PL94000B1 - - Google Patents

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Publication number
PL94000B1
PL94000B1 PL1973160307A PL16030773A PL94000B1 PL 94000 B1 PL94000 B1 PL 94000B1 PL 1973160307 A PL1973160307 A PL 1973160307A PL 16030773 A PL16030773 A PL 16030773A PL 94000 B1 PL94000 B1 PL 94000B1
Authority
PL
Poland
Prior art keywords
copper
alkyl
stabilizer
radical
oxygen
Prior art date
Application number
PL1973160307A
Other languages
English (en)
Polish (pl)
Original Assignee
Dynachem Corporation Te Santa Fe Springs Californie Ver St V Am
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dynachem Corporation Te Santa Fe Springs Californie Ver St V Am filed Critical Dynachem Corporation Te Santa Fe Springs Californie Ver St V Am
Publication of PL94000B1 publication Critical patent/PL94000B1/pl

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/38Coating with copper
    • C23C18/40Coating with copper using reducing agents
    • C23C18/405Formaldehyde

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
PL1973160307A 1972-01-17 1973-01-17 PL94000B1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US21845972A 1972-01-17 1972-01-17

Publications (1)

Publication Number Publication Date
PL94000B1 true PL94000B1 (de) 1977-07-30

Family

ID=22815208

Family Applications (1)

Application Number Title Priority Date Filing Date
PL1973160307A PL94000B1 (de) 1972-01-17 1973-01-17

Country Status (23)

Country Link
US (1) US3790392A (de)
JP (1) JPS5519983B2 (de)
AT (1) AT320372B (de)
AU (1) AU464729B2 (de)
BE (1) BE794048A (de)
CH (1) CH599981A5 (de)
DD (1) DD107490A5 (de)
DE (1) DE2300748C3 (de)
DK (1) DK143948C (de)
ES (1) ES410652A1 (de)
FI (1) FI54500C (de)
FR (1) FR2168364B1 (de)
GB (1) GB1414896A (de)
HK (1) HK65076A (de)
IL (1) IL41331A (de)
IT (1) IT980460B (de)
LU (1) LU66834A1 (de)
NL (1) NL177330C (de)
NO (1) NO135188C (de)
PL (1) PL94000B1 (de)
RO (1) RO69172A (de)
SE (1) SE387664B (de)
ZA (1) ZA73328B (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL164906C (nl) * 1975-08-19 1981-02-16 Philips Nv Werkwijze voor de bereiding van een waterig alkalische verkoperbad.
US4666858A (en) * 1984-10-22 1987-05-19 International Business Machines Corporation Determination of amount of anionic material in a liquid sample
US5626736A (en) 1996-01-19 1997-05-06 Shipley Company, L.L.C. Electroplating process
EP2639335B1 (de) * 2012-03-14 2015-09-16 Atotech Deutschland GmbH Alkalisches Plattierbad für stromlose Abscheidung von Kobaltlegierungen
CN103225092A (zh) * 2013-05-22 2013-07-31 南通鑫平制衣有限公司 一种塑料镀铜
JP6176841B2 (ja) * 2013-07-19 2017-08-09 ローム・アンド・ハース電子材料株式会社 無電解銅めっき液
US10060034B2 (en) 2017-01-23 2018-08-28 Rohm And Haas Electronic Materials Llc Electroless copper plating compositions
US10655227B2 (en) 2017-10-06 2020-05-19 Rohm And Haas Electronic Materials Llc Stable electroless copper plating compositions and methods for electroless plating copper on substrates
US10294569B2 (en) 2017-10-06 2019-05-21 Rohm And Haas Electronic Materials Llc Stable electroless copper plating compositions and methods for electroless plating copper on substrates

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1192021B (de) * 1963-01-12 1965-04-29 Dehydag Gmbh Galvanische Baeder
US3457089A (en) * 1967-04-07 1969-07-22 Shipley Co Electroless copperplating
US3635758A (en) * 1969-08-04 1972-01-18 Photocircuits Corp Electroless metal deposition

Also Published As

Publication number Publication date
IT980460B (it) 1974-09-30
AU5076873A (en) 1974-07-11
NO135188C (de) 1977-02-23
DD107490A5 (de) 1974-08-05
FR2168364A1 (de) 1973-08-31
DE2300748C3 (de) 1975-10-30
JPS4999934A (de) 1974-09-20
NL177330C (nl) 1985-09-02
IL41331A (en) 1975-11-25
ZA73328B (en) 1973-10-31
IL41331A0 (en) 1973-03-30
DE2300748A1 (de) 1973-07-26
FR2168364B1 (de) 1975-03-28
JPS5519983B2 (de) 1980-05-30
DE2300748B2 (de) 1975-03-13
FI54500B (fi) 1978-08-31
GB1414896A (en) 1975-11-19
US3790392A (en) 1974-02-05
AU464729B2 (en) 1975-09-04
SE387664B (sv) 1976-09-13
BE794048A (fr) 1973-07-16
DK143948C (da) 1982-04-19
NL7300599A (de) 1973-07-19
CH599981A5 (de) 1978-06-15
NO135188B (de) 1976-11-15
FI54500C (fi) 1978-12-11
ES410652A1 (es) 1976-01-01
LU66834A1 (de) 1973-03-19
HK65076A (en) 1976-10-22
DK143948B (da) 1981-11-02
NL177330B (nl) 1985-04-01
RO69172A (ro) 1980-01-15
AT320372B (de) 1975-02-10

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