PT1066926E - Metodo de polimento de pelo menos uma superficie de uma peca a base de silicone - Google Patents

Metodo de polimento de pelo menos uma superficie de uma peca a base de silicone

Info

Publication number
PT1066926E
PT1066926E PT00401691T PT00401691T PT1066926E PT 1066926 E PT1066926 E PT 1066926E PT 00401691 T PT00401691 T PT 00401691T PT 00401691 T PT00401691 T PT 00401691T PT 1066926 E PT1066926 E PT 1066926E
Authority
PT
Portugal
Prior art keywords
abrasive
polishing
smooth
article
roughness
Prior art date
Application number
PT00401691T
Other languages
English (en)
Inventor
Ferme Jean-Jacques
Godefroy Philippe
Dahan Gilbert
Original Assignee
Seso
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=9547373&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=PT1066926(E) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Seso filed Critical Seso
Publication of PT1066926E publication Critical patent/PT1066926E/pt

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/04—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by a combination of operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
PT00401691T 1999-06-28 2000-06-15 Metodo de polimento de pelo menos uma superficie de uma peca a base de silicone PT1066926E (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9908228 1999-06-28

Publications (1)

Publication Number Publication Date
PT1066926E true PT1066926E (pt) 2006-08-31

Family

ID=9547373

Family Applications (1)

Application Number Title Priority Date Filing Date
PT00401691T PT1066926E (pt) 1999-06-28 2000-06-15 Metodo de polimento de pelo menos uma superficie de uma peca a base de silicone

Country Status (8)

Country Link
US (1) US6428395B1 (pt)
EP (1) EP1066926B1 (pt)
JP (1) JP2001009708A (pt)
AT (1) ATE321628T1 (pt)
DE (1) DE60026953T2 (pt)
DK (1) DK1066926T3 (pt)
ES (1) ES2261166T3 (pt)
PT (1) PT1066926E (pt)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100664609B1 (ko) 2004-10-20 2007-01-04 주식회사 신안에스엔피 오엘이디 용 유리기판의 연마방법 및 이를 이용하여 생산된 오엘이디용 유리기판

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61219566A (ja) * 1985-03-25 1986-09-29 Toshiba Corp 研磨定盤用材料
JPS6440267A (en) * 1987-08-07 1989-02-10 Shinetsu Chemical Co Manufacture of precisely polished glass
US5607718A (en) * 1993-03-26 1997-03-04 Kabushiki Kaisha Toshiba Polishing method and polishing apparatus
EP1080797A3 (en) * 1994-06-28 2005-10-05 Ebara Corporation Method and apparatus for cleaning workpiece
US5704987A (en) * 1996-01-19 1998-01-06 International Business Machines Corporation Process for removing residue from a semiconductor wafer after chemical-mechanical polishing
JPH10180624A (ja) * 1996-12-19 1998-07-07 Shin Etsu Handotai Co Ltd ラッピング装置及び方法
JPH10204417A (ja) * 1997-01-27 1998-08-04 Kao Corp 加工用助剤組成物、研磨材組成物、表面加工方法及び基板の製造方法

Also Published As

Publication number Publication date
DE60026953D1 (de) 2006-05-18
EP1066926B1 (fr) 2006-03-29
ES2261166T3 (es) 2006-11-16
DE60026953T2 (de) 2007-04-05
DK1066926T3 (da) 2006-08-07
ATE321628T1 (de) 2006-04-15
EP1066926A1 (fr) 2001-01-10
US6428395B1 (en) 2002-08-06
JP2001009708A (ja) 2001-01-16

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