AU2002220717A1 - Filled epoxy resin system having high mechanical strength values - Google Patents
Filled epoxy resin system having high mechanical strength valuesInfo
- Publication number
- AU2002220717A1 AU2002220717A1 AU2002220717A AU2071702A AU2002220717A1 AU 2002220717 A1 AU2002220717 A1 AU 2002220717A1 AU 2002220717 A AU2002220717 A AU 2002220717A AU 2071702 A AU2071702 A AU 2071702A AU 2002220717 A1 AU2002220717 A1 AU 2002220717A1
- Authority
- AU
- Australia
- Prior art keywords
- epoxy resin
- mechanical strength
- high mechanical
- resin system
- strength values
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/52—Phosphorus bound to oxygen only
- C08K5/521—Esters of phosphoric acids, e.g. of H3PO4
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
Abstract
The invention relates to a method for deposition of a catalyst, in particular a method for coating a membrane electrode unit (MEA) for a fuel cell. Said method requires no external electrical field as usual for conventional galvanic techniques. The support for the catalytic layer is first capacitively charged (pseudocapacitance). When brought into contact with an electrolyte solution, comprising the catalyst in the form of dissolved metal salt ions, an in-situ reduction (deposition) of the metal salt ions to give metallic catalyst occurs at the site of contact.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH23162000 | 2000-11-29 | ||
CH2316/00 | 2000-11-29 | ||
PCT/EP2001/013431 WO2002044273A1 (en) | 2000-11-29 | 2001-11-20 | Filled epoxy resin system having high mechanical strength values |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2002220717A1 true AU2002220717A1 (en) | 2002-06-11 |
Family
ID=4568541
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2002220717A Abandoned AU2002220717A1 (en) | 2000-11-29 | 2001-11-20 | Filled epoxy resin system having high mechanical strength values |
Country Status (13)
Country | Link |
---|---|
US (1) | US20040039084A1 (en) |
EP (1) | EP1352026B1 (en) |
JP (1) | JP4002831B2 (en) |
KR (1) | KR100849946B1 (en) |
CN (1) | CN1205265C (en) |
AT (1) | ATE271584T1 (en) |
AU (1) | AU2002220717A1 (en) |
CA (1) | CA2430074A1 (en) |
CZ (1) | CZ20031466A3 (en) |
DE (1) | DE60104449T2 (en) |
ES (1) | ES2223963T3 (en) |
PL (1) | PL363757A1 (en) |
WO (1) | WO2002044273A1 (en) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1330680C (en) * | 2002-10-31 | 2007-08-08 | 共荣社化学株式会社 | Resin composition, transfer material and process for producing shaped item |
DE10318836A1 (en) * | 2003-04-25 | 2004-11-11 | Voith Paper Patent Gmbh | Process for coating a cylindrical body |
JP4668788B2 (en) * | 2003-06-09 | 2011-04-13 | 株式会社カネカ | Method for producing modified epoxy resin |
US7429604B2 (en) | 2004-06-15 | 2008-09-30 | Bristol Myers Squibb Company | Six-membered heterocycles useful as serine protease inhibitors |
EP1754733A1 (en) * | 2005-07-26 | 2007-02-21 | Huntsman Advanced Materials (Switzerland) GmbH | Composition |
CN101287794A (en) * | 2005-08-24 | 2008-10-15 | 亨克尔两合股份公司 | Epoxy compositions having improved impact resistance |
ES2691528T3 (en) | 2006-07-31 | 2018-11-27 | Henkel Ag & Co. Kgaa | Adhesive compositions based on curable epoxy resin |
KR20090080956A (en) * | 2006-10-06 | 2009-07-27 | 헨켈 아게 운트 코. 카게아아 | Pumpable epoxy paste adhesives resistant to wash-off |
WO2009058295A2 (en) * | 2007-10-30 | 2009-05-07 | Henkel Ag & Co. Kgaa | Epoxy paste adhesives resistant to wash-off |
DE102007062035A1 (en) | 2007-12-21 | 2009-06-25 | Robert Bosch Gmbh | Reactive resin system useful for encapsulating electronic or electrical components comprises an epoxy resin based on a monomer with three epoxy groups and an epoxy resin based on a monomer with at least four epoxy groups |
US20110003946A1 (en) * | 2008-01-18 | 2011-01-06 | Klaus-Volker Schuett | Curable reaction resin system |
DE102008025541A1 (en) | 2008-05-27 | 2009-12-17 | Hexion Specialty Chemicals Gmbh | Method for producing a crack-resistant cast-resin transformer and crack-resistant cast-resin transformer |
CN102323217A (en) * | 2011-10-09 | 2012-01-18 | 重庆市电力公司电力科学研究院 | Holographic detection device and method for gas content in GIS switch |
KR101401640B1 (en) | 2012-06-14 | 2014-06-02 | 주식회사 이피케미칼 | Epoxy resin composition containing silica and core-shell polymer particles |
EP3192835B1 (en) * | 2014-09-11 | 2023-04-19 | Kaneka Corporation | Epoxy resin composition for casting |
PL3275002T5 (en) * | 2015-03-26 | 2023-06-19 | Huntsman Advanced Materials Licensing (Switzerland) Gmbh | A process for the preparation of insulation systems for electrical engineering, the articles obtained therefrom and the use thereof |
DE102016205386A1 (en) * | 2016-03-31 | 2017-10-05 | Robert Bosch Gmbh | Hardenable epoxy molding compound |
JP6897041B2 (en) * | 2016-09-23 | 2021-06-30 | 昭和電工マテリアルズ株式会社 | Resin composition for wiring board, prepreg, laminated board and wiring board |
CN116162325A (en) | 2017-12-27 | 2023-05-26 | 3M创新有限公司 | Cured epoxy resin compositions, articles, and methods suitable for use in electronic device housings |
DE102018214641B4 (en) * | 2018-08-29 | 2022-09-22 | Robert Bosch Gmbh | Potting compound, method for electrically isolating an electrical or electronic component using the potting compound, electrically insulated component produced by such a method and using the potting compound |
CN114364738A (en) * | 2019-11-08 | 2022-04-15 | 电化株式会社 | Insulating resin composition, insulating resin cured product, laminate, and circuit board |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0717073B1 (en) * | 1994-12-13 | 2000-10-11 | Ciba SC Holding AG | Curable compositions based on epoxy resins comprising a core/shell impact modifier |
ES2175061T3 (en) * | 1995-11-29 | 2002-11-16 | Vantico Ag | NUCLEO-CASCARA PARTICLES (CORE-SHELL) AND COMPOSITIONS CONTAINING THESE EPOXYRETICULABLE RESINS. |
WO2000055254A1 (en) * | 1999-03-16 | 2000-09-21 | Vantico Ag | Hardenable composition with a particular combination of characteristics |
-
2001
- 2001-11-20 DE DE60104449T patent/DE60104449T2/en not_active Expired - Lifetime
- 2001-11-20 KR KR1020037005551A patent/KR100849946B1/en active IP Right Grant
- 2001-11-20 WO PCT/EP2001/013431 patent/WO2002044273A1/en not_active Application Discontinuation
- 2001-11-20 EP EP01998594A patent/EP1352026B1/en not_active Expired - Lifetime
- 2001-11-20 US US10/433,137 patent/US20040039084A1/en not_active Abandoned
- 2001-11-20 JP JP2002546628A patent/JP4002831B2/en not_active Expired - Fee Related
- 2001-11-20 CA CA002430074A patent/CA2430074A1/en not_active Abandoned
- 2001-11-20 CZ CZ20031466A patent/CZ20031466A3/en unknown
- 2001-11-20 PL PL01363757A patent/PL363757A1/en not_active Application Discontinuation
- 2001-11-20 ES ES01998594T patent/ES2223963T3/en not_active Expired - Lifetime
- 2001-11-20 AT AT01998594T patent/ATE271584T1/en not_active IP Right Cessation
- 2001-11-20 CN CNB018196519A patent/CN1205265C/en not_active Expired - Lifetime
- 2001-11-20 AU AU2002220717A patent/AU2002220717A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
CN1478127A (en) | 2004-02-25 |
PL363757A1 (en) | 2004-11-29 |
US20040039084A1 (en) | 2004-02-26 |
KR20030060916A (en) | 2003-07-16 |
KR100849946B1 (en) | 2008-08-01 |
EP1352026A1 (en) | 2003-10-15 |
DE60104449D1 (en) | 2004-08-26 |
CZ20031466A3 (en) | 2003-08-13 |
CN1205265C (en) | 2005-06-08 |
DE60104449T2 (en) | 2005-07-28 |
EP1352026B1 (en) | 2004-07-21 |
JP2004522816A (en) | 2004-07-29 |
ATE271584T1 (en) | 2004-08-15 |
CA2430074A1 (en) | 2002-06-06 |
JP4002831B2 (en) | 2007-11-07 |
ES2223963T3 (en) | 2005-03-01 |
WO2002044273A1 (en) | 2002-06-06 |
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