RU2015140801A3 - - Google Patents
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- RU2015140801A3 RU2015140801A3 RU2015140801A RU2015140801A RU2015140801A3 RU 2015140801 A3 RU2015140801 A3 RU 2015140801A3 RU 2015140801 A RU2015140801 A RU 2015140801A RU 2015140801 A RU2015140801 A RU 2015140801A RU 2015140801 A3 RU2015140801 A3 RU 2015140801A3
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- RU
- Russia
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Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361770413P | 2013-02-28 | 2013-02-28 | |
| US61/770,413 | 2013-02-28 | ||
| PCT/IB2014/058986 WO2014132164A2 (en) | 2013-02-28 | 2014-02-14 | Simple led package suitable for capacitive driving |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| RU2015140801A RU2015140801A (ru) | 2017-03-31 |
| RU2015140801A3 true RU2015140801A3 (enExample) | 2018-01-22 |
| RU2663814C2 RU2663814C2 (ru) | 2018-08-10 |
Family
ID=50193558
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| RU2015140801A RU2663814C2 (ru) | 2013-02-28 | 2014-02-14 | Простой светодиодный модуль, пригодный для емкостного возбуждения |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US9281299B2 (enExample) |
| EP (1) | EP2962531B1 (enExample) |
| JP (1) | JP6419089B2 (enExample) |
| CN (1) | CN105027674B (enExample) |
| RU (1) | RU2663814C2 (enExample) |
| WO (1) | WO2014132164A2 (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102015114010A1 (de) * | 2015-08-24 | 2017-03-02 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement, Verfahren zur Herstellung eines optoelektronischen Bauelements und Verfahren zum Betrieb eines optoelektronischen Bauelements |
| JP6914938B2 (ja) | 2015-12-23 | 2021-08-04 | コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． | 海洋構造物 |
| CN108476568B (zh) | 2015-12-23 | 2020-08-04 | 皇家飞利浦有限公司 | 负载布置和为负载供电的电力布置 |
| EP3395126B1 (en) | 2015-12-23 | 2019-05-15 | Koninklijke Philips N.V. | Load arrangement and electrical power arrangement for powering a load |
| CA3032714A1 (en) * | 2016-10-07 | 2018-04-12 | Grote Industries, Llc | Thin film sheet including power lines, lights, and sensors |
| CN110690328B (zh) * | 2019-10-16 | 2021-05-18 | 福州大学 | 一种基于波长下转换的无电学接触μLED发光器件 |
| CN110690329B (zh) * | 2019-10-16 | 2021-06-29 | 福州大学 | 一种单端电学接触、单端载流子注入的μLED发光与显示器件及其制备方法 |
| KR20240007822A (ko) * | 2022-07-07 | 2024-01-17 | 삼성디스플레이 주식회사 | 발광 소자, 이를 포함하는 화소, 및 발광 소자의 제조 방법 |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3249582B2 (ja) | 1992-07-24 | 2002-01-21 | シャープ株式会社 | 発光装置 |
| US6630689B2 (en) | 2001-05-09 | 2003-10-07 | Lumileds Lighting, U.S. Llc | Semiconductor LED flip-chip with high reflectivity dielectric coating on the mesa |
| CN100440528C (zh) * | 2003-08-12 | 2008-12-03 | 皇家飞利浦电子股份有限公司 | 用于交流驱动有机二极管的电路装置及其制造方法 |
| TWI223460B (en) | 2003-09-23 | 2004-11-01 | United Epitaxy Co Ltd | Light emitting diodes in series connection and method of making the same |
| EP1731003B1 (en) * | 2004-02-25 | 2011-03-30 | Michael Miskin | Ac light emitting diode and ac led drive methods and apparatus |
| US7294961B2 (en) | 2004-03-29 | 2007-11-13 | Articulated Technologies, Llc | Photo-radiation source provided with emissive particles dispersed in a charge-transport matrix |
| US8188503B2 (en) * | 2004-05-10 | 2012-05-29 | Permlight Products, Inc. | Cuttable illuminated panel |
| TW200702824A (en) * | 2005-06-02 | 2007-01-16 | Koninkl Philips Electronics Nv | LED assembly and module |
| US7498252B2 (en) | 2006-09-29 | 2009-03-03 | Intel Corporation | Dual layer dielectric stack for microelectronics having thick metal lines |
| US20090140279A1 (en) | 2007-12-03 | 2009-06-04 | Goldeneye, Inc. | Substrate-free light emitting diode chip |
| US8530906B2 (en) * | 2008-06-17 | 2013-09-10 | Koninklijke Philips N.V. | Light emitting device adapted for AC drive |
| US8269408B2 (en) | 2008-08-12 | 2012-09-18 | Helio Optoelectronics Corporation | LED base structure with embedded capacitor |
| EP2373921A1 (en) * | 2008-12-05 | 2011-10-12 | Lynk Labs, Inc. | Ac led lighting element and ac led lighting system methods and apparatus |
| CN101894901B (zh) | 2009-04-08 | 2013-11-20 | 硅谷光擎 | 用于多个发光二极管的封装 |
| CN102044600A (zh) | 2009-10-15 | 2011-05-04 | 展晶科技(深圳)有限公司 | 发光二极管封装结构及其制备方法 |
| JP5375544B2 (ja) * | 2009-11-19 | 2013-12-25 | 日亜化学工業株式会社 | 半導体発光装置及びその製造方法 |
| TWM401207U (en) | 2010-11-03 | 2011-04-01 | Harvatek Corp | Light-emitting diode packaging structure |
| JP2012142410A (ja) * | 2010-12-28 | 2012-07-26 | Rohm Co Ltd | 発光素子ユニットおよびその製造方法、発光素子パッケージならびに照明装置 |
| US8797285B2 (en) | 2011-04-18 | 2014-08-05 | Atmel Corporation | Panel |
-
2014
- 2014-02-14 JP JP2015559577A patent/JP6419089B2/ja not_active Expired - Fee Related
- 2014-02-14 EP EP14707846.3A patent/EP2962531B1/en not_active Not-in-force
- 2014-02-14 CN CN201480011058.4A patent/CN105027674B/zh not_active Expired - Fee Related
- 2014-02-14 WO PCT/IB2014/058986 patent/WO2014132164A2/en not_active Ceased
- 2014-02-14 RU RU2015140801A patent/RU2663814C2/ru not_active IP Right Cessation
- 2014-02-14 US US14/769,832 patent/US9281299B2/en not_active Expired - Fee Related
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