где каждый R, независимо представляют собой атом водорода или одновалентную органическую группу; R2 представляет собой необязательно замещенную ароматическую группу; каждый R4, независимо представляют собой атом галогена, гидрокси группу, меркапто группу, сульфидную группу, силильную группу, силанольную группу, нитро группу, нитрозо группу, сульфонато группу, фосфино группу, фосфинильную группу, фосфонато группу, или органическую группу; и n представляет собой целое число от 0 до 3; и
указанный R может связываться с другим R или с R2 с образованием циклической структуры.
2. Имидазольное соединение по п.1, причем это имидазольное соединение представляет собой соединение, представленное следующей формулой (1-1a)
Figure 00000002
где R, R4 и n являются такими же, как группы, определенные в формуле (1a); и R5, R6, R7, R8, и R9, каждый, независимо представляют собой атом водорода, атом галогена, гидрокси группу, меркапто группу, сульфидную группу, силильную группу, силанольную группу, нитро группу, нитрозо группу, сульфино группу, сульфо группу, сульфонато группу, фосфино группу, фосфинильную группу, фосфоно группу, фосфонато группу, амино группу, аммонио группу или органическую группу, при условии, что, по меньшей мере, один из R5, R6, R7, R8 и R9 представляет собой группу иную, чем атом водорода; по меньшей мере, две группы из R5, R6, R7, R8 и R9 могут связываться с образованием циклической структуры; и R может связываться с R7 с образованием циклической структуры.
3. Имидазольное соединение по п.2, причем это имидазольное соединение представляет собой соединение, представленное следующей далее формулой (1-1)
Figure 00000003
где R4 и n являются такими же, как группы, определенные в формуле (1а); R5, R6, R7, R8 и R9 являются такими же, как группы, определенные в формуле (1-1а); R1 представляет собой атом водорода или алкильную группу; R3 представляет собой необязательно замещенную алкиленовую группу; и R3 может связываться с R7 с образованием циклической структуры.
4. Имидазольное соединение по п.2 или 3, причем R9 представляет собой -О-R10; R10 представляет собой атом водорода или органическую группу, и R5, R6, R7, R8 и R9 представляют собой соответственно атом водорода.
5. Имидазольное соединение по п.4, причем R10 представляет собой метильную группу.
RU2017109679A 2014-08-29 2015-08-27 Имидазольное соединение, жидкость для обработки металлической поверхности, способ обработки металлической поверхности и способ изготовления ламината RU2692774C2 (ru)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2014176645 2014-08-29
JP2014-176645 2014-08-29
JP2015-029325 2015-02-18
JP2015029325 2015-02-18
PCT/JP2015/074280 WO2016031928A1 (ja) 2014-08-29 2015-08-27 イミダゾール化合物、金属表面処理液、金属の表面処理方法、及び積層体の製造方法

Publications (3)

Publication Number Publication Date
RU2017109679A3 RU2017109679A3 (ru) 2018-10-01
RU2017109679A true RU2017109679A (ru) 2018-10-01
RU2692774C2 RU2692774C2 (ru) 2019-06-27

Family

ID=55399812

Family Applications (1)

Application Number Title Priority Date Filing Date
RU2017109679A RU2692774C2 (ru) 2014-08-29 2015-08-27 Имидазольное соединение, жидкость для обработки металлической поверхности, способ обработки металлической поверхности и способ изготовления ламината

Country Status (8)

Country Link
US (1) US10336708B2 (ru)
EP (2) EP3184511B1 (ru)
JP (2) JP6625541B2 (ru)
KR (2) KR102157361B1 (ru)
CN (2) CN107540617B (ru)
RU (1) RU2692774C2 (ru)
TW (2) TWI682925B (ru)
WO (1) WO2016031928A1 (ru)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3228641B1 (en) * 2014-12-09 2019-07-03 Tokyo Ohka Kogyo Co., Ltd. Curable composition
KR102522739B1 (ko) * 2015-03-30 2023-04-17 도오꾜오까고오교 가부시끼가이샤 감광성 수지 조성물, 패턴 형성 방법, 경화막, 절연막, 컬러 필터, 및 표시 장치
JP6415374B2 (ja) * 2015-03-31 2018-10-31 東京応化工業株式会社 フォトリソグラフィ用現像液及びレジストパターン形成方法
JP6935287B2 (ja) * 2016-09-29 2021-09-15 東京応化工業株式会社 水素バリア剤、水素バリア膜形成用組成物、水素バリア膜、水素バリア膜の製造方法、及び電子素子
US10023540B2 (en) 2016-09-29 2018-07-17 Tokyo Ohka Kogyo Co., Ltd. Hydrogen barrier agent, hydrogen barrier film forming composition, hydrogen barrier film, method for producing hydrogen barrier film, and electronic element
JP6567198B2 (ja) * 2016-09-29 2019-08-28 富士フイルム株式会社 タッチパネルの製造方法
CN111108099B (zh) 2017-09-29 2023-09-29 东京应化工业株式会社 化合物、环氧固化催化剂、以及化合物的制造方法
JP6999469B2 (ja) * 2018-03-28 2022-01-18 東京応化工業株式会社 水素バリア剤、水素バリア膜形成用組成物、水素バリア膜、水素バリア膜の製造方法、及び電子素子
KR20210036350A (ko) * 2018-07-31 2021-04-02 제이에스알 가부시끼가이샤 도금 조형물의 제조 방법, 회로 기판, 및 표면 처리제, 그리고 표면 처리제 키트
KR20210080428A (ko) * 2018-10-18 2021-06-30 스미또모 베이크라이트 가부시키가이샤 감광성 수지 조성물, 경화막, 및 경화막을 구비하는 전자 장치 및 그 제조 방법
JP7269721B2 (ja) * 2018-12-12 2023-05-09 東京応化工業株式会社 感エネルギー性樹脂組成物、硬化物及び硬化物の製造方法
CN109735838B (zh) * 2019-03-14 2021-06-29 广东省石油与精细化工研究院 一种铜面选择性有机可焊保护剂
JP6861313B2 (ja) * 2020-06-24 2021-04-21 東京応化工業株式会社 微粒子含有組成物

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4659730A (en) 1984-06-18 1987-04-21 Eli Lilly And Company Aromatase inhibiting imidazole derivatives
ZA987385B (en) * 1997-08-19 2000-04-18 Lilly Co Eli Growth hormone secretagogues.
SI1037880T1 (en) * 1997-12-11 2004-10-31 Janssen Pharmaceutica N.V. Retinoic acid mimetic anilides
US6639076B1 (en) 1998-08-18 2003-10-28 Eli Lilly And Company Growth hormone secretagogues
JP2000219876A (ja) * 1999-01-29 2000-08-08 Nippon Chem Kogyo Kk 不凍液組成物
FR2837201A1 (fr) * 2002-03-18 2003-09-19 Servier Lab Nouveaux composes derives de la quinazoline, leur procede de preparation et les compositions pharmaceutiques qui les contiennent
US8911831B2 (en) * 2002-07-19 2014-12-16 Northwestern University Surface independent, surface-modifying, multifunctional coatings and applications thereof
JP4183999B2 (ja) 2002-07-29 2008-11-19 日鉱金属株式会社 イミダゾールアルコールを有効成分とする表面処理剤
GB0623209D0 (en) 2006-11-21 2007-01-03 F2G Ltd Antifungal agents
CN101765590B (zh) * 2007-05-24 2015-11-25 埃尔德鲁格股份有限公司 1，(3)，5-取代的咪唑、它们在治疗高血压中的用途以及它们的制备方法
GB0811091D0 (en) * 2008-06-17 2008-07-23 Cancer Rec Tech Ltd CYP26 Inhibitors
JP5489674B2 (ja) * 2008-12-01 2014-05-14 日本合成化学工業株式会社 金属表面処理剤ならびにイミダゾール系化合物
JP5610751B2 (ja) * 2008-12-02 2014-10-22 日本合成化学工業株式会社 金属表面処理剤ならびにイミダゾール系化合物
US8685966B2 (en) 2011-04-08 2014-04-01 University Of Kansas GRP94 inhibitors
JP5667927B2 (ja) * 2011-05-20 2015-02-12 富士フイルム株式会社 マイグレーション抑制層形成用処理液、および、マイグレーション抑制層を有する積層体の製造方法
JP5985368B2 (ja) * 2012-11-20 2016-09-06 四国化成工業株式会社 銅または銅合金の表面処理液及びその利用
JP6484056B2 (ja) * 2014-03-25 2019-03-13 東京応化工業株式会社 パターン形成方法
EP3228641B1 (en) * 2014-12-09 2019-07-03 Tokyo Ohka Kogyo Co., Ltd. Curable composition

Also Published As

Publication number Publication date
JPWO2016031928A1 (ja) 2017-06-22
KR102179510B1 (ko) 2020-11-16
KR20170048428A (ko) 2017-05-08
RU2692774C2 (ru) 2019-06-27
RU2017109679A3 (ru) 2018-10-01
US10336708B2 (en) 2019-07-02
US20170247334A1 (en) 2017-08-31
CN106687447A (zh) 2017-05-17
CN107540617B (zh) 2020-12-18
TW201808913A (zh) 2018-03-16
EP3514145A1 (en) 2019-07-24
CN106687447B (zh) 2020-06-02
JP6625541B2 (ja) 2019-12-25
EP3184511A4 (en) 2017-07-26
TWI669293B (zh) 2019-08-21
KR20170042795A (ko) 2017-04-19
TWI682925B (zh) 2020-01-21
TW201623248A (zh) 2016-07-01
EP3184511A1 (en) 2017-06-28
CN107540617A (zh) 2018-01-05
EP3184511B1 (en) 2019-03-20
JP6626072B2 (ja) 2019-12-25
JP2018039837A (ja) 2018-03-15
WO2016031928A1 (ja) 2016-03-03
KR102157361B1 (ko) 2020-09-18

Similar Documents

Publication Publication Date Title
RU2017109679A (ru) Имидазольное соединение, жидкость для обработки металлической поверхности, способ отбработки металлической поверхности и способ изготовления ламината
JP2014158032A5 (ru)
RU2020113165A (ru) Циклические пуриновые динуклеотиды в качестве модуляторов sting
JP2017536332A5 (ru)
UA113643C2 (xx) N-цикліламіди як нематоциди
EA201590619A1 (ru) Гербицидно и фунгицидно действующие 5-оксизамещенные 3-фенилизоксазолин-5-карбоксамиды и 5-оксизамещенные 3-фенилизоксазолин-5-тиоамиды
JP2014208621A5 (ja) 発光素子、ディスプレイモジュール、照明モジュール、発光装置、表示装置、照明装置、及び電子機器
EA201591497A1 (ru) Новые производные октагидропирроло[3,4-c]пиррола и их аналоги в качестве ингибиторов аутотаксина
RU2015148258A (ru) Силоксановое соединение и способ его получения
JP2015522045A5 (ru)
RU2018111201A (ru) Фунгицидная композиция для применения в сельском хозяйстве и садоводстве
EA201492223A1 (ru) Новые диазаспироциклоалканы и азаспироциклоалканы
EA201600091A1 (ru) 4-членные кольцевые карбоксамиды, применяемые в качестве нематоцидов
AU2012223584A8 (en) Dimensionally stable silicone hydrogel contact lenses
JP2013506009A5 (ru)
RU2015148257A (ru) Силоксановое соединение и способ его получения
EA201591451A1 (ru) Модуляторы flap
MX2016005383A (es) Composiciones para tratar formaciones subterraneas.
EA201400058A1 (ru) Соединения и композиции на основе амидопиридиловых эфиров и их применение против паразитов
EA201891808A1 (ru) Трис-амидные соединения и композиции, содержащие их
RU2016124167A (ru) Содержащий концевые эпоксигруппы сложный полиэфир
RU2016124166A (ru) Содержащий концевые эпоксигруппы сложный полиэфир
EA201401203A1 (ru) 6-пиридон-2-карбамоилазолы и их применение в качестве гербицидов
AR088909A1 (es) Compuestos de hidrocarburos aromaticos policiclicos que contienen un atomo de s o un grupo s(=o)₂ en su estructura basica
EA201892449A1 (ru) Конденсированные гетероциклические соединения