ATE226868T1 - Polier- oder schleifvorrichtung - Google Patents
Polier- oder schleifvorrichtungInfo
- Publication number
- ATE226868T1 ATE226868T1 AT99956065T AT99956065T ATE226868T1 AT E226868 T1 ATE226868 T1 AT E226868T1 AT 99956065 T AT99956065 T AT 99956065T AT 99956065 T AT99956065 T AT 99956065T AT E226868 T1 ATE226868 T1 AT E226868T1
- Authority
- AT
- Austria
- Prior art keywords
- polishing
- lapping
- abrasive suspension
- parts
- partitions
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title abstract 4
- 239000000725 suspension Substances 0.000 abstract 3
- 238000005192 partition Methods 0.000 abstract 2
- 239000002184 metal Substances 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/12—Lapping plates for working plane surfaces
- B24B37/16—Lapping plates for working plane surfaces characterised by the shape of the lapping plate surface, e.g. grooved
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9814563A FR2786118B1 (fr) | 1998-11-19 | 1998-11-19 | Dispositif de rodage ou polissage |
PCT/FR1999/002817 WO2000030806A1 (fr) | 1998-11-19 | 1999-11-17 | Dispositif de rodage ou polissage |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE226868T1 true ATE226868T1 (de) | 2002-11-15 |
Family
ID=9532934
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT99956065T ATE226868T1 (de) | 1998-11-19 | 1999-11-17 | Polier- oder schleifvorrichtung |
Country Status (7)
Country | Link |
---|---|
US (1) | US6837780B1 (de) |
EP (1) | EP1131186B1 (de) |
AT (1) | ATE226868T1 (de) |
DE (1) | DE69903748T2 (de) |
DK (1) | DK1131186T3 (de) |
FR (1) | FR2786118B1 (de) |
WO (1) | WO2000030806A1 (de) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ITMC20070237A1 (it) * | 2007-12-12 | 2009-06-13 | Ghines Srl | Utensile abrasivo perfezionato. |
JP6188286B2 (ja) * | 2012-07-13 | 2017-08-30 | スリーエム イノベイティブ プロパティズ カンパニー | 研磨パッド及びガラス、セラミックス、及び金属材料の研磨方法 |
JP7165719B2 (ja) * | 2017-08-04 | 2022-11-04 | スリーエム イノベイティブ プロパティズ カンパニー | 平坦性が向上された微細複製研磨表面 |
DE102017216033A1 (de) * | 2017-09-12 | 2019-03-14 | Carl Zeiss Smt Gmbh | Verfahren zum Bearbeiten eines Werkstücks bei der Herstellung eines optischen Elements |
USD1004393S1 (en) * | 2021-11-09 | 2023-11-14 | Ehwa Diamond Industrial Co., Ltd. | Grinding pad |
USD1000928S1 (en) * | 2022-06-03 | 2023-10-10 | Beng Youl Cho | Polishing pad |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2043501B (en) * | 1979-02-28 | 1982-11-24 | Interface Developments Ltd | Abrading member |
US4866886A (en) * | 1987-11-23 | 1989-09-19 | Magnetic Peripherals Inc. | Textured lapping plate and process for its manufacture |
FR2639278B1 (fr) | 1988-11-22 | 1991-01-11 | Lam Plan Sa | Plateau de polissage |
US5020283A (en) * | 1990-01-22 | 1991-06-04 | Micron Technology, Inc. | Polishing pad with uniform abrasion |
US5441598A (en) * | 1993-12-16 | 1995-08-15 | Motorola, Inc. | Polishing pad for chemical-mechanical polishing of a semiconductor substrate |
US5888119A (en) * | 1997-03-07 | 1999-03-30 | Minnesota Mining And Manufacturing Company | Method for providing a clear surface finish on glass |
FR2761289B1 (fr) * | 1997-03-25 | 1999-05-21 | Lam Plan Sa | Outil de polissage deformable |
US5882251A (en) * | 1997-08-19 | 1999-03-16 | Lsi Logic Corporation | Chemical mechanical polishing pad slurry distribution grooves |
US6206759B1 (en) * | 1998-11-30 | 2001-03-27 | Micron Technology, Inc. | Polishing pads and planarizing machines for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies, and methods for making and using such pads and machines |
US6217426B1 (en) * | 1999-04-06 | 2001-04-17 | Applied Materials, Inc. | CMP polishing pad |
US6238273B1 (en) * | 1999-08-31 | 2001-05-29 | Micron Technology, Inc. | Methods for predicting polishing parameters of polishing pads and methods and machines for planarizing microelectronic substrate assemblies in mechanical or chemical-mechanical planarization |
US6328632B1 (en) * | 1999-08-31 | 2001-12-11 | Micron Technology, Inc. | Polishing pads and planarizing machines for mechanical and/or chemical-mechanical planarization of microelectronic substrate assemblies |
US6439986B1 (en) * | 1999-10-12 | 2002-08-27 | Hunatech Co., Ltd. | Conditioner for polishing pad and method for manufacturing the same |
-
1998
- 1998-11-19 FR FR9814563A patent/FR2786118B1/fr not_active Expired - Lifetime
-
1999
- 1999-11-17 WO PCT/FR1999/002817 patent/WO2000030806A1/fr active IP Right Grant
- 1999-11-17 EP EP99956065A patent/EP1131186B1/de not_active Expired - Lifetime
- 1999-11-17 DE DE69903748T patent/DE69903748T2/de not_active Expired - Lifetime
- 1999-11-17 AT AT99956065T patent/ATE226868T1/de not_active IP Right Cessation
- 1999-11-17 US US09/831,865 patent/US6837780B1/en not_active Expired - Lifetime
- 1999-11-17 DK DK99956065T patent/DK1131186T3/da active
Also Published As
Publication number | Publication date |
---|---|
DE69903748D1 (de) | 2002-12-05 |
DK1131186T3 (da) | 2003-01-20 |
DE69903748T2 (de) | 2003-07-24 |
FR2786118B1 (fr) | 2000-12-22 |
FR2786118A1 (fr) | 2000-05-26 |
EP1131186B1 (de) | 2002-10-30 |
WO2000030806A1 (fr) | 2000-06-02 |
US6837780B1 (en) | 2005-01-04 |
EP1131186A1 (de) | 2001-09-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |