SG10201802873QA - Workpiece Transfer and Printing - Google Patents

Workpiece Transfer and Printing

Info

Publication number
SG10201802873QA
SG10201802873QA SG10201802873QA SG10201802873QA SG10201802873QA SG 10201802873Q A SG10201802873Q A SG 10201802873QA SG 10201802873Q A SG10201802873Q A SG 10201802873QA SG 10201802873Q A SG10201802873Q A SG 10201802873QA SG 10201802873Q A SG10201802873Q A SG 10201802873QA
Authority
SG
Singapore
Prior art keywords
printing
workpiece transfer
platens
rotary table
loading position
Prior art date
Application number
SG10201802873QA
Inventor
Chris Hawkins
Jeffrey Richard Willshere
Original Assignee
Asm Assembly Systems Singapore Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asm Assembly Systems Singapore Pte Ltd filed Critical Asm Assembly Systems Singapore Pte Ltd
Publication of SG10201802873QA publication Critical patent/SG10201802873QA/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/08—Machines
    • B41F15/0881—Machines for printing on polyhedral articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/14—Details
    • B41F15/16—Printing tables
    • B41F15/18—Supports for workpieces
    • B41F15/20—Supports for workpieces with suction-operated elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/14—Details
    • B41F15/16—Printing tables
    • B41F15/18—Supports for workpieces
    • B41F15/26—Supports for workpieces for articles with flat surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67715—Changing the direction of the conveying path
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67736—Loading to or unloading from a conveyor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41P—INDEXING SCHEME RELATING TO PRINTING, LINING MACHINES, TYPEWRITERS, AND TO STAMPS
    • B41P2215/00—Screen printing machines
    • B41P2215/50—Screen printing machines for particular purposes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0139—Blade or squeegee, e.g. for screen printing or filling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/166—Alignment or registration; Control of registration

Abstract

Workpiece Transfer and Printing A printing apparatus for printing workpieces comprises a rotary table supporting first and second platens rotatable between a loading position located in-line between input and output lines. The transfer apparatus is operable to cyclically perform first and second movement operations, in which the rotary table rotates to move the first platen from a loading position to a printing position and vice versa. The platens may be rotatable relative to each other. FIG. 1
SG10201802873QA 2017-05-16 2018-04-05 Workpiece Transfer and Printing SG10201802873QA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB1707878.3A GB2562503A (en) 2017-05-16 2017-05-16 Workpiece transfer and printing

Publications (1)

Publication Number Publication Date
SG10201802873QA true SG10201802873QA (en) 2018-12-28

Family

ID=59201441

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201802873QA SG10201802873QA (en) 2017-05-16 2018-04-05 Workpiece Transfer and Printing

Country Status (10)

Country Link
US (1) US10986736B2 (en)
EP (1) EP3403828B1 (en)
JP (1) JP6626923B2 (en)
KR (1) KR102082107B1 (en)
CN (1) CN108878334B (en)
GB (1) GB2562503A (en)
HK (1) HK1257251A1 (en)
PL (1) PL3403828T3 (en)
SG (1) SG10201802873QA (en)
TW (1) TWI702151B (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2580347A (en) * 2019-01-03 2020-07-22 Asm Assembly Systems Singapore Pte Ltd Alignment of singulated workpieces
CN111516384A (en) * 2019-02-01 2020-08-11 湖南华庆科技有限公司 Optical film production equipment and method
EP3725522B1 (en) * 2019-04-18 2023-12-20 Exentis Knowledge GmbH Device and method for the preparation of three-dimensional screen printing workpieces
CN110060946A (en) * 2019-04-26 2019-07-26 无锡奥特维科技股份有限公司 Double-station conductive glue device and stacked wafer moudle process units
CN110047786A (en) * 2019-04-26 2019-07-23 无锡奥特维科技股份有限公司 Conductive glue device and stacked wafer moudle process units
CN110867404A (en) * 2019-09-30 2020-03-06 正信光电科技股份有限公司 Spare part conveyer belt is used in photovoltaic module production
KR102253792B1 (en) * 2019-12-27 2021-05-20 주식회사 엘에이티 Dual stage unit and wafer loading/un loading apparatus including same, and wafer loading/un loading method using same
CN112848652A (en) * 2021-01-02 2021-05-28 蔡宗新 Ceramic high-precision automatic printing equipment and process thereof
CN115042510B (en) * 2022-07-25 2023-08-08 丰县通亚电子科技有限公司 Thermal transfer printer for producing plastic parts of electric vehicles
CN116353192B (en) * 2023-03-20 2023-11-21 杭州余杭獐山钢瓶有限公司 Automatic printing machine for steel cylinders

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4386864A (en) * 1980-11-04 1983-06-07 Wang Laboratories, Inc. Selective paper insertion and feeding means for individual sheet printing apparatus
US4974508A (en) * 1989-03-08 1990-12-04 Andersen Edward A Screen printing apparatus
JP2560146B2 (en) * 1990-11-30 1996-12-04 株式会社新興製作所 Platen positioning device
US5592877A (en) * 1995-10-25 1997-01-14 Elexon Ltd. Screen printing apparatus with data storage
JPH1110832A (en) * 1997-06-23 1999-01-19 Ibiden Co Ltd Automatic operating apparatus
US6732855B1 (en) * 2000-09-08 2004-05-11 Motorola, Inc. Conveying element and conveyor means for conveying wafer receptacles, and method
JP2002225221A (en) * 2001-02-02 2002-08-14 Matsushita Electric Ind Co Ltd Screen press and method for screen printing
TWI348450B (en) * 2003-11-13 2011-09-11 Applied Materials Inc Break-away positioning conveyor mount for accommodating conveyor belt bends
JP5023904B2 (en) * 2007-09-11 2012-09-12 パナソニック株式会社 Screen printing device
ITUD20070198A1 (en) * 2007-10-24 2009-04-25 Baccini S P A POSITIONING DEVICE TO POSITION ONE OR MORE PLATES OF ELECTRONIC CIRCUITS, IN A METAL DEPOSITION UNIT, AND ITS PROCEDURE
US8215473B2 (en) * 2008-05-21 2012-07-10 Applied Materials, Inc. Next generation screen printing system
US20090308860A1 (en) * 2008-06-11 2009-12-17 Applied Materials, Inc. Short thermal profile oven useful for screen printing
JP5511273B2 (en) * 2008-09-12 2014-06-04 株式会社日立国際電気 Substrate processing apparatus and substrate processing method
JP4545230B1 (en) * 2010-01-26 2010-09-15 智雄 松下 Pattern forming device
KR101144769B1 (en) * 2010-04-08 2012-05-11 (유)에스엔티 Screen printing system
ES2689681T3 (en) 2010-07-23 2018-11-15 Plastipak Packaging, Inc. Rotary system and method for printing containers
IT1402241B1 (en) * 2010-09-13 2013-08-28 Applied Materials Inc UNIT FOR TRANSPORTING A PRINTING SUPPORT TO A PLANT FOR DEPOSITING PRINTING TRACKS ON SUCH PRINTING SUPPORT, AND ITS PROCEDURE FOR TRANSPORT
US9757963B2 (en) * 2010-11-01 2017-09-12 Scodix Ltd. System and method for transporting substrates
JP5597595B2 (en) * 2011-05-31 2014-10-01 ヤマハ発動機株式会社 Screen printing device
JP6124249B2 (en) * 2012-08-16 2017-05-10 Ｊｕｋｉオートメーションシステムズ株式会社 Screen printing apparatus, method for producing printed matter, and method for producing substrate
US9315012B2 (en) * 2013-10-22 2016-04-19 M&R Printing Equipment, Inc. Screen printing pallet assembly and method of using pallet assembly in a screen printing operation
KR101605077B1 (en) * 2014-03-10 2016-04-04 (주)예스티 Apparatus for bonding chip on wafer precisely
EP2918410A1 (en) * 2014-03-10 2015-09-16 Applied Materials Italia S.R.L. Rotary table and solar cell processing system
JP2017064743A (en) * 2015-09-29 2017-04-06 株式会社ディスコ Laser processing device
CN105835522B (en) 2016-05-26 2018-08-24 东莞市展迅机械科技有限公司 A kind of rotary quick print machine

Also Published As

Publication number Publication date
US20180338378A1 (en) 2018-11-22
TW201900428A (en) 2019-01-01
EP3403828B1 (en) 2021-12-15
PL3403828T3 (en) 2022-04-19
CN108878334B (en) 2023-05-09
US10986736B2 (en) 2021-04-20
HK1257251A1 (en) 2019-10-18
EP3403828A1 (en) 2018-11-21
KR20180125883A (en) 2018-11-26
KR102082107B1 (en) 2020-02-28
GB201707878D0 (en) 2017-06-28
JP2018195821A (en) 2018-12-06
CN108878334A (en) 2018-11-23
JP6626923B2 (en) 2019-12-25
GB2562503A (en) 2018-11-21
TWI702151B (en) 2020-08-21

Similar Documents

Publication Publication Date Title
SG10201802873QA (en) Workpiece Transfer and Printing
CN203791521U (en) Intermittent movement feeding device
US11446891B2 (en) Tool head positioning mechanism for a converting machine, and method for positioning a plurality of tool heads in a converting machine
PH12020550516A1 (en) Liquid material application device and application method
PL1765550T3 (en) Machine tool
MX2012006269A (en) Transport unit.
ATE516102T1 (en) HARD FINE PROCESSING MACHINE
EP3832584A4 (en) Operation assistance module, image generation application, and work machine
EP1743736A3 (en) Machine tool and process with at least a machining unit and two workpiece transporting devices
WO2018073310A3 (en) Transport device, method and computer program product for loading and unloading at least one materials machining machine
MX2018016296A (en) Machine for machining workpieces.
WO2015111070A3 (en) Five-axis machining apparatus
MX2018011440A (en) Wood door slab processing system, and related methods.
MX2019002112A (en) Apparatus for machining pipes and/or pipe flanges.
EP3050657A8 (en) Automated apparatus for processing panels made of wood-like material
NZ624027A (en) Device for marking molluscs and packaging line comprising such a device
PL3493946T3 (en) System comprising a machine tool and a catching apparatus, catching apparatus for the same, and catching method for workpieces machined in a machine tool
MY198794A (en) Workpiece processing method and processing apparatus
WO2020127259A3 (en) Materials for electronic devices
AU2017262424A1 (en) Device having a changeable tool for processing workpiece sheets
MY198404A (en) Communication apparatus, control method, and computer readable storage medium
MX2017008753A (en) Improvements to machining process control.
EP3677359A4 (en) Workpiece inversion device, press conveyance line, and workpiece inversion method
MY194579A (en) Processing apparatus and method of controlling processing apparatus
MX2019011149A (en) Printing apparatus.