PT1363811E - Processo de fabrico de um componente moldado para automovel, com uma pista condutora integrada e componente moldado de um automovel - Google Patents
Processo de fabrico de um componente moldado para automovel, com uma pista condutora integrada e componente moldado de um automovelInfo
- Publication number
- PT1363811E PT1363811E PT02732446T PT02732446T PT1363811E PT 1363811 E PT1363811 E PT 1363811E PT 02732446 T PT02732446 T PT 02732446T PT 02732446 T PT02732446 T PT 02732446T PT 1363811 E PT1363811 E PT 1363811E
- Authority
- PT
- Portugal
- Prior art keywords
- component
- automobile
- molded
- conductor track
- manufacturing
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
- B60R16/00—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
- B60R16/02—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1266—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by electrographic or magnetographic printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
- B60R16/00—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
- B60R16/02—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements
- B60R16/0207—Wire harnesses
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/102—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09109—Locally detached layers, e.g. in multilayer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0517—Electrographic patterning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1333—Deposition techniques, e.g. coating
- H05K2203/1344—Spraying small metal particles or droplets of molten metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/467—Adding a circuit layer by thin film methods
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49158—Manufacturing circuit on or in base with molding of insulated base
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Laminated Bodies (AREA)
- Thermistors And Varistors (AREA)
- Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)
- Electrostatic Charge, Transfer And Separation In Electrography (AREA)
- Vehicle Interior And Exterior Ornaments, Soundproofing, And Insulation (AREA)
- Non-Insulated Conductors (AREA)
- Linear Motors (AREA)
- Automobile Manufacture Line, Endless Track Vehicle, Trailer (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10109087A DE10109087A1 (de) | 2001-02-24 | 2001-02-24 | Verfahren zum Herstellen eines Formbauteils mit einer integrierten Leiterbahn |
Publications (1)
Publication Number | Publication Date |
---|---|
PT1363811E true PT1363811E (pt) | 2005-04-29 |
Family
ID=7675450
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PT02732446T PT1363811E (pt) | 2001-02-24 | 2002-02-22 | Processo de fabrico de um componente moldado para automovel, com uma pista condutora integrada e componente moldado de um automovel |
Country Status (10)
Country | Link |
---|---|
US (1) | US20040055153A1 (pt) |
EP (2) | EP1517597B1 (pt) |
JP (1) | JP4133335B2 (pt) |
KR (1) | KR20030090647A (pt) |
AT (2) | ATE285346T1 (pt) |
AU (1) | AU2002304822A1 (pt) |
DE (2) | DE10109087A1 (pt) |
ES (1) | ES2233821T3 (pt) |
PT (1) | PT1363811E (pt) |
WO (1) | WO2002068245A1 (pt) |
Families Citing this family (40)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10048680C1 (de) * | 2000-09-30 | 2002-04-25 | Oechsler Ag | Elektrische Stromschiene,deren Verwendung und Verfahren zu ihrer Herstellung |
DE10153482A1 (de) * | 2001-10-30 | 2003-05-22 | Leoni Ag | Verfahren zum Behandeln eines elektrischen Leiters |
DE10205615A1 (de) | 2002-02-11 | 2003-08-28 | Leoni Ag | Vorrichtung mit einer einen elektrischen Anschluss aufweisenden Einheit |
DE10207589A1 (de) * | 2002-02-22 | 2003-10-16 | Leoni Ag | Verfahren zum Erzeugen einer Leiterbahn auf einem Trägerbauteil sowie Trägerbauteil |
DE10211445A1 (de) | 2002-03-15 | 2003-10-02 | Basf Ag | Katalysator-Precursor für die Herstellung von Maleinsäureanhydrid und Verfahren zu dessen Herstellung |
DE10222301B4 (de) * | 2002-05-18 | 2006-08-10 | Leoni Ag | Verfahren zur Herstellung eines elektrischen Streckelements |
CN1659307A (zh) * | 2002-06-05 | 2005-08-24 | 三菱商事塑料株式会社 | 用于清洁cvd装置所用原料气导入管的方法和装置 |
DE10242526B4 (de) * | 2002-09-12 | 2004-12-09 | Daimlerchrysler Ag | Fahrzeugteile aus Kunststoff mit integrierten Antennenelementen sowie Verfahren zu deren Herstellung und Verwendung der Fahrzeugteile |
DE10308060B3 (de) * | 2003-02-26 | 2004-05-19 | Daimlerchrysler Ag | Verfahren zur Herstellung von elektrischen Stromführungen bei Kraftfahrzeugen |
EP1473194A1 (de) * | 2003-04-30 | 2004-11-03 | Hirschmann Electronics GmbH & Co. KG | Integration einer elektronischen Schaltung in einem Fahrzeug |
FR2878069B1 (fr) * | 2004-11-15 | 2007-05-25 | Plastic Omnium Cie | Panneau en matiere plastique d'un vehicule automobile |
EP1760727B1 (en) * | 2005-09-06 | 2015-01-07 | Alcatel Lucent | Process and apparatus for manufacturing structures guiding electromagnetic waves |
DE102005062271B3 (de) * | 2005-12-24 | 2007-03-08 | Leoni Ag | Verfahren zum Aufbringen von Material auf ein Bauteil sowie Bauteil |
DE102006061435A1 (de) | 2006-12-23 | 2008-06-26 | Leoni Ag | Verfahren und Vorrichtung zum Aufspritzen insbesondere einer Leiterbahn, elektrisches Bauteil mit einer Leiterbahn sowie Dosiervorrichtung |
US20080265613A1 (en) * | 2007-04-26 | 2008-10-30 | Excello Engineered Systems, Llc | Circuit-carrying water deflector and method for making the same |
ES2669070T3 (es) | 2007-11-02 | 2018-05-23 | Interpane Entwicklungs- Und Beratungsgesellschaft Mbh & Co. Kg | Sistema multicapas con elementos de contacto y procedimiento para la creación de un elemento de contacto para un sistema multicapas |
DE102008049215A1 (de) | 2008-09-27 | 2010-04-01 | Hotset Heizpatronen U. Zubehör Gmbh | Elektrisches Heizelement für technische Zwecke |
DE102009034483A1 (de) * | 2009-07-22 | 2011-01-27 | W.C. Heraeus Gmbh | Bleifreie Hochtemperaturverbindung für die AVT in der Elektronik |
DE102011002872B4 (de) * | 2011-01-19 | 2018-11-15 | Federal-Mogul Sealing Systems Gmbh | Verfahren zur Herstellung einer Zylinderkopfdichtung und dadurch hergestellte Zylinderkopfdichtung |
DE102011100255B3 (de) | 2011-05-03 | 2012-04-26 | Danfoss Silicon Power Gmbh | Verfahren zum Herstellen eines Halbleiterbauelements |
KR20140061422A (ko) | 2011-07-25 | 2014-05-21 | 엑카르트 게엠베하 | 기판 코팅 방법 및 이러한 방법에서 첨가제 함유 분말 코팅 물질의 용도 |
DE102011052119A1 (de) | 2011-07-25 | 2013-01-31 | Eckart Gmbh | Verfahren zur Substratbeschichtung und Verwendung additivversehener, pulverförmiger Beschichtungsmaterialien in derartigen Verfahren |
DE102011052120A1 (de) | 2011-07-25 | 2013-01-31 | Eckart Gmbh | Verwendung speziell belegter, pulverförmiger Beschichtungsmaterialien und Beschichtungsverfahren unter Einsatz derartiger Beschichtungsmaterialien |
DE102011052121A1 (de) | 2011-07-25 | 2013-01-31 | Eckart Gmbh | Beschichtungsverfahren nutzend spezielle pulverförmige Beschichtungsmaterialien und Verwendung derartiger Beschichtungsmaterialien |
EP2642837A1 (en) * | 2012-03-20 | 2013-09-25 | Jacky Chang | Conductive pattern film substrate and manufacturing method |
DE102012107896A1 (de) * | 2012-08-28 | 2014-03-06 | Reinhausen Plasma Gmbh | Verfahren und Vorrichtung zum Verbinden von Leitern mit Substraten |
DE102012224376A1 (de) | 2012-12-27 | 2014-07-03 | Robert Bosch Gmbh | Leiterbahnanordnung und Verfahren zu deren Herstellung |
DE102013219541B4 (de) | 2013-09-27 | 2019-05-09 | Evonik Degussa Gmbh | Verbessertes Verfahren zur pulvermetallurgischen Herstellung thermoelektrischer Bauelemente |
EP2959992A1 (de) | 2014-06-26 | 2015-12-30 | Eckart GmbH | Verfahren zur Herstellung eines partikelhaltigen Aerosols |
FR3031274B1 (fr) * | 2014-12-30 | 2018-02-02 | Airbus Group Sas | Structure comportant des lignes electriquement conductrices en surface et procede pour la realisation de lignes electriquement conductrices sur une face d'une structure |
DE102015117558A1 (de) * | 2015-10-15 | 2017-04-20 | Lpkf Laser & Electronics Ag | Verfahren zum Herstellen von strukturierten Beschichtungen auf einem Formteil und Vorrichtung zur Durchführung des Verfahrens |
US9783130B2 (en) * | 2015-12-01 | 2017-10-10 | Delphi Technologies, Inc. | Interior trim components with integrated electrical wiring |
EP3196951B1 (de) | 2016-01-21 | 2018-11-14 | Evonik Degussa GmbH | Rationelles verfahren zur pulvermetallurgischen herstellung thermoelektrischer bauelemente |
WO2018092798A1 (ja) | 2016-11-18 | 2018-05-24 | 矢崎総業株式会社 | 回路体形成方法及び回路体 |
EP3422828A1 (de) | 2017-06-29 | 2019-01-02 | voestalpine Stahl GmbH | Verfahren und vorrichtung zur herstellung eines elektrischen anschlusskontakts - kontaktinator |
JP2019026102A (ja) * | 2017-07-31 | 2019-02-21 | トヨタ車体株式会社 | 車両用天井モジュール及びその製造方法 |
EP3454631B1 (de) * | 2017-09-08 | 2020-03-25 | voestalpine Stahl GmbH | Verfahren zur herstellung eines elektrischen anschlusskontakts an einem beschichteten blech |
DE102019106346A1 (de) * | 2019-03-13 | 2020-09-17 | Trw Automotive Safety Systems Gmbh | Verfahren zur herstellung eines fahrzeuginnenraumbauteils |
AT523652B1 (de) * | 2020-02-28 | 2021-10-15 | Lkr Leichtmetallkompetenzzentrum Ranshofen Gmbh | Verfahren zur Herstellung eines mehrlagigen Funktionsbauteiles sowie Funktionsbauteil |
EP3993571A1 (en) * | 2020-11-03 | 2022-05-04 | Benecke-Kaliko AG | Vehicle electronics using conductive paint |
Family Cites Families (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1086770B (de) * | 1955-12-01 | 1960-08-11 | Blaupunkt Werke Gmbh | Verfahren zur Herstellung einer Baueinheit fuer elektrische Geraete |
US3042591A (en) * | 1957-05-20 | 1962-07-03 | Motorola Inc | Process for forming electrical conductors on insulating bases |
DE1107743B (de) * | 1959-09-10 | 1961-05-31 | Siemens Elektrogeraete Gmbh | Verfahren zur Herstellung von gedruckten Schaltungen nach dem Pulververfahren |
US3330695A (en) * | 1962-05-21 | 1967-07-11 | First Safe Deposit Nat Bank Of | Method of manufacturing electric circuit structures |
GB1095117A (en) * | 1963-12-26 | 1967-12-13 | Matsushita Electric Ind Co Ltd | Method of making printed circuit board |
US3431350A (en) * | 1966-03-31 | 1969-03-04 | Texas Instruments Inc | Circuit board |
DE1923028B2 (de) * | 1968-05-06 | 1972-03-02 | Xerox Corp , Rochester, N Y (V St A ) | Verfahren zur herstellung einer gedruckten schaltung |
US4234626A (en) * | 1978-02-01 | 1980-11-18 | E. I. Du Pont De Nemours And Company | Producing printed circuits by conjoining metal powder images |
EP0003363B1 (en) * | 1978-02-01 | 1982-12-01 | E.I. Du Pont De Nemours And Company | Producing printed circuits by soldering metal powder images |
US4263341A (en) * | 1978-12-19 | 1981-04-21 | Western Electric Company, Inc. | Processes of making two-sided printed circuit boards, with through-hole connections |
JPS5685894A (en) * | 1979-12-17 | 1981-07-13 | Tokyo Shibaura Electric Co | Method of forming printed circuit |
CA1172112A (en) * | 1980-12-12 | 1984-08-07 | Richard P. Plunkett | Process for making conductive coatings |
EP0089221A1 (en) * | 1982-03-15 | 1983-09-21 | EASTMAN KODAK COMPANY (a New Jersey corporation) | Electrographic method of forming conductive circuit patterns and circuit boards formed thereby |
US4454168A (en) * | 1982-09-29 | 1984-06-12 | E. I. Du Pont De Nemours And Company | Printed circuits prepared from metallized photoadhesive layers |
DE3429615C1 (de) * | 1984-08-11 | 1985-12-12 | Du Pont de Nemours (Deutschland) GmbH, 4000 Düsseldorf | Verfahren zur Erzeugung von aus Pulvern bestehenden Mustern |
EP0297678A1 (en) * | 1987-06-30 | 1989-01-04 | Akzo N.V. | Conductive metallization of substrates without developing agents |
DE3736391C1 (de) * | 1987-10-28 | 1989-02-16 | Du Pont Deutschland | Verfahren zum Beschichten von vorher klebrig gemachten Oberflaechenbereichen |
US4841099A (en) * | 1988-05-02 | 1989-06-20 | Xerox Corporation | Electrically insulating polymer matrix with conductive path formed in situ |
DE3913115A1 (de) * | 1989-04-21 | 1990-10-25 | Du Pont Deutschland | Verfahren zur herstellung von elektrisch leitfaehigen mustern |
DE3913117A1 (de) * | 1989-04-21 | 1990-10-25 | Du Pont Deutschland | Verfahren zur herstellung von elektrisch leitfaehigen mustern |
US5032737A (en) * | 1990-07-24 | 1991-07-16 | Deere & Company | Ignition circuit module and method of manufacture |
US5281765A (en) * | 1992-05-27 | 1994-01-25 | Sumitomo Wiring Systems, Ltd. | Wiring assembly for equipment and a method for producing the same |
WO1994007611A1 (en) * | 1992-10-01 | 1994-04-14 | Motorola, Inc. | Method for forming circuitry by a spraying process with stencil |
DE19502044A1 (de) * | 1995-01-12 | 1996-07-18 | Lars Ickert | Fertigungsverfahren zur Herstellung mehrlagiger 2D und 3D Leiterplatten |
DE19511553C2 (de) * | 1995-03-29 | 1997-02-20 | Litton Precision Prod Int | Verfahren zur Erzeugung elektrisch leitfähiger Strukturen, eine nach dem Verfahren erhaltene elektrisch leitfähige Struktur sowie Kombination zur Erzeugung elektrisch leitfähiger Strukturen |
JPH11195327A (ja) * | 1998-01-06 | 1999-07-21 | Yazaki Corp | ワイヤハーネス及びその製造方法 |
JPH11330671A (ja) * | 1998-05-08 | 1999-11-30 | Murata Mfg Co Ltd | 電子写真装置 |
US6106303A (en) * | 1998-05-27 | 2000-08-22 | Lear Automotive Dearborn, Inc. | Trim panel having grooves with integrally formed electrical circuits |
US6032357A (en) * | 1998-06-16 | 2000-03-07 | Lear Automotive Dearborn, Inc. | Method of fabricating a printed circuit |
US6036501A (en) * | 1998-08-05 | 2000-03-14 | Lear Automotive Dearborn, Inc. | Trim panel with integrally formed electrical connectors |
US6161889A (en) * | 1998-10-26 | 2000-12-19 | Lear Automotive Dearborn, Inc. | Ribbed trim panel for thermal spraying of electrical circuit |
DE19930014A1 (de) * | 1999-06-30 | 2001-01-18 | Volkswagen Ag | Kraftfahrzeug mit Leiterbahnen enthaltenden Flachleitungen |
US20020139472A1 (en) * | 2001-03-29 | 2002-10-03 | Albert Wojewnik | Method of forming an electrical circuit on a substrate |
US6799786B2 (en) * | 2002-11-08 | 2004-10-05 | Lear Corporation | Instrument panel for a vehicle |
-
2001
- 2001-02-24 DE DE10109087A patent/DE10109087A1/de not_active Withdrawn
-
2002
- 2002-02-22 PT PT02732446T patent/PT1363811E/pt unknown
- 2002-02-22 AU AU2002304822A patent/AU2002304822A1/en not_active Abandoned
- 2002-02-22 AT AT02732446T patent/ATE285346T1/de not_active IP Right Cessation
- 2002-02-22 EP EP04015563A patent/EP1517597B1/de not_active Expired - Lifetime
- 2002-02-22 WO PCT/EP2002/001896 patent/WO2002068245A1/de not_active Application Discontinuation
- 2002-02-22 JP JP2002567579A patent/JP4133335B2/ja not_active Expired - Fee Related
- 2002-02-22 ES ES02732446T patent/ES2233821T3/es not_active Expired - Lifetime
- 2002-02-22 KR KR10-2003-7011040A patent/KR20030090647A/ko not_active Application Discontinuation
- 2002-02-22 DE DE50201837T patent/DE50201837D1/de not_active Expired - Lifetime
- 2002-02-22 AT AT04015563T patent/ATE511343T1/de active
- 2002-02-22 EP EP02732446A patent/EP1363811B1/de not_active Expired - Lifetime
-
2003
- 2003-08-25 US US10/647,542 patent/US20040055153A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
US20040055153A1 (en) | 2004-03-25 |
WO2002068245A8 (de) | 2004-06-10 |
DE50201837D1 (de) | 2005-01-27 |
EP1517597A2 (de) | 2005-03-23 |
JP4133335B2 (ja) | 2008-08-13 |
AU2002304822A1 (en) | 2002-09-12 |
ATE511343T1 (de) | 2011-06-15 |
DE10109087A1 (de) | 2002-10-24 |
KR20030090647A (ko) | 2003-11-28 |
ATE285346T1 (de) | 2005-01-15 |
EP1363811B1 (de) | 2004-12-22 |
WO2002068245A1 (de) | 2002-09-06 |
EP1517597B1 (de) | 2011-05-25 |
JP2004525757A (ja) | 2004-08-26 |
ES2233821T3 (es) | 2005-06-16 |
EP1363811A1 (de) | 2003-11-26 |
EP1517597A3 (de) | 2005-12-07 |
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