PL363757A1 - Układ napełnionej żywicy epoksydowej o wysokich wartościach wytrzymałości mechanicznej - Google Patents
Układ napełnionej żywicy epoksydowej o wysokich wartościach wytrzymałości mechanicznejInfo
- Publication number
- PL363757A1 PL363757A1 PL01363757A PL36375701A PL363757A1 PL 363757 A1 PL363757 A1 PL 363757A1 PL 01363757 A PL01363757 A PL 01363757A PL 36375701 A PL36375701 A PL 36375701A PL 363757 A1 PL363757 A1 PL 363757A1
- Authority
- PL
- Poland
- Prior art keywords
- epoxy resin
- mechanical strength
- high mechanical
- resin system
- strength values
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/52—Phosphorus bound to oxygen only
- C08K5/521—Esters of phosphoric acids, e.g. of H3PO4
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Catalysts (AREA)
- Inert Electrodes (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH23162000 | 2000-11-29 | ||
PCT/EP2001/013431 WO2002044273A1 (en) | 2000-11-29 | 2001-11-20 | Filled epoxy resin system having high mechanical strength values |
Publications (1)
Publication Number | Publication Date |
---|---|
PL363757A1 true PL363757A1 (pl) | 2004-11-29 |
Family
ID=4568541
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PL01363757A PL363757A1 (pl) | 2000-11-29 | 2001-11-20 | Układ napełnionej żywicy epoksydowej o wysokich wartościach wytrzymałości mechanicznej |
Country Status (13)
Country | Link |
---|---|
US (1) | US20040039084A1 (pl) |
EP (1) | EP1352026B1 (pl) |
JP (1) | JP4002831B2 (pl) |
KR (1) | KR100849946B1 (pl) |
CN (1) | CN1205265C (pl) |
AT (1) | ATE271584T1 (pl) |
AU (1) | AU2002220717A1 (pl) |
CA (1) | CA2430074A1 (pl) |
CZ (1) | CZ20031466A3 (pl) |
DE (1) | DE60104449T2 (pl) |
ES (1) | ES2223963T3 (pl) |
PL (1) | PL363757A1 (pl) |
WO (1) | WO2002044273A1 (pl) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2004039856A1 (ja) * | 2002-10-31 | 2004-05-13 | Kyoeisha Chemical Co.,Ltd. | 樹脂組成物、転写材及び成型品の製造方法 |
DE10318836A1 (de) * | 2003-04-25 | 2004-11-11 | Voith Paper Patent Gmbh | Verfahren zur Beschichtung eines zylindrischen Körpers |
KR100780582B1 (ko) * | 2003-06-09 | 2007-11-29 | 카네카 코포레이션 | 변성 에폭시 수지의 제조방법 |
US7429604B2 (en) | 2004-06-15 | 2008-09-30 | Bristol Myers Squibb Company | Six-membered heterocycles useful as serine protease inhibitors |
EP1754733A1 (en) * | 2005-07-26 | 2007-02-21 | Huntsman Advanced Materials (Switzerland) GmbH | Composition |
EP1920005B1 (en) * | 2005-08-24 | 2011-11-23 | Henkel AG & Co. KGaA | Epoxy compositions having improved impact resistance |
ES2691528T3 (es) | 2006-07-31 | 2018-11-27 | Henkel Ag & Co. Kgaa | Composiciones adhesivas basadas en resina epoxi curable |
CA2665551A1 (en) * | 2006-10-06 | 2008-04-17 | Henkel Ag & Co. Kgaa | Pumpable epoxy paste adhesives resistant to wash-off |
WO2009058295A2 (en) * | 2007-10-30 | 2009-05-07 | Henkel Ag & Co. Kgaa | Epoxy paste adhesives resistant to wash-off |
DE102007062035A1 (de) | 2007-12-21 | 2009-06-25 | Robert Bosch Gmbh | Reaktionsharzsystem |
US20110003946A1 (en) * | 2008-01-18 | 2011-01-06 | Klaus-Volker Schuett | Curable reaction resin system |
DE102008025541A1 (de) | 2008-05-27 | 2009-12-17 | Hexion Specialty Chemicals Gmbh | Verfahren zum Herstellen eines rissfestem Gießharztransformators und rissfester Gießharztransformator |
CN102323217A (zh) * | 2011-10-09 | 2012-01-18 | 重庆市电力公司电力科学研究院 | Gis开关内气体含量全息检测装置及方法 |
KR101401640B1 (ko) | 2012-06-14 | 2014-06-02 | 주식회사 이피케미칼 | 실리카와 코어-쉘 고분자 입자를 함유하는 에폭시 수지 조성물 |
US10287387B2 (en) | 2014-09-11 | 2019-05-14 | Kaneka Corporation | Epoxy resin composition for casting |
PL3275002T5 (pl) * | 2015-03-26 | 2023-06-19 | Huntsman Advanced Materials Licensing (Switzerland) Gmbh | Sposób wytwarzania systemów izolacyjnych dla elektrotechniki i ich zastosowanie |
DE102016205386A1 (de) | 2016-03-31 | 2017-10-05 | Robert Bosch Gmbh | Härtbare Epoxidharz-Gießmasse |
JP6897041B2 (ja) * | 2016-09-23 | 2021-06-30 | 昭和電工マテリアルズ株式会社 | 配線板用樹脂組成物、プリプレグ、積層板及び配線板 |
CN116162325A (zh) | 2017-12-27 | 2023-05-26 | 3M创新有限公司 | 适用于电子器件外罩的固化环氧树脂组合物、制品和方法 |
DE102018214641B4 (de) * | 2018-08-29 | 2022-09-22 | Robert Bosch Gmbh | Vergussmasse, Verfahren zum elektrischen Isolieren eines elektrischen oder elektronischen Bauteils unter Verwendung der Vergussmasse, elektrisch isoliertes Bauteil, hergestellt über ein solches Verfahren und Verwendung der Vergussmasse |
CN114364738A (zh) * | 2019-11-08 | 2022-04-15 | 电化株式会社 | 绝缘性树脂组合物、绝缘性树脂固化物、层合体及电路基板 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ES2151949T3 (es) * | 1994-12-13 | 2001-01-16 | Ciba Sc Holding Ag | Masas de colada endurecibles, a base de resina epoxi, que contienen un promotor de tenacidad del tipo nucleo/envoltura. |
DE59609259D1 (de) * | 1995-11-29 | 2002-07-04 | Vantico Ag | Core/Shell-Partikel und diese enthaltende härtbare Epoxidharzzusammensetzungen |
ES2276676T3 (es) * | 1999-03-16 | 2007-07-01 | Huntsman Advanced Materials (Switzerland) Gmbh | Composicion endurecible con combinacion especial de propiedades. |
-
2001
- 2001-11-20 AT AT01998594T patent/ATE271584T1/de not_active IP Right Cessation
- 2001-11-20 PL PL01363757A patent/PL363757A1/pl not_active Application Discontinuation
- 2001-11-20 CA CA002430074A patent/CA2430074A1/en not_active Abandoned
- 2001-11-20 US US10/433,137 patent/US20040039084A1/en not_active Abandoned
- 2001-11-20 JP JP2002546628A patent/JP4002831B2/ja not_active Expired - Fee Related
- 2001-11-20 CN CNB018196519A patent/CN1205265C/zh not_active Expired - Lifetime
- 2001-11-20 WO PCT/EP2001/013431 patent/WO2002044273A1/en not_active Application Discontinuation
- 2001-11-20 EP EP01998594A patent/EP1352026B1/en not_active Expired - Lifetime
- 2001-11-20 CZ CZ20031466A patent/CZ20031466A3/cs unknown
- 2001-11-20 AU AU2002220717A patent/AU2002220717A1/en not_active Abandoned
- 2001-11-20 ES ES01998594T patent/ES2223963T3/es not_active Expired - Lifetime
- 2001-11-20 KR KR1020037005551A patent/KR100849946B1/ko active IP Right Grant
- 2001-11-20 DE DE60104449T patent/DE60104449T2/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
CN1478127A (zh) | 2004-02-25 |
KR100849946B1 (ko) | 2008-08-01 |
JP4002831B2 (ja) | 2007-11-07 |
EP1352026B1 (en) | 2004-07-21 |
JP2004522816A (ja) | 2004-07-29 |
US20040039084A1 (en) | 2004-02-26 |
DE60104449D1 (de) | 2004-08-26 |
ATE271584T1 (de) | 2004-08-15 |
WO2002044273A1 (en) | 2002-06-06 |
DE60104449T2 (de) | 2005-07-28 |
AU2002220717A1 (en) | 2002-06-11 |
ES2223963T3 (es) | 2005-03-01 |
CN1205265C (zh) | 2005-06-08 |
CA2430074A1 (en) | 2002-06-06 |
KR20030060916A (ko) | 2003-07-16 |
EP1352026A1 (en) | 2003-10-15 |
CZ20031466A3 (cs) | 2003-08-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
REFS | Decisions on refusal to grant patents (taken after the publication of the particulars of the applications) |