PL3768654T3 - Podłoże miedziano-ceramiczne - Google Patents

Podłoże miedziano-ceramiczne

Info

Publication number
PL3768654T3
PL3768654T3 PL18713175.0T PL18713175T PL3768654T3 PL 3768654 T3 PL3768654 T3 PL 3768654T3 PL 18713175 T PL18713175 T PL 18713175T PL 3768654 T3 PL3768654 T3 PL 3768654T3
Authority
PL
Poland
Prior art keywords
copper
ceramic substrate
ceramic
substrate
Prior art date
Application number
PL18713175.0T
Other languages
English (en)
Inventor
Helge Lehmann
Karl Zeiger
Benjamin Cappi
Original Assignee
Aurubis Stolberg Gmbh & Co. Kg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aurubis Stolberg Gmbh & Co. Kg filed Critical Aurubis Stolberg Gmbh & Co. Kg
Publication of PL3768654T3 publication Critical patent/PL3768654T3/pl

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C04B37/021Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles in a direct manner, e.g. direct copper bonding [DCB]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3731Ceramic materials or glass
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736Metallic materials
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/70Aspects relating to sintered or melt-casted ceramic products
    • C04B2235/72Products characterised by the absence or the low content of specific components, e.g. alkali metal free alumina ceramics
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    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/70Aspects relating to sintered or melt-casted ceramic products
    • C04B2235/72Products characterised by the absence or the low content of specific components, e.g. alkali metal free alumina ceramics
    • C04B2235/723Oxygen content
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/70Aspects relating to sintered or melt-casted ceramic products
    • C04B2235/72Products characterised by the absence or the low content of specific components, e.g. alkali metal free alumina ceramics
    • C04B2235/725Metal content
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    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/70Aspects relating to sintered or melt-casted ceramic products
    • C04B2235/72Products characterised by the absence or the low content of specific components, e.g. alkali metal free alumina ceramics
    • C04B2235/726Sulfur content
    • CCHEMISTRY; METALLURGY
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    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/70Aspects relating to sintered or melt-casted ceramic products
    • C04B2235/72Products characterised by the absence or the low content of specific components, e.g. alkali metal free alumina ceramics
    • C04B2235/727Phosphorus or phosphorus compound content
    • CCHEMISTRY; METALLURGY
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    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/70Aspects relating to sintered or melt-casted ceramic products
    • C04B2235/74Physical characteristics
    • C04B2235/78Grain sizes and shapes, product microstructures, e.g. acicular grains, equiaxed grains, platelet-structures
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    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/70Aspects relating to sintered or melt-casted ceramic products
    • C04B2235/74Physical characteristics
    • C04B2235/78Grain sizes and shapes, product microstructures, e.g. acicular grains, equiaxed grains, platelet-structures
    • C04B2235/782Grain size distributions
    • C04B2235/784Monomodal
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    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/70Aspects relating to sintered or melt-casted ceramic products
    • C04B2235/74Physical characteristics
    • C04B2235/78Grain sizes and shapes, product microstructures, e.g. acicular grains, equiaxed grains, platelet-structures
    • C04B2235/786Micrometer sized grains, i.e. from 1 to 100 micron
    • CCHEMISTRY; METALLURGY
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    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/70Aspects relating to sintered or melt-casted ceramic products
    • C04B2235/96Properties of ceramic products, e.g. mechanical properties such as strength, toughness, wear resistance
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32Ceramic
    • C04B2237/34Oxidic
    • CCHEMISTRY; METALLURGY
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    • C04B2237/00Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32Ceramic
    • C04B2237/34Oxidic
    • C04B2237/341Silica or silicates
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    • C04B2237/00Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32Ceramic
    • C04B2237/34Oxidic
    • C04B2237/343Alumina or aluminates
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
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    • C04B2237/00Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32Ceramic
    • C04B2237/34Oxidic
    • C04B2237/345Refractory metal oxides
    • C04B2237/346Titania or titanates
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    • C04B2237/00Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32Ceramic
    • C04B2237/34Oxidic
    • C04B2237/345Refractory metal oxides
    • C04B2237/348Zirconia, hafnia, zirconates or hafnates
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    • C04B2237/00Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32Ceramic
    • C04B2237/36Non-oxidic
    • C04B2237/366Aluminium nitride
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    • C04B2237/00Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32Ceramic
    • C04B2237/36Non-oxidic
    • C04B2237/368Silicon nitride
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    • C04B2237/00Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/40Metallic
    • C04B2237/407Copper
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    • C04B2237/00Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/70Forming laminates or joined articles comprising layers of a specific, unusual thickness
    • C04B2237/706Forming laminates or joined articles comprising layers of a specific, unusual thickness of one or more of the metallic layers or articles

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Organic Chemistry (AREA)
  • Structural Engineering (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Ceramic Products (AREA)
  • Laminated Bodies (AREA)
PL18713175.0T 2018-03-20 2018-03-20 Podłoże miedziano-ceramiczne PL3768654T3 (pl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
PCT/EP2018/056957 WO2019179600A1 (de) 2018-03-20 2018-03-20 Kupfer-keramik-substrat
EP18713175.0A EP3768654B1 (de) 2018-03-20 2018-03-20 Kupfer-keramik-substrat

Publications (1)

Publication Number Publication Date
PL3768654T3 true PL3768654T3 (pl) 2022-07-25

Family

ID=61768281

Family Applications (1)

Application Number Title Priority Date Filing Date
PL18713175.0T PL3768654T3 (pl) 2018-03-20 2018-03-20 Podłoże miedziano-ceramiczne

Country Status (9)

Country Link
US (1) US20210002179A1 (pl)
EP (1) EP3768654B1 (pl)
JP (1) JP2021518669A (pl)
KR (1) KR102514960B1 (pl)
CN (1) CN111886214A (pl)
ES (1) ES2917407T3 (pl)
HU (1) HUE058955T2 (pl)
PL (1) PL3768654T3 (pl)
WO (1) WO2019179600A1 (pl)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102020213729A1 (de) 2020-11-02 2022-05-05 Aurubis Stolberg Gmbh & Co. Kg Kupfer-Keramik-Substrat
JP2023134292A (ja) * 2022-03-14 2023-09-27 Dowaメタルテック株式会社 銅-セラミックス接合基板およびその製造方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62282797A (ja) * 1986-05-29 1987-12-08 Dowa Mining Co Ltd セラミツクス−銅直接接合用銅材
JPH062058A (ja) * 1992-06-23 1994-01-11 Furukawa Electric Co Ltd:The 結晶粒成長抑制無酸素銅
JP3211856B2 (ja) * 1994-11-02 2001-09-25 電気化学工業株式会社 回路基板
JP3856581B2 (ja) * 1999-01-18 2006-12-13 日鉱金属株式会社 フレキシブルプリント回路基板用圧延銅箔およびその製造方法
JP4206915B2 (ja) * 2002-12-27 2009-01-14 三菱マテリアル株式会社 パワーモジュール用基板
JP2006237383A (ja) * 2005-02-25 2006-09-07 Hitachi Metals Ltd セラミックス回路基板および半導体モジュール
JP5186719B2 (ja) 2005-08-29 2013-04-24 日立金属株式会社 セラミックス配線基板、その製造方法及び半導体モジュール
CN103080347A (zh) * 2010-08-27 2013-05-01 古河电气工业株式会社 铜合金板材及其制造方法
KR101548091B1 (ko) * 2011-07-28 2015-08-27 가부시끼가이샤 도시바 산화물계 세라믹스 회로 기판의 제조 방법 및 산화물계 세라믹스 회로 기판
CN105132735A (zh) * 2015-08-22 2015-12-09 汕头市骏码凯撒有限公司 一种微电子封装用超细铜合金键合丝及其制备方法
JP6734033B2 (ja) * 2015-10-16 2020-08-05 株式会社Shカッパープロダクツ 無酸素銅板、無酸素銅板の製造方法およびセラミック配線基板
DE102015224464A1 (de) 2015-12-07 2017-06-08 Aurubis Stolberg Gmbh & Co. Kg Kupfer-Keramik-Substrat, Kupferhalbzeug zur Herstellung eines Kupfer-Keramik-Substrats und Verfahren zur Herstellung eines Kupfer-Keramik-Substrats
EP3210956B1 (de) * 2016-02-26 2018-04-11 Heraeus Deutschland GmbH & Co. KG Kupfer-keramik-verbund
EP3263537B1 (de) * 2016-06-27 2021-09-22 Infineon Technologies AG Verfahren zur herstellung eines metall-keramik-substrats
JP6744174B2 (ja) * 2016-08-12 2020-08-19 株式会社Shカッパープロダクツ 無酸素銅板、無酸素銅板の製造方法およびセラミック配線基板

Also Published As

Publication number Publication date
JP2021518669A (ja) 2021-08-02
CN111886214A (zh) 2020-11-03
KR20200134258A (ko) 2020-12-01
WO2019179600A1 (de) 2019-09-26
KR102514960B1 (ko) 2023-03-30
US20210002179A1 (en) 2021-01-07
EP3768654B1 (de) 2022-04-20
HUE058955T2 (hu) 2022-10-28
ES2917407T3 (es) 2022-07-08
EP3768654A1 (de) 2021-01-27

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