PL3403828T3 - Przemieszczanie i drukowanie przedmiotu obrabianego - Google Patents

Przemieszczanie i drukowanie przedmiotu obrabianego

Info

Publication number
PL3403828T3
PL3403828T3 PL18000455T PL18000455T PL3403828T3 PL 3403828 T3 PL3403828 T3 PL 3403828T3 PL 18000455 T PL18000455 T PL 18000455T PL 18000455 T PL18000455 T PL 18000455T PL 3403828 T3 PL3403828 T3 PL 3403828T3
Authority
PL
Poland
Prior art keywords
workpiece
printing
moving
Prior art date
Application number
PL18000455T
Other languages
English (en)
Inventor
Chris Hawkins
Jeffrey Richard Willshere
Original Assignee
Asm Assembly Systems Singapore Pte. Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asm Assembly Systems Singapore Pte. Ltd. filed Critical Asm Assembly Systems Singapore Pte. Ltd.
Publication of PL3403828T3 publication Critical patent/PL3403828T3/pl

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/08—Machines
    • B41F15/0881—Machines for printing on polyhedral articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/14—Details
    • B41F15/16—Printing tables
    • B41F15/18—Supports for workpieces
    • B41F15/20—Supports for workpieces with suction-operated elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/14—Details
    • B41F15/16—Printing tables
    • B41F15/18—Supports for workpieces
    • B41F15/26—Supports for workpieces for articles with flat surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3202—Mechanical details, e.g. rollers or belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3208—Changing the direction of the conveying path
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3222—Loading to or unloading from a conveyor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41P—INDEXING SCHEME RELATING TO PRINTING, LINING MACHINES, TYPEWRITERS, AND TO STAMPS
    • B41P2215/00—Screen printing machines
    • B41P2215/50—Screen printing machines for particular purposes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0139—Blade or squeegee, e.g. for screen printing or filling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/166—Alignment or registration; Control of registration

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Screen Printers (AREA)
  • Handling Of Sheets (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Specific Conveyance Elements (AREA)
PL18000455T 2017-05-16 2018-05-14 Przemieszczanie i drukowanie przedmiotu obrabianego PL3403828T3 (pl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB1707878.3A GB2562503A (en) 2017-05-16 2017-05-16 Workpiece transfer and printing
EP18000455.8A EP3403828B1 (en) 2017-05-16 2018-05-14 Workpiece transfer and printing

Publications (1)

Publication Number Publication Date
PL3403828T3 true PL3403828T3 (pl) 2022-04-19

Family

ID=59201441

Family Applications (1)

Application Number Title Priority Date Filing Date
PL18000455T PL3403828T3 (pl) 2017-05-16 2018-05-14 Przemieszczanie i drukowanie przedmiotu obrabianego

Country Status (9)

Country Link
US (1) US10986736B2 (pl)
EP (1) EP3403828B1 (pl)
JP (1) JP6626923B2 (pl)
KR (1) KR102082107B1 (pl)
CN (1) CN108878334B (pl)
GB (1) GB2562503A (pl)
PL (1) PL3403828T3 (pl)
SG (1) SG10201802873QA (pl)
TW (1) TWI702151B (pl)

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* Cited by examiner, † Cited by third party
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CN107458088B (zh) * 2017-08-16 2024-06-14 深圳市深龙杰科技有限公司 一种双工位全自动产品图文打印机
GB2580347A (en) * 2019-01-03 2020-07-22 Asm Assembly Systems Singapore Pte Ltd Alignment of singulated workpieces
CN111516384A (zh) * 2019-02-01 2020-08-11 湖南华庆科技有限公司 一种光学膜片生产设备及方法
HUE065483T2 (hu) * 2019-04-18 2024-05-28 Exentis Knowledge Gmbh Berendezés és eljárás háromdimenziós szitanyomó munkadarabok elõállítására
ES2988515T3 (es) 2019-04-18 2024-11-20 Exentis Knowledge Gmbh Procedimiento para la fabricación de piezas de trabajo de serigrafía tridimensionales
PT3725523T (pt) 2019-04-18 2024-05-02 Exentis Knowledge Gmbh Dispositivo e método para a produção de peças serigrafadas tridimensionais
CN110047786B (zh) * 2019-04-26 2024-07-05 无锡奥特维科技股份有限公司 导电胶涂覆装置及叠片组件生产装置
CN110060946B (zh) * 2019-04-26 2024-08-02 无锡奥特维科技股份有限公司 双工位导电胶涂覆装置及叠片组件生产装置
CN110867404A (zh) * 2019-09-30 2020-03-06 正信光电科技股份有限公司 光伏组件生产用零部件输送带
KR102253792B1 (ko) * 2019-12-27 2021-05-20 주식회사 엘에이티 듀얼 스테이지 유닛 및 이를 포함하는 웨이퍼 로딩/언로딩 장치, 그리고 이를 이용한 웨이퍼 로딩/언로딩 방법
CN112848652A (zh) * 2021-01-02 2021-05-28 蔡宗新 一种陶瓷高精度自动印花设备及其工艺
DE102021205984A1 (de) * 2021-06-11 2022-12-15 Ekra Automatisierungssysteme Gmbh Druckvorrichtung und Verfahren zum Bedrucken von Substraten
US12275232B1 (en) * 2022-03-08 2025-04-15 Applied Materials Italia S.R.L. Method of dispensing paste for a printer using a paste dispensing apparatus and paste dispensing apparatus for dispensing paste for a printer
CN115042510B (zh) * 2022-07-25 2023-08-08 丰县通亚电子科技有限公司 一种电动车塑件生产用热转印机
KR102723660B1 (ko) * 2022-08-29 2024-10-29 조성천 태양광패널 프린팅장치
CN116353192B (zh) * 2023-03-20 2023-11-21 杭州余杭獐山钢瓶有限公司 一种钢瓶自动印刷机
US20240329004A1 (en) * 2023-04-03 2024-10-03 Sonix, Inc. Multi-holder inspection system using moveable support structure

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US4386864A (en) * 1980-11-04 1983-06-07 Wang Laboratories, Inc. Selective paper insertion and feeding means for individual sheet printing apparatus
US4974508A (en) * 1989-03-08 1990-12-04 Andersen Edward A Screen printing apparatus
JP2560146B2 (ja) * 1990-11-30 1996-12-04 株式会社新興製作所 プラテン位置決め装置
US5592877A (en) * 1995-10-25 1997-01-14 Elexon Ltd. Screen printing apparatus with data storage
JPH1110832A (ja) * 1997-06-23 1999-01-19 Ibiden Co Ltd 自動作業装置
US6732855B1 (en) * 2000-09-08 2004-05-11 Motorola, Inc. Conveying element and conveyor means for conveying wafer receptacles, and method
JP2002225221A (ja) * 2001-02-02 2002-08-14 Matsushita Electric Ind Co Ltd スクリーン印刷機及びスクリーン印刷方法
TWI348450B (en) * 2003-11-13 2011-09-11 Applied Materials Inc Break-away positioning conveyor mount for accommodating conveyor belt bends
JP5023904B2 (ja) * 2007-09-11 2012-09-12 パナソニック株式会社 スクリーン印刷装置
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JP6124249B2 (ja) * 2012-08-16 2017-05-10 Ｊｕｋｉオートメーションシステムズ株式会社 スクリーン印刷装置、印刷物の製造方法及び基板の製造方法
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JP2017064743A (ja) * 2015-09-29 2017-04-06 株式会社ディスコ レーザー加工装置
CN105835522B (zh) 2016-05-26 2018-08-24 东莞市展迅机械科技有限公司 一种旋转式快速印刷机

Also Published As

Publication number Publication date
CN108878334B (zh) 2023-05-09
CN108878334A (zh) 2018-11-23
JP2018195821A (ja) 2018-12-06
JP6626923B2 (ja) 2019-12-25
GB201707878D0 (en) 2017-06-28
KR20180125883A (ko) 2018-11-26
GB2562503A (en) 2018-11-21
US20180338378A1 (en) 2018-11-22
TW201900428A (zh) 2019-01-01
EP3403828A1 (en) 2018-11-21
US10986736B2 (en) 2021-04-20
HK1257251A1 (zh) 2019-10-18
EP3403828B1 (en) 2021-12-15
SG10201802873QA (en) 2018-12-28
KR102082107B1 (ko) 2020-02-28
TWI702151B (zh) 2020-08-21

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