RU2016115865A - Электронное устройство, содержащее органические материалы - Google Patents
Электронное устройство, содержащее органические материалы Download PDFInfo
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- RU2016115865A RU2016115865A RU2016115865A RU2016115865A RU2016115865A RU 2016115865 A RU2016115865 A RU 2016115865A RU 2016115865 A RU2016115865 A RU 2016115865A RU 2016115865 A RU2016115865 A RU 2016115865A RU 2016115865 A RU2016115865 A RU 2016115865A
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- 239000011368 organic material Substances 0.000 title claims 9
- 239000010410 layer Substances 0.000 claims 31
- 239000004020 conductor Substances 0.000 claims 9
- 238000000034 method Methods 0.000 claims 9
- 230000002093 peripheral effect Effects 0.000 claims 5
- 239000004065 semiconductor Substances 0.000 claims 2
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 239000011229 interlayer Substances 0.000 claims 1
- 238000002955 isolation Methods 0.000 claims 1
- 230000004807 localization Effects 0.000 claims 1
- 238000000926 separation method Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
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- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
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- H01L21/8232—Field-effect technology
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- H01L21/8232—Field-effect technology
- H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
- H01L21/823481—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type isolation region manufacturing related aspects, e.g. to avoid interaction of isolation region with adjacent structure
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- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
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- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
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- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
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Claims (9)
1. Способ, включающий формирование на общей подложке одной или более серий многослойных электронных устройств с последующим разделением указанных устройств; каждое из которых содержит один или более слоев органического материала, при этом способ включает нанесение единственного или каждого из указанных слоев в виде слоя, имеющего протяженность по меньшей мере от одного конца одной или более серий устройств до противоположного конца одной или более серий устройств.
2. Способ по п. 1, в котором каждое электронное устройство содержит массив транзисторов, при этом один или более слоев органического материала, наносимых в виде одного или более непрерывных слоев, содержит один или более из следующих слоев: полупроводниковый слой, задающий полупроводниковые каналы транзисторов; диэлектрический слой, образующий диэлектрик затворов транзисторов, и один или более изоляторных слоев, нанесенных между проводящими слоями.
3. Способ по п. 1, в котором электронные устройства содержат по меньшей мере один проводящий слой, задающий массив проводников, активируемых через соответствующие выходные терминалы одного или более чипов драйвера, а способ включает формирование контактов для указанных одного или более чипов драйвера с локализацией указанных контактов поверх одного или более слоев органического материала, наносимых в виде непрерывных слоев, при этом указанные контакты связаны с соответствующими проводниками указанного массива через указанные один или более слоев органического материала.
4. Способ по п. 1, в котором устройства содержат по меньшей мере три проводящих слоя, расположенные на соответствующих уровнях, при этом способ дополнительно включает осуществление сжатия периферийной области указанных одного или более слоев органического материала, нанесенных в виде непрерывных слоев, и создание одного или более проводящих перемычек между одним или более частями верхнего проводящего слоя в указанной периферийной области и одной или более частями промежуточного проводящего слоя, смещенными внутрь относительно указанной периферийной области, через одну или более частей нижнего проводящего слоя, расположенных между указанной периферийной областью и областью, смещенной внутрь относительно периферийной области.
5. Способ по п. 4, в котором верхний проводящий слой задает контакты затвора и истока для массива транзисторов, а одна или более частей указанного промежуточного проводящего слоя содержат один или более проводников затвора, образующих электроды затвора для указанного массива транзисторов, и/или один или более проводников истока, образующих электроды истока для массива транзисторов.
6. Способ по любому из предыдущих пунктов, дополнительно включающий:
формирование по меньшей мере одного закорачивающего проводника, связывающего группу проводников, расположенных в проводящем слое под указанными одним или более слоями органического материала, нанесенными в виде непрерывных слоев;
формирование по меньшей мере одной межслоевой проводящей перемычки между указанным закорачивающим проводником и контактом, сформированным поверх указанных одного или более слоев органического материала, через указанные один или более слоев, нанесенных в виде непрерывных слоев, и
осуществление электрического тестирования через указанный контакт с последующим изолированием закорачивающего проводника от указанной группы проводников путем удаления одной или более частей указанного проводящего слоя и одной или более частей одного или более слоев органического материала, расположенных поверх указанных одной или более частей проводящего слоя.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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GB1317760.5A GB2519081B (en) | 2013-10-08 | 2013-10-08 | Electronic devices including organic materials |
GB1317760.5 | 2013-10-08 | ||
PCT/EP2014/071467 WO2015052200A1 (en) | 2013-10-08 | 2014-10-07 | Electronic devices including organic materials |
Publications (3)
Publication Number | Publication Date |
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RU2016115865A true RU2016115865A (ru) | 2017-11-15 |
RU2016115865A3 RU2016115865A3 (ru) | 2018-05-24 |
RU2672778C2 RU2672778C2 (ru) | 2018-11-19 |
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RU2016115865A RU2672778C2 (ru) | 2013-10-08 | 2014-10-07 | Электронное устройство, содержащее органические материалы |
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DE (1) | DE112014004633T5 (ru) |
GB (1) | GB2519081B (ru) |
RU (1) | RU2672778C2 (ru) |
TW (1) | TWI651876B (ru) |
WO (1) | WO2015052200A1 (ru) |
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GB2556313B (en) * | 2016-02-10 | 2020-12-23 | Flexenable Ltd | Semiconductor patterning |
GB2563191A (en) * | 2017-03-15 | 2018-12-12 | Flexenable Ltd | Cross-linked polymers |
GB2567871B (en) * | 2017-10-27 | 2022-02-02 | Flexenable Ltd | Electronic device for pressure sensors |
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JP2002215065A (ja) * | 2000-11-02 | 2002-07-31 | Seiko Epson Corp | 有機エレクトロルミネッセンス装置及びその製造方法、並びに電子機器 |
JP4115158B2 (ja) * | 2002-04-24 | 2008-07-09 | シャープ株式会社 | 半導体装置およびその製造方法 |
JP4325479B2 (ja) * | 2003-07-17 | 2009-09-02 | セイコーエプソン株式会社 | 有機トランジスタの製造方法、アクティブマトリクス装置の製造方法、表示装置の製造方法および電子機器の製造方法 |
JP3909601B2 (ja) * | 2004-07-29 | 2007-04-25 | セイコーエプソン株式会社 | フレキシブルプリント基板の実装方法及び、電気光学装置の製造方法 |
WO2006054709A1 (ja) * | 2004-11-19 | 2006-05-26 | Matsushita Electric Industrial Co., Ltd. | 電界効果トランジスタおよびその製造方法、ならびにそれを用いた電子機器 |
KR101219035B1 (ko) * | 2005-05-03 | 2013-01-07 | 삼성디스플레이 주식회사 | 유기 박막 트랜지스터 표시판 및 그 제조 방법 |
KR100647695B1 (ko) * | 2005-05-27 | 2006-11-23 | 삼성에스디아이 주식회사 | 유기 박막 트랜지스터 및 그의 제조방법과 이를 구비한평판표시장치 |
JP2007041386A (ja) * | 2005-08-04 | 2007-02-15 | Seiko Epson Corp | 電気泳動表示モジュール、電子機器及び電気泳動表示モジュールの製造方法。 |
JP5107596B2 (ja) * | 2007-03-13 | 2012-12-26 | 三菱電機株式会社 | 液晶表示装置、及びその製造方法 |
JP5167685B2 (ja) * | 2007-04-25 | 2013-03-21 | セイコーエプソン株式会社 | アクティブマトリクス基板の製造方法、及び電気光学装置の製造方法 |
DE102007062944B4 (de) * | 2007-12-21 | 2016-03-17 | Leonhard Kurz Stiftung & Co. Kg | Elektronische Schaltung |
JP2010186768A (ja) * | 2009-02-10 | 2010-08-26 | Brother Ind Ltd | 有機半導体素子、及びその製造方法 |
GB2480875B (en) * | 2010-06-04 | 2014-09-03 | Plastic Logic Ltd | Production of electronic switching devices |
KR101738531B1 (ko) * | 2010-10-22 | 2017-05-23 | 삼성디스플레이 주식회사 | 유기 발광 디스플레이 장치의 제조 방법 및 이에 따라 제조된 유기 발광 디스플레이 장치 |
KR20120042365A (ko) * | 2010-10-25 | 2012-05-03 | 삼성모바일디스플레이주식회사 | 유기 발광 표시 장치 및 유기 발광 표시 장치의 제조 방법 |
GB2485828B (en) * | 2010-11-26 | 2015-05-13 | Plastic Logic Ltd | Electronic devices |
KR102133433B1 (ko) * | 2013-05-24 | 2020-07-14 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치, 이를 포함하는 전자 기기, 및 유기 발광 표시 장치의 제조 방법 |
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US9704764B2 (en) | 2017-07-11 |
US20160247732A1 (en) | 2016-08-25 |
TW201526322A (zh) | 2015-07-01 |
TWI651876B (zh) | 2019-02-21 |
RU2016115865A3 (ru) | 2018-05-24 |
CN105705990A (zh) | 2016-06-22 |
GB2519081A (en) | 2015-04-15 |
GB2519081B (en) | 2019-07-03 |
DE112014004633T5 (de) | 2016-07-28 |
CN105705990B (zh) | 2020-09-29 |
RU2672778C2 (ru) | 2018-11-19 |
GB201317760D0 (en) | 2013-11-20 |
WO2015052200A1 (en) | 2015-04-16 |
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