PL82569B1 - - Google Patents
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- Publication number
- PL82569B1 PL82569B1 PL1972155413A PL15541372A PL82569B1 PL 82569 B1 PL82569 B1 PL 82569B1 PL 1972155413 A PL1972155413 A PL 1972155413A PL 15541372 A PL15541372 A PL 15541372A PL 82569 B1 PL82569 B1 PL 82569B1
- Authority
- PL
- Poland
- Prior art keywords
- carrier
- rod
- closed
- recess
- pressed
- Prior art date
Links
- 239000000463 material Substances 0.000 claims description 16
- 239000004065 semiconductor Substances 0.000 claims description 13
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 10
- 150000001875 compounds Chemical class 0.000 claims description 6
- 229910002804 graphite Inorganic materials 0.000 claims description 6
- 239000010439 graphite Substances 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 229910052799 carbon Inorganic materials 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 2
- 229910021397 glassy carbon Inorganic materials 0.000 claims description 2
- 210000001061 forehead Anatomy 0.000 claims 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 230000007704 transition Effects 0.000 description 4
- 230000003628 erosive effect Effects 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- 235000012434 pretzels Nutrition 0.000 description 2
- 239000000376 reactant Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910003822 SiHCl3 Inorganic materials 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000012217 deletion Methods 0.000 description 1
- 230000037430 deletion Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/01—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes on temporary substrates, e.g. substrates subsequently removed by etching
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Silicon Compounds (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE2125085A DE2125085C3 (de) | 1971-05-19 | 1971-05-19 | Vorrichtung zum Herstellen von einseitig geschlossenen Rohren aus Halbleitermaterial |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| PL82569B1 true PL82569B1 (enrdf_load_html_response) | 1975-10-31 |
Family
ID=5808445
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PL1972155413A PL82569B1 (enrdf_load_html_response) | 1971-05-19 | 1972-05-16 |
Country Status (16)
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111734950A (zh) * | 2020-07-01 | 2020-10-02 | 西安维国电子科技有限公司 | 密闭空间电绝缘气体填充与回收的方法及填充装置 |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4015922A (en) * | 1970-12-09 | 1977-04-05 | Siemens Aktiengesellschaft | Apparatus for the manufacture of tubular bodies of semiconductor material |
| US3979490A (en) * | 1970-12-09 | 1976-09-07 | Siemens Aktiengesellschaft | Method for the manufacture of tubular bodies of semiconductor material |
| US4034705A (en) * | 1972-05-16 | 1977-07-12 | Siemens Aktiengesellschaft | Shaped bodies and production of semiconductor material |
| US4035460A (en) * | 1972-05-16 | 1977-07-12 | Siemens Aktiengesellschaft | Shaped bodies and production of semiconductor material |
| DE2322952C3 (de) * | 1973-05-07 | 1979-04-19 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Verfahren zum Herstellen von Horden für die Aufnahme von Kristallscheiben bei Diffusions- und Temperprozessen |
| JP2888253B2 (ja) * | 1989-07-20 | 1999-05-10 | 富士通株式会社 | 化学気相成長法およびその実施のための装置 |
| DE69835216T2 (de) | 1997-07-25 | 2007-05-31 | Nichia Corp., Anan | Halbleitervorrichtung aus einer nitridverbindung |
| DE19738234C1 (de) * | 1997-09-02 | 1998-10-22 | Fraunhofer Ges Forschung | Einrichtung zum Aufstäuben von Hartstoffschichten |
| JP3770014B2 (ja) | 1999-02-09 | 2006-04-26 | 日亜化学工業株式会社 | 窒化物半導体素子 |
| US6711191B1 (en) | 1999-03-04 | 2004-03-23 | Nichia Corporation | Nitride semiconductor laser device |
| TWI362769B (en) | 2008-05-09 | 2012-04-21 | Univ Nat Chiao Tung | Light emitting device and fabrication method therefor |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2955566A (en) * | 1957-04-16 | 1960-10-11 | Chilean Nitrate Sales Corp | Dissociation-deposition unit for the production of chromium |
| GB944009A (en) * | 1960-01-04 | 1963-12-11 | Texas Instruments Ltd | Improvements in or relating to the deposition of silicon on a tantalum article |
| US3451772A (en) * | 1967-06-14 | 1969-06-24 | Air Reduction | Production of ultrapure titanium nitride refractory articles |
| US3547530A (en) * | 1968-11-12 | 1970-12-15 | Bell Telephone Labor Inc | Overhead projector |
-
1971
- 1971-05-19 DE DE2125085A patent/DE2125085C3/de not_active Expired
-
1972
- 1972-01-31 BE BE778749A patent/BE778749A/xx not_active IP Right Cessation
- 1972-03-07 NL NL7202997A patent/NL7202997A/xx not_active Application Discontinuation
- 1972-03-07 CH CH329072A patent/CH537214A/de not_active IP Right Cessation
- 1972-03-21 AT AT241272A patent/AT336682B/de active
- 1972-04-07 GB GB1612072A patent/GB1340464A/en not_active Expired
- 1972-05-15 US US00253629A patent/US3747559A/en not_active Expired - Lifetime
- 1972-05-16 PL PL1972155413A patent/PL82569B1/pl unknown
- 1972-05-17 IT IT24456/72A patent/IT955601B/it active
- 1972-05-17 CS CS3363A patent/CS167349B2/cs unknown
- 1972-05-17 DD DD163029A patent/DD96853A5/xx unknown
- 1972-05-18 FR FR727217841A patent/FR2138099B1/fr not_active Expired
- 1972-05-18 CA CA142,467A patent/CA968673A/en not_active Expired
- 1972-05-18 DK DK249772A patent/DK137550C/da active
- 1972-05-19 SE SE06636/72A patent/SE367216B/xx unknown
- 1972-05-19 JP JP4980572A patent/JPS5540528B1/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111734950A (zh) * | 2020-07-01 | 2020-10-02 | 西安维国电子科技有限公司 | 密闭空间电绝缘气体填充与回收的方法及填充装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2138099A1 (enrdf_load_html_response) | 1972-12-29 |
| DE2125085A1 (de) | 1972-12-07 |
| DK137550C (da) | 1978-09-04 |
| DK137550B (da) | 1978-03-20 |
| ATA241272A (de) | 1976-09-15 |
| JPS5540528B1 (enrdf_load_html_response) | 1980-10-18 |
| US3747559A (en) | 1973-07-24 |
| DD96853A5 (enrdf_load_html_response) | 1973-04-12 |
| FR2138099B1 (enrdf_load_html_response) | 1974-07-26 |
| NL7202997A (enrdf_load_html_response) | 1972-11-21 |
| DE2125085B2 (de) | 1978-06-29 |
| SE367216B (enrdf_load_html_response) | 1974-05-20 |
| GB1340464A (en) | 1973-12-12 |
| DE2125085C3 (de) | 1979-02-22 |
| AT336682B (de) | 1977-05-25 |
| CA968673A (en) | 1975-06-03 |
| CS167349B2 (enrdf_load_html_response) | 1976-04-29 |
| BE778749A (fr) | 1972-05-16 |
| CH537214A (de) | 1973-05-31 |
| IT955601B (it) | 1973-09-29 |
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