EP1131186B1 - Polier- oder schleifvorrichtung - Google Patents

Polier- oder schleifvorrichtung Download PDF

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Publication number
EP1131186B1
EP1131186B1 EP99956065A EP99956065A EP1131186B1 EP 1131186 B1 EP1131186 B1 EP 1131186B1 EP 99956065 A EP99956065 A EP 99956065A EP 99956065 A EP99956065 A EP 99956065A EP 1131186 B1 EP1131186 B1 EP 1131186B1
Authority
EP
European Patent Office
Prior art keywords
partitions
disc
polishing
lapping
hollow portions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP99956065A
Other languages
English (en)
French (fr)
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EP1131186A1 (de
Inventor
Georges Henri Guy Broido
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dite Lam-Plan Sa Ste
Original Assignee
Dite Lam-Plan Sa Ste
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dite Lam-Plan Sa Ste filed Critical Dite Lam-Plan Sa Ste
Publication of EP1131186A1 publication Critical patent/EP1131186A1/de
Application granted granted Critical
Publication of EP1131186B1 publication Critical patent/EP1131186B1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • B24B37/16—Lapping plates for working plane surfaces characterised by the shape of the lapping plate surface, e.g. grooved

Definitions

  • the invention relates, according to a first of its aspects, to a polishing or lapping device comprising a surface selectively rotated around an axis of revolution and on which parts to be polished are intended to be applied, with the interposition of a abrasive suspension and with a certain pressure, this surface comprising a plurality of recessed parts forming, for the abrasive suspension, reservoirs which are independent of each other and the parties in hollow being delimited by partitions whose walls in cooperation with the abrasive suspension, form the active areas for lapping or polishing.
  • Devices of this type can in particular be presented in the form of a disc or a cylinder.
  • EP-0 370 843 describes a polishing plate having a flat surface to which are exposed soft parts and hard parts. These tender parts and hard are distributed appropriately to adjust the length of the intervals between the hard parts.
  • the partitions delimiting the abrasive suspension tanks have a different height depending on whether they are open or closed, side walls of these partitions form with the walls upper walls of these partitions at a right angle, and tanks and partitions are distributed so irregular both in a radial direction and in a tangential direction.
  • the invention aims to overcome these drawbacks by proposing a lapping or polishing device, the manufacturing is simplified and whose yield is increases.
  • the device of the invention is characterized in that the partitions have a substantially constant height over the entire said surface of the device, before using this one, in that the hollow parts are delimited by side walls forming with the walls greater than an angle less than 90 °, and in that the recessed parts and the partitions are distributed so regular on each circle centered on the axis of revolution.
  • the ratio between the smallest thickness of said partitions and the largest dimension of the parts intaglio is between approximately 1: 3 and 1: 6 and, from preferably 1: 5.
  • the depth of the recesses or the partition height is between 0.05 and 15 millimeters and, in particular, between 0.05 and 10 millimeters.
  • the thickness of the upper walls of the partitions is advantageously between 0.5 and 15 mm.
  • the angle between the side walls and the top wall of a partition is advantageously greater than or equal to 75 °.
  • the recessed parts and the partitions are preferably evenly distributed throughout said device surface.
  • the surface of the walls upper partitions advantageously increases since the edge of the disc toward the center of the disc.
  • the lapping or polishing device according to the invention preferably consists of at least one resin synthetic mixed with at least one powder, in particular with metal or ceramic base.
  • Abrasive grains in particular based on aluminum oxides, silicon carbides or natural diamond or synthetic, can be mixed with said resin.
  • partitions define shapes geometric type polygonal or rounded.
  • its surface corresponds to relief in positive or negative of a taffeta type fabric or satin.
  • the mold consists of the negative reproduction of a grid and a plate obstructing it.
  • the mold has a surface whose relief is that of a taffeta or satin type fabric or its negative.
  • Figure 1 shows an embodiment of the device lapping or polishing according to the invention which is presented in the form of a disc, the flat surface of which comprises a plurality of recessed parts 1 which are delimited between them by partitions 2.
  • the parts in hollow 1 here have substantially the shape of a square, the recessed parts being regularly distributed over the disk surface according to the invention.
  • This disc is intended to be used with a suspension abrasive which is sprayed over the entire surface of the disc. To perform lapping or polishing, the disc is rotated and the parts to be polished are applied to its surface, with a certain pressure.
  • the recessed parts 1 form a plurality of tanks for the abrasive suspension.
  • the partitions 2 are defined by a wall upper 20 and two side walls 21 and 22.
  • These partitions 2 have a height h which is regular over the entire surface of the disc and this, to ensure regular lapping or polishing of the parts to be polished.
  • This depth h also defines the depth of each hollow part or tank 1.
  • this height h is advantageously between approximately 0.05 and 15 millimeters and preferably between 0.05 and 10 millimeters.
  • the parties in troughs actually act as reservoirs, while allowing the passage of part of the suspension abrasive on the upper walls of partitions 2, in while using the disc.
  • the thickness of the partitions 2 or the z dimension of the upper face 20 of the partitions are between 0.5 and 15 millimeters, this to contribute to the efficiency of material removal, when using the disc according to the invention.
  • the ratio between the thickness z partitions 2 and the x or y side of the hollow parts 1 is advantageously between approximately 1: 3 and 1: 6 and that this ratio is notably equal to 1: 5.
  • the draft angle ⁇ , between the upper wall 20 of the partition 2 and a side wall 21 or 22 is less than 90 °. This is due the fact that the device according to the invention is advantageously obtained by molding as will be seen in the rest of the description.
  • this angle is not less than 75 °, so that the active surface of the disc, consisting of all the upper walls partitions 2, is not significantly changed when the disc undergoes wear, after use extended.
  • the invention is of course not limited to the form of recessed parts 1 and partitions 2 which is illustrated on the figures.
  • the recessed parts 1 may have a shape any geometric, in particular polygonal and for example rectangular or hexagonal, or a rounded shape, such as a round or oval shape.
  • the surface of the lapping or polishing device according to the invention can also correspond to the relief in negative or positive of a fabric, in particular of the satin type or taffeta.
  • the negative relief of these fabrics defines parts in hollow forming reservoirs for the abrasive solution and raised parts forming partitions between the tanks.
  • the size of the tanks depends on the dimension of the threads of the fabric as well as the armor of this latest.
  • Figures 8 and 9 illustrate respectively a fabric of the taffeta type and a fabric of the satin type.
  • the elements in relief 18 respectively 19 will form the reservoirs of the device according to the invention and the hollow elements 28 respectively 29, the partitions of these measures.
  • FIGS. 6 and 7 illustrate alternative embodiments of the device according to the invention, also in the form of a disk.
  • the recessed portions 16 have the shape of an equilateral triangle and they are delimited by partitions 26.
  • the smallest dimension of the tanks 16, corresponding to the height of the triangle, is indicated by x and the largest dimension of the tanks, corresponding to one side of the triangle, by y. So, this is the z / y ratio which is advantageously between approximately 1: 3 and 1: 6.
  • the recessed portions 17 have an oval or elliptical shape and are demarcated by partitions 27.
  • the smallest dimension of the tanks 17 is indicated by x, corresponding to the minor axis of the ellipse, and the largest dimension of the tanks by y, corresponding to the major axis of the ellipse.
  • the smaller thickness of the partitions 27 is indicated by z. In this case again, it is the z / y ratio which is advantageously between approximately 1: 3 and 1: 6.
  • the invention is also not limited to a device for lapping or polishing in the form of a disc with a flat surface.
  • the disc may have a concave surface or convex.
  • the device can also be present in the form of a cylinder, the active surface of polishing or lapping being formed by the surface outer surface or the inner surface of the cylinder.
  • the device according to the invention is a surface of revolution whose axis of revolution is the axis of rotation of the device on the lapping machine or polishing on which it is used.
  • the recessed parts and the partitions are evenly distributed over any curve defining a plane perpendicular to the axis of revolution of the device and all points of which are equidistant from the axis of revolution.
  • the hollow parts and the partitions are evenly distributed over the entire surface of the device which is intended to receive parts to be polished.
  • the hollow parts and the partitions are distributed evenly on any circle of any radius.
  • Figure 10 shows a disc of lapping or polishing according to the invention, the parts of which in the hollow have the shape of a trapezoid.
  • recessed parts are distributed in seven circles concentric. All recessed parts 100, 101, 102, 104, 105, 106 respectively defining a circle of the same radius, have the same shape and the same dimensions. On the other hand, from one circle to another, these hollow parts have a different shape and dimensions.
  • the surface of the upper walls of the partitions or the thickness of the partitions is greater at the level of the center of the disc only towards its edge.
  • the surface tanks may be smaller towards the center of the disc only at its edge.
  • FIGS. 4 and 5 reference is made to FIGS. 4 and 5.
  • Figure 4 shows in plan, a detail of a variant of realization of the device illustrated in figures 1 to 3.
  • FIG. 4 shows a particular distribution of the parts recessed and partitions according to a diameter of the device according to the invention, in the form of a disc.
  • the right part of Figure 4 corresponds to an area of the disc closer to the center of the disc, while the left part of this figure corresponds to an area more close to the edge of the disc.
  • the thickness zb of the partition 24b between the hollow parts 14c and 14b is therefore greater than the thickness za of the partition 24a between the hollow parts 14b and 14a.
  • the side xc of the hollow part 14c is lower than the side xb of the recessed portion 14b which is itself lower than the side xa of the hollow part 14a.
  • the thickness of the partitions is more important towards the center of the disc than towards the edge, the dimensions of the hollow parts being substantially identical.
  • the device according to the invention is advantageously obtained by molding a material consisting of a pure metal or another composite metal, i.e. at least one resin synthetic mixed with at least one solid powder, in particular metallic or also based on ceramics.
  • the mold has the shape of the desired counterpart, so to obtain the recessed parts and the desired partitions. So practically a mold will have domes, each dome representing a tank.
  • the mold may consist of the negative reproduction of a grid whose voids represent the partitions and which is associated with a plate which obstructs it.
  • this mold is advantageous when the partitions of the device according to the invention, which constitute its active part, must be made of a material relatively expensive. Indeed, with this mold, the bottom of tanks can then be realized separately in another any material.
  • a mold used to make a device according to the invention can also be in the form of a stamped plate on which the tanks are reproduced.
  • This mold may also have a surface whose relief is that of a taffeta or satin type fabric (see Figures 8 and 9) or the relief in negative of such tissue.
  • a device according to the invention is used in combination with an abrasive suspension which is sprayed on its surface.
  • This spraying supplies each reservoir with the surface of the device.
  • the parts distribute the abrasive suspension on the surface of the device.
  • the cleaning of the devices according to the invention is carried out periodically and manually, the abraded material largely depositing in tanks.
  • test conditions are as follows:
  • the tests are carried out with three samples, the dimensions are 10 x 20 millimeters, type 316 LS, coated in a resin and having a final diameter of 40 millimeters.
  • Lapping is carried out in six cycles of 10 minutes each.
  • Material removal is measured at the end of each cycle by measuring the difference in weight. The measurements are data in milligrams.
  • the abrasive film is no longer regular and it is necessary to stop machine for cleaning the plate, lapping or polishing cannot be achieved.
  • the roughness of the samples obtained after polishing on the two discs was measured with a roughness tester at MAHR PERTHEN type probe.
  • the measurements carried out showed that the total roughness, or Rt, is 1.2 microns with the blue New Lam disc and 0.9 micron with the disc according to the invention.
  • the average roughness, or Ra is 0.11 micron with the blue New Lam disc and 0.08 micron with the disc according to the invention.
  • the disc according to the invention makes it possible to obtain a state which is improved by around 30%.
  • the pieces lapped have an average roughness Ra of less than 0.10 micron.
  • the disc according to the invention described above provides parts whose average roughness Ra is effectively less than 0.10 micron which is not the case for parts run in with the New Lam blue disc previously described.
  • the lapping or polishing device makes it possible to reduce the running-in time or polishing compared to conventional discs, obtaining a similar roughness.
  • the disc according to the invention allows a lot greater maneuverability when running in manually.
  • the device according to the invention could be obtained by molding a material consisting of pure metal or composite metal, i.e. a mixture of at least one synthetic resin and minus a solid, especially metallic, powder.
  • the material used to make the lapping device or polishing according to the invention can be unique. we can also plan to make the device according to the invention from two or more different materials, in the case where one wishes to obtain on the surface of the device with different hardness zones.
  • a first constituent material of device according to the invention can be a mixture of resin polyester and a metallic powder
  • a second constituent material may be a mixture of polyurethane resin and another metallic powder
  • the material of the device according to the invention may include abrasive grains, in particular based on aluminum oxides, silicon carbides, or still natural or synthetic diamond.
  • the device according to the invention can be in the form of a fixed sheet of removably on a support of suitable shape, by any suitable means.
  • the device according to the invention can also form in one piece the active surface for abrasion and its support.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Polarising Elements (AREA)
  • Glass Compositions (AREA)

Claims (14)

  1. Polier- oder Einschleifvorrichtung mit einer selektiv um eine Drehachse in Rotation gebrachten Fläche, auf der die zu polierenden Stücke dazu bestimmt sind, unter Zwischenschaltung einer schleifenden Aufhängung und mit einem gewissen Druck angewendet zu werden, wobei diese Fläche eine Vielzahl von vertieften Teilen (1, 16, 17) umfasst, die für die schleifende Aufhängung Reservoirs bilden, die voneinander unabhängig sind, und wobei die vertieften Teile (1, 16, 17) durch Zwischenwände (2, 26, 27) begrenzt sind, deren obere Wände (20) durch Zusammenwirken mit der schleifenden Aufhängung aktive Bereiche für das Einschleifen oder das Polieren bilden, dadurch gekennzeichnet, das die Zwischenwände (2, 26, 27) eine deutlich konstante Höhe auf der ganzen besagten Fläche der Vorrichtung vor der Nutzung derselben aufweisen, dass die vertieften Teile durch mit den oberen Wänden (20) einen Winkel α unter 90° bildende Seitenwände (21, 22) begrenzt sind, und dass die vertieften Teile (1, 16, 17) und die Zwischenwände (2, 26, 27) regelmäßig auf jedem auf der Drehachse zentrierten Zirkel verteilt sind.
  2. Vorrichtung gemäß Anspruch 1, dadurch gekennzeichnet, dass das Verhältnis zwischen der kleinsten Stärke (z) der besagten Zwischenwände (2, 26, 27) und der größten Abmessung (y) der besagten vertieften Teile (1, 16, 17) zwischen ungefähr 1:3 und 1:6 inbegriffen ist und bevorzugt gleich 1:5 ist.
  3. Vorrichtung gemäß Anspruch 1 oder 2, dadurch gekennzeichnet, dass die Tiefe der vertieften Teile (1, 16, 17) oder die Höhe (h) der Zwischenwände (2, 26, 27) zwischen 0,05 und 15 Millimetern inbegriffen ist und bevorzugt zwischen 0,05 und 10 Millimetern.
  4. Vorrichtung gemäß Anspruch 1 bis 3, dadurch gekennzeichnet, dass die Stärke (z) der oberen Wände (20) der Zwischenwände (2, 26, 27) zwischen 0,5 und 15 Millimetern inbegriffen ist.
  5. Vorrichtung gemäß Anspruch 1 bis 4, dadurch gekennzeichnet, dass der Winkel (α) zwischen den Seitenwänden (21, 22) und der oberen Wand (20) einer Zwischenwand (2, 26, 27) größer oder gleich 75° ist.
  6. Vorrichtung gemäß Anspruch 1 bis 5, dadurch gekennzeichnet, dass die besagten vertieften Teile und die besagten Zwischenwände gleichmäßig auf der ganzen Fläche der Vorrichtung verteilt sind.
  7. Vorrichtung gemäß einem der vorherigen Ansprüche, dadurch gekennzeichnet, dass sie die Form einer Scheibe aufweist, und dass die Fläche der oberen Wände der besagten Zwischenwände (24a, 24b) ab dem Rand der Scheibe zum Zentrum der Scheibe hin zunimmt.
  8. Vorrichtung gemäß Anspruch 1 bis 7, dadurch gekennzeichnet, dass sie aus wenigstens einem, mit wenigstens einem Pulver, insbesondere auf Metall- oder Keramikbasis vermischten Kunstharz besteht.
  9. Vorrichtung gemäß Anspruch 8, dadurch gekennzeichnet, Schleifkörner, insbesondere auf Aluminiumoxidbasis, Siliziumkarbidbasis oder auf Basis natürlicher oder synthetischer Diamanten mit dem besagten Harz vermischt werden.
  10. Vorrichtung gemäß Anspruch 1 bis 9, dadurch gekennzeichnet, dass die besagten Zwischenwände (2, 26, 27) geometrische Formen vom polygonalen oder abgerundeten Typ definieren.
  11. Vorrichtung gemäß Anspruch 1 bis 9, dadurch gekennzeichnet, dass die besagte Fläche dem positiven oder negativen Relief eines Stoffes vom Typ Taft oder Satin entspricht.
  12. Verfahren zum Erhalt einer Polier- oder Einschleifvorrichtung gemäß Anspruch 1 bis 11, das aus Folgendem besteht:
    Gießen einer Mischung aus wenigstens einem synthetischen Harz und wenigstens einem eventuell Schleifkörner enthaltendem Pulver, insbesondere auf Metall- oder Keramikbasis in eine Gießform in geeigneter Form,
    Aushärten lassen der besagten Mischung und
    Vornehmen des Ausformens.
  13. Verfahren gemäß Anspruch 12, dadurch gekennzeichnet, dass die besagte Gießform aus der negativen Nachbildung eines Gitters und einer es verschließenden Platte gebildet wird.
  14. Verfahren gemäß Anspruch 13, dadurch gekennzeichnet, dass die besagte Gießform eine Fläche aufweist, deren Relief das eines Stoffes vom Typ Satin oder Taft oder seines Negativs ist.
EP99956065A 1998-11-19 1999-11-17 Polier- oder schleifvorrichtung Expired - Lifetime EP1131186B1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR9814563 1998-11-19
FR9814563A FR2786118B1 (fr) 1998-11-19 1998-11-19 Dispositif de rodage ou polissage
PCT/FR1999/002817 WO2000030806A1 (fr) 1998-11-19 1999-11-17 Dispositif de rodage ou polissage

Publications (2)

Publication Number Publication Date
EP1131186A1 EP1131186A1 (de) 2001-09-12
EP1131186B1 true EP1131186B1 (de) 2002-10-30

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Family Applications (1)

Application Number Title Priority Date Filing Date
EP99956065A Expired - Lifetime EP1131186B1 (de) 1998-11-19 1999-11-17 Polier- oder schleifvorrichtung

Country Status (7)

Country Link
US (1) US6837780B1 (de)
EP (1) EP1131186B1 (de)
AT (1) ATE226868T1 (de)
DE (1) DE69903748T2 (de)
DK (1) DK1131186T3 (de)
FR (1) FR2786118B1 (de)
WO (1) WO2000030806A1 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ITMC20070237A1 (it) * 2007-12-12 2009-06-13 Ghines Srl Utensile abrasivo perfezionato.
JP6188286B2 (ja) * 2012-07-13 2017-08-30 スリーエム イノベイティブ プロパティズ カンパニー 研磨パッド及びガラス、セラミックス、及び金属材料の研磨方法
JP7165719B2 (ja) * 2017-08-04 2022-11-04 スリーエム イノベイティブ プロパティズ カンパニー 平坦性が向上された微細複製研磨表面
DE102017216033A1 (de) * 2017-09-12 2019-03-14 Carl Zeiss Smt Gmbh Verfahren zum Bearbeiten eines Werkstücks bei der Herstellung eines optischen Elements
USD1004393S1 (en) * 2021-11-09 2023-11-14 Ehwa Diamond Industrial Co., Ltd. Grinding pad
USD1000928S1 (en) * 2022-06-03 2023-10-10 Beng Youl Cho Polishing pad

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2043501B (en) * 1979-02-28 1982-11-24 Interface Developments Ltd Abrading member
US4866886A (en) * 1987-11-23 1989-09-19 Magnetic Peripherals Inc. Textured lapping plate and process for its manufacture
FR2639278B1 (fr) 1988-11-22 1991-01-11 Lam Plan Sa Plateau de polissage
US5020283A (en) * 1990-01-22 1991-06-04 Micron Technology, Inc. Polishing pad with uniform abrasion
US5441598A (en) * 1993-12-16 1995-08-15 Motorola, Inc. Polishing pad for chemical-mechanical polishing of a semiconductor substrate
US5888119A (en) * 1997-03-07 1999-03-30 Minnesota Mining And Manufacturing Company Method for providing a clear surface finish on glass
FR2761289B1 (fr) * 1997-03-25 1999-05-21 Lam Plan Sa Outil de polissage deformable
US5882251A (en) * 1997-08-19 1999-03-16 Lsi Logic Corporation Chemical mechanical polishing pad slurry distribution grooves
US6206759B1 (en) * 1998-11-30 2001-03-27 Micron Technology, Inc. Polishing pads and planarizing machines for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies, and methods for making and using such pads and machines
US6217426B1 (en) * 1999-04-06 2001-04-17 Applied Materials, Inc. CMP polishing pad
US6328632B1 (en) * 1999-08-31 2001-12-11 Micron Technology, Inc. Polishing pads and planarizing machines for mechanical and/or chemical-mechanical planarization of microelectronic substrate assemblies
US6238273B1 (en) * 1999-08-31 2001-05-29 Micron Technology, Inc. Methods for predicting polishing parameters of polishing pads and methods and machines for planarizing microelectronic substrate assemblies in mechanical or chemical-mechanical planarization
US6439986B1 (en) * 1999-10-12 2002-08-27 Hunatech Co., Ltd. Conditioner for polishing pad and method for manufacturing the same

Also Published As

Publication number Publication date
DE69903748T2 (de) 2003-07-24
FR2786118A1 (fr) 2000-05-26
WO2000030806A1 (fr) 2000-06-02
DE69903748D1 (de) 2002-12-05
EP1131186A1 (de) 2001-09-12
DK1131186T3 (da) 2003-01-20
FR2786118B1 (fr) 2000-12-22
ATE226868T1 (de) 2002-11-15
US6837780B1 (en) 2005-01-04

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