PL374021A1 - Kompozycje do czyszczenia elementów mikroelektronicznych i zmywania powłok przeciwodblaskowych - Google Patents

Kompozycje do czyszczenia elementów mikroelektronicznych i zmywania powłok przeciwodblaskowych

Info

Publication number
PL374021A1
PL374021A1 PL03374021A PL37402103A PL374021A1 PL 374021 A1 PL374021 A1 PL 374021A1 PL 03374021 A PL03374021 A PL 03374021A PL 37402103 A PL37402103 A PL 37402103A PL 374021 A1 PL374021 A1 PL 374021A1
Authority
PL
Poland
Prior art keywords
remover compositions
microelectronic cleaning
arc remover
arc
microelectronic
Prior art date
Application number
PL03374021A
Other languages
English (en)
Other versions
PL207297B1 (pl
Inventor
Chien-Pin Sherman Hsu
Original Assignee
Mallinckrodt Baker Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mallinckrodt Baker Inc filed Critical Mallinckrodt Baker Inc
Publication of PL374021A1 publication Critical patent/PL374021A1/pl
Publication of PL207297B1 publication Critical patent/PL207297B1/pl

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/32—Liquid compositions therefor, e.g. developers
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
    • C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions
    • C23G1/04—Cleaning or pickling metallic material with solutions or molten salts with acid solutions using inhibitors
    • C23G1/06—Cleaning or pickling metallic material with solutions or molten salts with acid solutions using inhibitors organic inhibitors
    • C23G1/061—Cleaning or pickling metallic material with solutions or molten salts with acid solutions using inhibitors organic inhibitors nitrogen-containing compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • G03F7/425—Stripping or agents therefor using liquids only containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/26—Cleaning or polishing of the conductive pattern
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/121—Metallo-organic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax or thiol

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Detergent Compositions (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
PL374021A 2002-06-07 2003-05-27 Bezkrzemianowa kompozycja czyszcząca i zastosowanie bezkrzemianowej kompozycji czyszczącej PL207297B1 (pl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US38680002P 2002-06-07 2002-06-07
US40168802P 2002-08-07 2002-08-07

Publications (2)

Publication Number Publication Date
PL374021A1 true PL374021A1 (pl) 2005-09-19
PL207297B1 PL207297B1 (pl) 2010-11-30

Family

ID=29739917

Family Applications (1)

Application Number Title Priority Date Filing Date
PL374021A PL207297B1 (pl) 2002-06-07 2003-05-27 Bezkrzemianowa kompozycja czyszcząca i zastosowanie bezkrzemianowej kompozycji czyszczącej

Country Status (17)

Country Link
US (1) US8906838B2 (pl)
EP (1) EP1512050A2 (pl)
JP (1) JP4330529B2 (pl)
KR (1) KR100958068B1 (pl)
CN (2) CN1659480A (pl)
AU (1) AU2003240827A1 (pl)
BR (1) BR0311830A (pl)
CA (1) CA2488737A1 (pl)
IL (1) IL165581A (pl)
IN (2) IN2004CH02744A (pl)
MY (1) MY142745A (pl)
NO (1) NO20050075L (pl)
PL (1) PL207297B1 (pl)
RS (1) RS106104A (pl)
TW (1) TWI330766B (pl)
WO (1) WO2003104901A2 (pl)
ZA (1) ZA200409622B (pl)

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7208049B2 (en) * 2003-10-20 2007-04-24 Air Products And Chemicals, Inc. Process solutions containing surfactants used as post-chemical mechanical planarization treatment
CN101833251B (zh) * 2004-02-11 2013-11-13 安万托特性材料股份有限公司 含有卤素含氧酸、其盐及其衍生物的微电子清洗组合物及清洗方法
US8338087B2 (en) * 2004-03-03 2012-12-25 Advanced Technology Materials, Inc Composition and process for post-etch removal of photoresist and/or sacrificial anti-reflective material deposited on a substrate
US7867779B2 (en) 2005-02-03 2011-01-11 Air Products And Chemicals, Inc. System and method comprising same for measurement and/or analysis of particles in gas stream
US7923424B2 (en) * 2005-02-14 2011-04-12 Advanced Process Technologies, Llc Semiconductor cleaning using superacids
SG161211A1 (en) * 2005-04-04 2010-05-27 Mallinckrodt Baker Inc Compositions for cleaning ion implanted photoresist in front end of line applications
TWI408212B (zh) 2005-06-07 2013-09-11 Advanced Tech Materials 金屬及介電相容犧牲抗反射塗層清洗及移除組成物
KR101152139B1 (ko) 2005-12-06 2012-06-15 삼성전자주식회사 표시 장치용 세정제 및 이를 사용하는 박막 트랜지스터표시판의 제조 방법
KR101349491B1 (ko) * 2005-12-20 2014-01-08 미츠비시 가스 가가쿠 가부시키가이샤 배선 기판의 잔사 제거용 조성물 및 세정 방법
US20080149884A1 (en) * 2006-12-21 2008-06-26 Junaid Ahmed Siddiqui Method and slurry for tuning low-k versus copper removal rates during chemical mechanical polishing
US20100163788A1 (en) * 2006-12-21 2010-07-01 Advanced Technology Materials, Inc. Liquid cleaner for the removal of post-etch residues
US8110508B2 (en) * 2007-11-22 2012-02-07 Samsung Electronics Co., Ltd. Method of forming a bump structure using an etching composition for an under bump metallurgy layer
CN101487993A (zh) * 2008-01-18 2009-07-22 安集微电子（上海）有限公司 一种厚膜光刻胶清洗剂
KR101570256B1 (ko) * 2008-02-29 2015-11-18 아반토르 퍼포먼스 머티리얼스, 인크. 마이크로전자 기재 세정용 조성물
JP2009231354A (ja) * 2008-03-19 2009-10-08 Fujifilm Corp 半導体デバイス用洗浄液、および洗浄方法
CN101359189B (zh) * 2008-09-17 2011-04-27 电子科技大学 正性光敏聚酰亚胺光刻胶用显影液
CN102282682B (zh) * 2009-01-14 2016-07-06 安万托特性材料有限公司 增加晶片薄层电阻和/或光电池功率密度水平的溶液
AU2010218426A1 (en) * 2009-02-25 2011-10-20 Avantor Performance Materials, Inc. Multipurpose acidic, organic solvent based microelectronic cleaning composition
AU2010218275A1 (en) * 2009-02-25 2011-10-20 Avantor Performance Materials, Inc. Stripping compositions for cleaning ion implanted photoresist from semiconductor device wafers
US8754021B2 (en) 2009-02-27 2014-06-17 Advanced Technology Materials, Inc. Non-amine post-CMP composition and method of use
CN101901782B (zh) * 2010-07-21 2011-12-14 河北工业大学 极大规模集成电路多层布线碱性抛光后防氧化方法
CN101901784B (zh) * 2010-07-21 2012-05-30 河北工业大学 钽化学机械抛光工序中的表面清洗方法
EP2768920A4 (en) * 2011-10-21 2015-06-03 Advanced Tech Materials AMIN FREE POST-KMP COMPOSITION AND METHOD OF USE THEREOF
CN103809394B (zh) * 2012-11-12 2019-12-31 安集微电子科技（上海）股份有限公司 一种去除光阻蚀刻残留物的清洗液
US9460934B2 (en) 2013-03-15 2016-10-04 Globalfoundries Inc. Wet strip process for an antireflective coating layer
SG11201603122XA (en) 2013-10-21 2016-05-30 Fujifilm Electronic Materials Cleaning formulations for removing residues on surfaces
JP2015108041A (ja) * 2013-12-03 2015-06-11 ダイキン工業株式会社 洗浄用組成物
CN105873691B (zh) 2013-12-06 2018-04-20 富士胶片电子材料美国有限公司 用于去除表面上的残余物的清洗调配物
EP3093875A4 (en) 2014-04-10 2017-03-08 Mitsubishi Gas Chemical Company, Inc. Liquid composition for semiconductor element cleaning and method for cleaning semiconductor element
US9570285B2 (en) * 2015-04-17 2017-02-14 Taiwan Semiconductor Manufacturing Company, Ltd. Cleaning composition and methods thereof
TWI705132B (zh) 2015-10-08 2020-09-21 日商三菱瓦斯化學股份有限公司 半導體元件之洗淨用液體組成物、半導體元件之洗淨方法及半導體元件之製造方法
TWI816635B (zh) 2015-10-15 2023-10-01 日商三菱瓦斯化學股份有限公司 半導體元件之洗淨用液體組成物、半導體元件之洗淨方法及半導體元件之製造方法
US10988718B2 (en) 2016-03-09 2021-04-27 Entegris, Inc. Tungsten post-CMP cleaning composition
CN107313055A (zh) * 2017-07-19 2017-11-03 马爱连 一种金属油污清洗剂及其制备方法和使用方法
CN111902569B (zh) * 2018-03-26 2022-03-29 三菱瓦斯化学株式会社 蚀刻液
EP3774680A4 (en) 2018-03-28 2021-05-19 FUJIFILM Electronic Materials U.S.A, Inc. CLEANING COMPOSITIONS
JPWO2022163350A1 (pl) * 2021-01-29 2022-08-04

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3673099A (en) * 1970-10-19 1972-06-27 Bell Telephone Labor Inc Process and composition for stripping cured resins from substrates
US4744834A (en) * 1986-04-30 1988-05-17 Noor Haq Photoresist stripper comprising a pyrrolidinone, a diethylene glycol ether, a polyglycol and a quaternary ammonium hydroxide
US5037724A (en) 1988-02-25 1991-08-06 Hoya Corporation Peeling solution for photo- or electron beam-sensitive resin
US6492311B2 (en) * 1990-11-05 2002-12-10 Ekc Technology, Inc. Ethyenediaminetetraacetic acid or its ammonium salt semiconductor process residue removal composition and process
US5308745A (en) 1992-11-06 1994-05-03 J. T. Baker Inc. Alkaline-containing photoresist stripping compositions producing reduced metal corrosion with cross-linked or hardened resist resins
US5561105A (en) * 1995-05-08 1996-10-01 Ocg Microelectronic Materials, Inc. Chelating reagent containing photoresist stripper composition
JPH1055993A (ja) * 1996-08-09 1998-02-24 Hitachi Ltd 半導体素子製造用洗浄液及びそれを用いた半導体素子の製造方法
JPH1116882A (ja) * 1997-06-19 1999-01-22 Toray Fine Chem Co Ltd フォトレジスト剥離用組成物
JPH1167632A (ja) * 1997-08-18 1999-03-09 Mitsubishi Gas Chem Co Inc 半導体装置用洗浄剤
JPH11323394A (ja) * 1998-05-14 1999-11-26 Texas Instr Japan Ltd 半導体素子製造用洗浄剤及びそれを用いた半導体素子の製造方法
JP3606738B2 (ja) * 1998-06-05 2005-01-05 東京応化工業株式会社 アッシング後の処理液およびこれを用いた処理方法
JP4224652B2 (ja) * 1999-03-08 2009-02-18 三菱瓦斯化学株式会社 レジスト剥離液およびそれを用いたレジストの剥離方法
US6531436B1 (en) * 2000-02-25 2003-03-11 Shipley Company, L.L.C. Polymer removal
US6475966B1 (en) * 2000-02-25 2002-11-05 Shipley Company, L.L.C. Plasma etching residue removal
MY129673A (en) * 2000-03-20 2007-04-30 Avantor Performance Mat Inc Method and composition for removing sodium-containing material from microcircuit substrates
US6274296B1 (en) * 2000-06-08 2001-08-14 Shipley Company, L.L.C. Stripper pretreatment
US6455479B1 (en) * 2000-08-03 2002-09-24 Shipley Company, L.L.C. Stripping composition
US6599370B2 (en) 2000-10-16 2003-07-29 Mallinckrodt Inc. Stabilized alkaline compositions for cleaning microelectronic substrates
US6773873B2 (en) * 2002-03-25 2004-08-10 Advanced Technology Materials, Inc. pH buffered compositions useful for cleaning residue from semiconductor substrates

Also Published As

Publication number Publication date
JP2005529363A (ja) 2005-09-29
PL207297B1 (pl) 2010-11-30
IN2004CH02762A (pl) 2006-02-10
US20050176602A1 (en) 2005-08-11
ZA200409622B (en) 2006-05-31
JP4330529B2 (ja) 2009-09-16
AU2003240827A8 (en) 2003-12-22
RS106104A (en) 2007-04-10
CA2488737A1 (en) 2003-12-18
CN1659480A (zh) 2005-08-24
CN102135735A (zh) 2011-07-27
TW200401958A (en) 2004-02-01
IL165581A0 (en) 2006-01-15
WO2003104901A2 (en) 2003-12-18
BR0311830A (pt) 2005-03-29
AU2003240827A1 (en) 2003-12-22
KR100958068B1 (ko) 2010-05-14
MY142745A (en) 2010-12-31
KR20050012770A (ko) 2005-02-02
IN2004CH02744A (pl) 2006-02-10
EP1512050A2 (en) 2005-03-09
NO20050075L (no) 2005-01-06
TWI330766B (en) 2010-09-21
US8906838B2 (en) 2014-12-09
IL165581A (en) 2009-06-15
WO2003104901A3 (en) 2004-03-18

Similar Documents

Publication Publication Date Title
PL374021A1 (pl) Kompozycje do czyszczenia elementów mikroelektronicznych i zmywania powłok przeciwodblaskowych
AU2003231107A8 (en) Detergent compositions and components thereof
SG105010A1 (en) Cleaning composition
TWI340652B (en) Detergent compositions
GB0228584D0 (en) Detergent compositions
AU2003240963A1 (en) Cleaning compositions
EP1447440A4 (en) CLEANING SUPPLIES
EP1516914A4 (en) DETERGENT COMPOSITIONS
TWI320516B (en) Photoresist residue remover composition
SG118216A1 (en) Stripping and cleaning compositions for microelectronics
EP1556129A4 (en) COMPOSITIONS AND METHODS FOR INDUCING OSTEOGENESIS
GB0221739D0 (en) Detergent compositions
AU2003224306A1 (en) Cleaning and disinfecting compositions
GB0206333D0 (en) Peersonal cleaning composition
PL373862A1 (pl) Kompozycja do depilacji
GB0221735D0 (en) Detergent compositions
GB0300656D0 (en) Detergent compositions
AU2003222983A1 (en) Cleaning and disinfecting compositions
GB2386603B (en) Personal cleaning composition
GB0221738D0 (en) Detergent compositions
EP1574562A4 (en) DETERGENT COMPOSITIONS
TWI350308B (en) Thickener for detergent and cleaning composition comprising thereof
GB0119293D0 (en) Solid cleaning compositions
GB0111131D0 (en) Cleaning composition
GB0127281D0 (en) Cleaning composition

Legal Events

Date Code Title Description
LAPS Decisions on the lapse of the protection rights

Effective date: 20120527