RU2009124293A - Устройство и способ для гальванического покрытия - Google Patents

Устройство и способ для гальванического покрытия Download PDF

Info

Publication number
RU2009124293A
RU2009124293A RU2009124293/02A RU2009124293A RU2009124293A RU 2009124293 A RU2009124293 A RU 2009124293A RU 2009124293/02 A RU2009124293/02 A RU 2009124293/02A RU 2009124293 A RU2009124293 A RU 2009124293A RU 2009124293 A RU2009124293 A RU 2009124293A
Authority
RU
Russia
Prior art keywords
cathode
substrate
rollers
roller
contact
Prior art date
Application number
RU2009124293/02A
Other languages
English (en)
Russian (ru)
Inventor
Рене ЛОХТМАН (DE)
Рене Лохтман
Юрген КАЧУН (DE)
Юрген КАЧУН
Норберт ВАГНЕР (DE)
Норберт Вагнер
Юрген ПФИСТЕР (DE)
Юрген ПФИСТЕР
Герт ПОЛЬ (DE)
Герт ПОЛЬ
Original Assignee
Басф Се (De)
Басф Се
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Басф Се (De), Басф Се filed Critical Басф Се (De)
Publication of RU2009124293A publication Critical patent/RU2009124293A/ru

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/16—Apparatus for electrolytic coating of small objects in bulk
    • C25D17/28—Apparatus for electrolytic coating of small objects in bulk with means for moving the objects individually through the apparatus during treatment
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/241—Reinforcing of the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1509—Horizontally held PCB

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Battery Electrode And Active Subsutance (AREA)
RU2009124293/02A 2006-11-28 2007-11-26 Устройство и способ для гальванического покрытия RU2009124293A (ru)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP06124862.1 2006-11-28
EP06124862 2006-11-28

Publications (1)

Publication Number Publication Date
RU2009124293A true RU2009124293A (ru) 2011-01-10

Family

ID=39047993

Family Applications (1)

Application Number Title Priority Date Filing Date
RU2009124293/02A RU2009124293A (ru) 2006-11-28 2007-11-26 Устройство и способ для гальванического покрытия

Country Status (10)

Country Link
US (1) US20090301891A1 (https=)
EP (1) EP2099954A1 (https=)
JP (1) JP2010511103A (https=)
KR (1) KR20090083489A (https=)
CN (1) CN101542022A (https=)
BR (1) BRPI0719665A2 (https=)
IL (1) IL198594A0 (https=)
RU (1) RU2009124293A (https=)
TW (1) TW200829726A (https=)
WO (1) WO2008065069A1 (https=)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009112573A2 (de) * 2008-03-13 2009-09-17 Basf Se Verfahren und dispersion zum aufbringen einer metallschicht auf einem substrat sowie metallisierbare thermoplastische formmasse
EP2306892A1 (en) * 2008-04-15 2011-04-13 Nonin Medical, Inc Non-invasive optical sensor
CN102318044A (zh) * 2008-05-08 2012-01-11 巴斯夫欧洲公司 包含碳化硅层的层型结构、其制备方法及其用途
KR20120023832A (ko) * 2009-05-26 2012-03-13 우시 썬테크 파워 컴퍼니 리미티드 물품 이송용 이송 롤러
DE102010000211A1 (de) * 2010-01-26 2011-07-28 Atotech Deutschland GmbH, 90537 Vorrichtung zum Transport von plattenförmigen Substraten in einer Anlage zur chemischen und/oder elektrochemischen Behandlung
CN101827444B (zh) * 2010-03-31 2015-03-25 中兴通讯股份有限公司 一种测量参考信号的信令配置系统及方法
DE102010042642B4 (de) 2010-10-19 2013-12-12 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren und Vorrichtung zur galvanischen Beschichtung von Substraten und Solarzellen
US20130255858A1 (en) * 2012-04-03 2013-10-03 Jun-Chung Hsu Method of manufacturing a laminate circuit board
US9970297B2 (en) * 2014-08-29 2018-05-15 Rolls-Royce Corporation Composite fan slider with nano-coating
KR20160140241A (ko) 2015-05-29 2016-12-07 전자부품연구원 플라즈마 전해 기반의 시료 코팅 방법
KR101578640B1 (ko) * 2015-08-25 2015-12-17 선호경 부분 강화된 이송롤러를 구비한 pcb 도금장치
JP7358238B2 (ja) 2016-07-13 2023-10-10 イオントラ インコーポレイテッド 電気化学的方法、装置及び組成物
CN108430170A (zh) * 2018-01-29 2018-08-21 昆山群安电子贸易有限公司 一种电路板基板的制作方法
JP2022525563A (ja) * 2019-03-20 2022-05-17 ザ リージェンツ オブ ザ ユニバーシティ オブ コロラド，ア ボディー コーポレイト キレート化金属を含む電気化学貯蔵装置
AU2021329906A1 (en) 2020-08-18 2023-04-27 Enviro Metals, LLC Metal refinement
CN114481244B (zh) * 2022-02-24 2022-08-23 广东盈华电子科技有限公司 一种电解铜箔耐高温抗氧化的表面处理工艺
DE102022120646A1 (de) 2022-08-16 2024-02-22 Audi Aktiengesellschaft Verfahren zur Herstellung einer flexiblen gedruckten Schaltung (FPC) mittels Auftragen von Metallleiterbahnen, gedruckte Schaltung und Batteriesystem mit gedruckter Schaltung

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4019877A (en) * 1975-10-21 1977-04-26 Westinghouse Electric Corporation Method for coating of polyimide by electrodeposition
DE59004422D1 (de) * 1989-12-23 1994-03-10 Heraeus Elektrochemie Verfahren und Vorrichtung zur kontinuierlichen elektrolytischen Ausbringung von Metall in Form eines Bandes aus einer Lösung sowie Verwendung der Vorrichtung.
DE59202882D1 (de) * 1991-04-12 1995-08-17 Siemens Ag Galvanisiereinrichtung für plattenförmige werkstücke, insbesondere leiterplatten.
US5705219A (en) * 1991-04-22 1998-01-06 Atotech Deutschland Gmbh Method for coating surfaces with finely particulate materials
DE4212567A1 (de) * 1992-03-14 1993-09-16 Schmid Gmbh & Co Geb Einrichtung zur behandlung von gegenstaenden, insbesondere galvanisiereinrichtungen fuer leiterplatten
US6599412B1 (en) * 1997-09-30 2003-07-29 Semitool, Inc. In-situ cleaning processes for semiconductor electroplating electrodes
DE19633796B4 (de) * 1996-08-22 2012-02-02 Hans Höllmüller Maschinenbau GmbH Vorrichtung zum Galvanisieren von elektronischen Leiterplatten
EP1541719A3 (en) * 1998-05-20 2006-05-31 Process Automation International Limited An electroplating machine
US6153064A (en) * 1998-11-25 2000-11-28 Oliver Sales Company Apparatus for in line plating
DE10043817C2 (de) * 2000-09-06 2002-07-18 Egon Huebel Anordnung und Verfahren für elektrochemisch zu behandelndes Gut
DE10248965A1 (de) * 2002-10-15 2004-04-29 Simmerlein, Ewald Wilhelm Galvanisierungseinrichtung zum freien Beschichten von leitfähigen Strukturen und Flächen, mit und ohne Versorgungsbahnen
DE10342512B3 (de) * 2003-09-12 2004-10-28 Atotech Deutschland Gmbh Vorrichtung und Verfahren zum elektrolytischen Behandeln von elektrisch gegeneinander isolierten, elektrisch leitfähigen Strukturen auf Oberflächen von bandförmigem Behandlungsgut
NL1025446C2 (nl) * 2004-02-09 2005-08-10 Besi Plating B V Werkwijze en inrichting voor het elektrolytisch doen toenemen van de dikte van een elektrisch geleidend patroon op een dielektrische drager alsmede dielektrische drager.
DE102005033784A1 (de) * 2005-07-20 2007-01-25 Viktoria Händlmeier System zur galvanischen Abscheidung einer leitfähigen Schicht auf einem nichtleitfähigen Trägermaterial
DE102005038450A1 (de) * 2005-08-03 2007-02-08 Gebr. Schmid Gmbh & Co. Einrichtung zur Behandlung von Substraten, insbesondere zur Galvanisierung von Substraten
DE102005038449B4 (de) * 2005-08-03 2010-03-25 Gebr. Schmid Gmbh & Co. Einrichtung zur Behandlung von Substraten, insbesondere zur Galvanisierung von Leiterplatten, und Verfahren
EP2010700B1 (de) * 2006-04-18 2010-01-20 Basf Se Vorrichtung und verfahren zur galvanischen beschichtung
US20090101511A1 (en) * 2006-04-18 2009-04-23 Rene Lochtman Electroplating device and method

Also Published As

Publication number Publication date
TW200829726A (en) 2008-07-16
WO2008065069A1 (de) 2008-06-05
KR20090083489A (ko) 2009-08-03
CN101542022A (zh) 2009-09-23
EP2099954A1 (de) 2009-09-16
JP2010511103A (ja) 2010-04-08
US20090301891A1 (en) 2009-12-10
IL198594A0 (en) 2010-02-17
BRPI0719665A2 (pt) 2013-12-17

Similar Documents

Publication Publication Date Title
RU2009124293A (ru) Устройство и способ для гальванического покрытия
JP2010511103A5 (https=)
RU2008145108A (ru) Устройство и способ для гальванического покрытия
RU2008145105A (ru) Способ и устройство для гальванического покрытия
JP2009534527A5 (https=)
US7578048B2 (en) Patterns of conductive objects on a substrate coated with inorganic compounds and method of producing thereof
KR101076947B1 (ko) 전기 절연 구조체를 전해 처리하는 장치 및 방법
EP0136034A2 (en) Method of forming an electrically conductive member
RU2009129827A (ru) Способ изготовления электропроводящих поверхностей
JP6123025B2 (ja) 内蔵型アンテナの製造方法
RU2440444C2 (ru) Устройство и способ для электрического контактирования плоского изделия в установках непрерывного действия
CA2191339C (en) Method and device for continuous uniform electrolytic metallising or etching
US20110308955A1 (en) Integrated shielding for wafer plating
JP2009534525A5 (https=)
JP6431980B2 (ja) 金属の水平電気化学堆積法
KR101326266B1 (ko) 도전성 부직포의 제조방법 및 도전성 부직포를 이용한 멀티 기능 ｅｍｉ 차폐용 테이프의 제조방법
JP3154267U (ja) めっき処理物保持具
CN1969065B (zh) 电解处理平坦工件的装置及方法
KR20110097225A (ko) 기판 도금 장치
JP2017222907A (ja) めっき装置
CN216074077U (zh) 扇出型面板级封装电镀的电极挂具构造
EP2625318B1 (en) Device for single-sided electrolytic treatment of a flat substrate
CN206783799U (zh) 一种泡沫金属挂镀加工挂具
CN106242314A (zh) 一种玻璃镀铜工艺
KR20140055747A (ko) 기판 도금용 지그

Legal Events

Date Code Title Description
FA92 Acknowledgement of application withdrawn (lack of supplementary materials submitted)

Effective date: 20120317