ATE321628T1 - Verfahren zum polieren von mindestens einer seite eines silizium enthaltende werkstücks - Google Patents
Verfahren zum polieren von mindestens einer seite eines silizium enthaltende werkstücksInfo
- Publication number
- ATE321628T1 ATE321628T1 AT00401691T AT00401691T ATE321628T1 AT E321628 T1 ATE321628 T1 AT E321628T1 AT 00401691 T AT00401691 T AT 00401691T AT 00401691 T AT00401691 T AT 00401691T AT E321628 T1 ATE321628 T1 AT E321628T1
- Authority
- AT
- Austria
- Prior art keywords
- abrasive
- polishing
- smooth
- article
- roughness
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title abstract 5
- 229910052710 silicon Inorganic materials 0.000 title abstract 3
- 239000010703 silicon Substances 0.000 title abstract 3
- 238000000034 method Methods 0.000 title abstract 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 2
- 230000003746 surface roughness Effects 0.000 abstract 2
- 229910001018 Cast iron Inorganic materials 0.000 abstract 1
- 229910052684 Cerium Inorganic materials 0.000 abstract 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 abstract 1
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 abstract 1
- 239000008119 colloidal silica Substances 0.000 abstract 1
- 229910001651 emery Inorganic materials 0.000 abstract 1
- 230000004907 flux Effects 0.000 abstract 1
- 239000007788 liquid Substances 0.000 abstract 1
- 239000002245 particle Substances 0.000 abstract 1
- 238000007517 polishing process Methods 0.000 abstract 1
- 229920002635 polyurethane Polymers 0.000 abstract 1
- 239000004814 polyurethane Substances 0.000 abstract 1
- 239000002344 surface layer Substances 0.000 abstract 1
- 229910052726 zirconium Inorganic materials 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/04—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by a combination of operations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR9908228 | 1999-06-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE321628T1 true ATE321628T1 (de) | 2006-04-15 |
Family
ID=9547373
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT00401691T ATE321628T1 (de) | 1999-06-28 | 2000-06-15 | Verfahren zum polieren von mindestens einer seite eines silizium enthaltende werkstücks |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US6428395B1 (de) |
| EP (1) | EP1066926B1 (de) |
| JP (1) | JP2001009708A (de) |
| AT (1) | ATE321628T1 (de) |
| DE (1) | DE60026953T2 (de) |
| DK (1) | DK1066926T3 (de) |
| ES (1) | ES2261166T3 (de) |
| PT (1) | PT1066926E (de) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100664609B1 (ko) | 2004-10-20 | 2007-01-04 | 주식회사 신안에스엔피 | 오엘이디 용 유리기판의 연마방법 및 이를 이용하여 생산된 오엘이디용 유리기판 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61219566A (ja) * | 1985-03-25 | 1986-09-29 | Toshiba Corp | 研磨定盤用材料 |
| JPS6440267A (en) * | 1987-08-07 | 1989-02-10 | Shinetsu Chemical Co | Manufacture of precisely polished glass |
| US5607718A (en) * | 1993-03-26 | 1997-03-04 | Kabushiki Kaisha Toshiba | Polishing method and polishing apparatus |
| EP0692318B1 (de) * | 1994-06-28 | 2001-09-12 | Ebara Corporation | Verfahren und Vorrichtung zum Reinigen von Werkstücken |
| US5704987A (en) * | 1996-01-19 | 1998-01-06 | International Business Machines Corporation | Process for removing residue from a semiconductor wafer after chemical-mechanical polishing |
| JPH10180624A (ja) * | 1996-12-19 | 1998-07-07 | Shin Etsu Handotai Co Ltd | ラッピング装置及び方法 |
| JPH10204417A (ja) * | 1997-01-27 | 1998-08-04 | Kao Corp | 加工用助剤組成物、研磨材組成物、表面加工方法及び基板の製造方法 |
-
2000
- 2000-06-15 AT AT00401691T patent/ATE321628T1/de active
- 2000-06-15 PT PT00401691T patent/PT1066926E/pt unknown
- 2000-06-15 EP EP00401691A patent/EP1066926B1/de not_active Expired - Lifetime
- 2000-06-15 DE DE60026953T patent/DE60026953T2/de not_active Expired - Lifetime
- 2000-06-15 DK DK00401691T patent/DK1066926T3/da active
- 2000-06-15 ES ES00401691T patent/ES2261166T3/es not_active Expired - Lifetime
- 2000-06-22 US US09/598,904 patent/US6428395B1/en not_active Expired - Lifetime
- 2000-06-28 JP JP2000195141A patent/JP2001009708A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| EP1066926A1 (de) | 2001-01-10 |
| US6428395B1 (en) | 2002-08-06 |
| EP1066926B1 (de) | 2006-03-29 |
| JP2001009708A (ja) | 2001-01-16 |
| ES2261166T3 (es) | 2006-11-16 |
| DK1066926T3 (da) | 2006-08-07 |
| PT1066926E (pt) | 2006-08-31 |
| DE60026953D1 (de) | 2006-05-18 |
| DE60026953T2 (de) | 2007-04-05 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| UEP | Publication of translation of european patent specification |
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