CN110060946A - Double-station conductive glue device and stacked wafer moudle process units - Google Patents

Double-station conductive glue device and stacked wafer moudle process units Download PDF

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Publication number
CN110060946A
CN110060946A CN201910345682.2A CN201910345682A CN110060946A CN 110060946 A CN110060946 A CN 110060946A CN 201910345682 A CN201910345682 A CN 201910345682A CN 110060946 A CN110060946 A CN 110060946A
Authority
CN
China
Prior art keywords
cell piece
conductive glue
station
delivery section
plummer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201910345682.2A
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Chinese (zh)
Inventor
李文
徐强
刘伟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuxi Autowell Technology Co Ltd
Original Assignee
Wuxi Autowell Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wuxi Autowell Technology Co Ltd filed Critical Wuxi Autowell Technology Co Ltd
Priority to CN201910345682.2A priority Critical patent/CN110060946A/en
Publication of CN110060946A publication Critical patent/CN110060946A/en
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/6715Apparatus for applying a liquid, a resin, an ink or the like
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1876Particular processes or apparatus for batch treatment of the devices
    • H01L31/188Apparatus specially adapted for automatic interconnection of solar cells in a module
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Abstract

The present invention proposes a kind of double-station conductive glue device and stacked wafer moudle process units.Double-station conductive glue device, including at least one set of conductive glue component, every group of conductive glue component includes delivery section, cell piece moving portion and conductive glue mechanism, delivery section includes preceding delivery section and rear delivery section, preceding delivery section is set to the preceding road station of cell piece moving portion, for cell piece to be delivered to cell piece moving portion;Cell piece moving portion includes rotating device and the first plummer and the second plummer, and rotating device drives the first plummer and the second plummer to exchange position between cell piece receiving station and conductive glue station;Conductive glue mechanism coats conducting resinl to the main gate line for the cell piece for being located at conductive glue station;Delivery site is in the rear road station of cell piece moving portion afterwards, for receiving from cell piece receiving station and conveying the cell piece after conductive glue mechanism coats conducting resinl.

Description

Double-station conductive glue device and stacked wafer moudle process units
Technical field
The present invention relates to a kind of double-station conductive glue devices to cell piece coating conducting resinl.The invention further relates to one Kind has the stacked wafer moudle process units of the double-station conductive glue device.
Background technique
In photovoltaic technology, imbrication technology refers to conventional batteries piece is cut to the battery fragment of 1/5 or 1/6 size after, utilize The two panels battery fragment that edge is stacked is adhered together by conducting resinl, forms battery after being successively adhered the battery fragment of predetermined quantity String.Traditional components generally can all retain about 2~3 millimeters of cell piece spacing, and imbrication technique is realized by overlapping battery fragment Without cell piece spacing, more cell pieces (60 type general components can encapsulate 66) can be placed under same area, to have Effect expands cell piece light-receiving area, the average power generation density of lifting assembly.
Imbrication technology with conducting resinl substitute welding, avoid welding and block, facilitate component power promotion, electron motion away from From shortening, output power is effectively promoted, it is reported that component power 15-20W can be improved in imbrication technology, is much higher than half, more main grids Equal component technologies.
In the production technology of imbrication component, a vital link is that conducting resinl is applied on cell piece, traditional The mode of spraying conducting resinl is to use cell piece direct spraying conducting resinl of the spray head directly on conveyer belt, but this mode is imitated Rate is low, and is easy pollution transportation band.Therefore urgent need to resolve.
Above- mentioned information are only used for reinforcing the understanding to background of the invention, therefore it disclosed in the background technology part It may include the information not constituted to the prior art known to persons of ordinary skill in the art.
Summary of the invention
It is an object of the invention to overcome above-mentioned the deficiencies in the prior art, providing one kind can efficiently be coated to cell piece The double-station conductive glue device of conducting resinl.
Additional aspect and advantage of the invention will be set forth in part in the description, and partly will be from description It is apparent from, or can practice through the invention and acquistion.
According to an aspect of the present invention, a kind of double-station conductive glue device, for the main gate line to cell piece Conducting resinl is coated, the double-station conductive glue device includes at least one set of conductive glue component, every group of conductive glue Component includes delivery section, cell piece moving portion and conductive glue mechanism, and the delivery section includes preceding delivery section and rear delivery section, Wherein:
The preceding delivery section is set to the preceding road station of the cell piece moving portion, for by the battery of conducting resinl to be coated Piece is delivered to the cell piece moving portion;
The cell piece moving portion includes a rotating device and the first plummer for being respectively arranged in the rotating device two sides With the second plummer, the rotating device drives first plummer and the second plummer in a cell piece receiving station and one Position is exchanged between conductive glue station with mobile battery piece, first plummer and the second plummer are in the cell piece Receiving station receives the cell piece in the preceding delivery section;
The conductive glue mechanism coats conducting resinl to the main gate line for the cell piece for being located at the conductive glue station;
Delivery site is in the rear road station of the cell piece moving portion after described, for connecing from the cell piece receiving station It receives and conveys the cell piece after the conductive glue mechanism coating conducting resinl.
According to an embodiment of the present invention, the conductive glue component is equipped with two groups, and conducting resinl described in two groups applies The delivery section of component is covered in arranged in parallel, and the conductive glue mechanism in conductive glue component described in two groups is set to two Between a delivery section.
According to an embodiment of the present invention, on the preceding delivery section, rear delivery section, the first plummer and the second plummer It is equipped with the conveyer belt for conveying the cell piece, and the conveyor surface of the conveyer belt is in the same plane.
According to an embodiment of the present invention, the delivery section and rear delivery section are installed on lifting device with oscilaltion.
According to an embodiment of the present invention, the preceding delivery section and rear delivery section include for drive the cell piece by The dynamic step device of displacement.
According to an embodiment of the present invention, the step device includes lifting unit and cell piece lift unit, described Lifting unit drives the cell piece lift unit mobile.
According to an embodiment of the present invention, the conductive glue mechanism is screen printing device;Alternatively, the conducting resinl applies Covering mechanism includes for the spray head to cell piece spraying conducting resinl.
According to another aspect of the present invention, a kind of stacked wafer moudle process units, the stacked wafer moudle process units include Above-mentioned double-station conductive glue device, the stacked wafer moudle process units further include cell piece lamination device and heated transportation Device;The cell piece lamination device can by the double-station conductive glue device coat conducting resinl after cell piece according to Scheduled sequence stacks into battery strings;The heating conveyor can carry out conveying to the battery strings and carry out to conducting resinl Heating, so that the welding of battery film in the battery strings is together.
According to an embodiment of the present invention, the stacked wafer moudle process units further includes that can break into the cell piece Small pieces break sheet devices.
According to an embodiment of the present invention, the sheet devices of breaking are set to the preceding road station of the conductive glue mechanism, It is broken into small pieces for will be broken after cell piece laser grooving and scribing and is placed into the delivery section;Alternatively, the sheet devices of breaking are set to Road station after the conductive glue mechanism is broken into small pieces simultaneously for breaking after the cell piece laser grooving and scribing by the complete conducting resinl of silk-screen It is placed into the delivery section.
As shown from the above technical solution, the advantages and positive effects of the present invention are:
In double-station conductive glue device of the present invention, cell piece moving portion can convey between delivery section and plummer Cell piece, conductive glue mechanism coat conducting resinl to the main gate line for the cell piece for being located at the conductive glue station, thus Conducting resinl efficiently can be coated to cell piece, it is thus also avoided that the problem of conducting resinl pollution transportation band.
Detailed description of the invention
Its example embodiment is described in detail by referring to accompanying drawing, above and other feature of the invention and advantage will become It is more obvious.
Fig. 1 is the structural schematic diagram of the double-station conductive glue device of embodiment of the present invention one;
Fig. 2 is the structural schematic diagram of the conductive glue component in Fig. 1;
Fig. 3 is the schematic side view for showing the conductive glue component of Fig. 2;
Fig. 4 is schematic diagram of the step device in embodiment of the present invention two in initial position;
Fig. 5 is the schematic diagram that step device jacks up cell piece;
Fig. 6 is the schematic diagram of step device mobile battery piece;
Fig. 7 is the schematic diagram that step device falls cell piece.
In figure: 1, preceding delivery section;2, rear delivery section;3, rotating device;4, the first plummer;5, the second plummer;6, it leads Electric glue coating mechanism;7, step device;10, conveyer belt;20, conveyer belt;30, pedestal;40, cell piece.
Specific embodiment
Example embodiment is described more fully with reference to the drawings.However, example embodiment can be with a variety of shapes Formula is implemented, and is not understood as limited to embodiment set forth herein;On the contrary, thesing embodiments are provided so that the present invention will Fully and completely, and by the design of example embodiment comprehensively it is communicated to those skilled in the art.Identical attached drawing in figure Label indicates same or similar structure, thus the detailed description that will omit them.
Embodiment one
As shown in Figure 1 to Figure 3, embodiment of the present invention discloses a kind of double-station conductive glue device, is used for electricity The main gate line of pond piece coats conducting resinl, which includes at least one set of conductive glue component, and every group Conductive glue component includes delivery section, cell piece moving portion and conductive glue mechanism 6.Delivery section includes preceding 1 He of delivery section Delivery section 2 afterwards.Conveyer belt 10 and conveyer belt 20 are respectively provided in the front and back of delivery section.
Preceding delivery section 1 is set to the preceding road station of cell piece moving portion, for the cell piece 40 of conducting resinl to be coated is defeated It send to the cell piece moving portion.
Cell piece moving portion includes a rotating device 3 and 4 He of the first plummer for being respectively arranged in 3 two sides of rotating device Second plummer 5, the rotating device 3 drive the first plummer 4 and the second plummer 5 conductive in a cell piece receiving station and one Glue, which coats, exchanges position with mobile battery piece 40 between station, the first plummer 4 and the second plummer 5 are in cell piece receiving station Receive the cell piece 40 in the preceding delivery section 1.
Conductive glue mechanism 6 coats conducting resinl to the main gate line for the cell piece 40 for being located at conductive glue station;
Delivery section 2 is located at the rear road station of cell piece moving portion afterwards, leads for receiving and conveying from cell piece receiving station Cell piece 40 after electric glue coating mechanism coating conducting resinl.
As shown in Figure 1, in the present embodiment, which is equipped with two groups, and two groups of conductive glue groups For the delivery section of part in arranged in parallel, the conductive glue mechanism 6 in two groups of conductive glue components is set to two conveyings Between portion.So, accounting for for double-station conductive glue device can be reduced as far as possible using the space between delivery section Ground area.
In the present embodiment, conductive glue mechanism is screen printing device, and screen printing device is widely applied in solar energy enterprise In printing main gate line and secondary grid line.Present embodiment can accurately control the printing position of conducting resinl by using screen printing device, And the conducting resinl one-pass molding of all positions in cell piece surface, high production efficiency can be made.Conductive glue mechanism may also comprise For the spray head to cell piece spraying conducting resinl.
Referring to Fig. 1 to Fig. 3, in the present embodiment, the preceding delivery section 1, rear delivery section 2, the first plummer 4 and second are held The conveyer belt for conveying cell piece 40 is equipped on microscope carrier 5, and the conveyor surface of these conveyer belts is in the same plane, battery Piece 40 can be smoothly moved to by the conveyer belt of preceding delivery section 1 on the conveyer belt of first plummer 4 or the second plummer 5, It is delivered to again by the conveyer belt of the first plummer 4 or the second plummer 5 on the conveyer belt of rear delivery section 2.
In the present embodiment, the preceding delivery section 1, rear delivery section 2 are installed on the lifting device that pedestal 30 is arranged in, should Lifting device can be the mechanisms such as lifting cylinder, with oscilaltion.When current delivery section 1 and rear delivery section 2 rise, conveyer belt Conveyor surface can be generally aligned in the same plane with the conveyor surface of the first plummer 4, can when current delivery section 1 and rear delivery section 2 decline It avoids interfering with the first plummer 4 and the second plummer 5, influences the rotation of the first plummer 4 and the second plummer 5.
The course of work of the double-station conductive glue device of present embodiment is described below.
1) delivery section 1 before, cell piece 40 is transported to by conveyer belt 10, at this point, the first plummer 4, which is located at cell piece, receives work Position, the second plummer 5 are located at conductive glue station, and cell piece is delivered to the first plummer 4 by the conveyer belt of preceding delivery section 1 On conveyer belt.
2), lifting device drives preceding delivery section 1 and rear delivery section 2 to decline.
3), rotating device 3 drives the first plummer 4 and the second plummer 5 to rotate 180 °, is located at the first plummer 4 and leads Electric glue coats station, and the second plummer 5 is located at cell piece receiving station.
4), lifting device drives preceding delivery section 1 and rear delivery section 2 to rise.
5), conductive glue mechanism coats conducting resinl to the cell piece on the first plummer 4, the electricity on the second plummer 5 Pond piece is moved to rear delivery section 2, and the cell piece in preceding delivery section 1 moves to the second plummer 5.
6), lifting device drives preceding delivery section 1 and rear delivery section 2 to decline.
7), rotating device 3 drives the first plummer 4 and the second plummer 5 to rotate 180 °, and the first plummer 4 is made to be located at electricity Pond piece receiving station, the second plummer 5 are located at conductive glue station.
8), lifting device drives preceding delivery section 1 and rear delivery section 2 to rise, after the cell piece on the first plummer 4 is moved to Delivery section 2, then re-execute the steps 1).
The double-station conductive glue device of present embodiment, cell piece moving portion can be between delivery section and plummer Cell piece is conveyed, conductive glue mechanism coats conducting resinl to the main gate line for the cell piece for being located at the conductive glue station, Thus conducting resinl efficiently can be coated to cell piece, it is thus also avoided that the problem of conducting resinl pollution transportation band.
Embodiment two
As shown in Figures 4 to 7, present embodiment discloses a kind of double-station conductive glue device, with embodiment One something in common is no longer superfluous to be chatted, the difference is that, in the present embodiment, preceding delivery section 1 and rear delivery section 2 include being used for The step device 7 for driving cell piece 40 to move by turn.
The step device can be such that cell piece moves by turn between preceding delivery section 1, cell piece receiving station and rear delivery section 2 Dynamic cell piece.In the present embodiment, which includes lifting unit and cell piece lift unit.Lifting unit being capable of band After dynamic cell piece lift unit contacts and lifts cell piece, drive cell piece lift unit mobile.The lifting unit may include The common horicontal motion mechanism such as linear guide and linear motor and lifting hydraulic cylinder etc. are capable of the vertical motion of vertical motion Mechanism after lifting unit is combined by vertical motion and horizontal movement, can drive cell piece lift unit mobile with defeated Send cell piece.
When current delivery section 1 and rear delivery section 2 are lower than the height of the first plummer and the second plummer, present embodiment Technical solution can be omitted the lifting device for driving delivery section 1 and delivery section 2 to go up and down in embodiment 1.
The course of work of the double-station conductive glue device of present embodiment is described below.
1) delivery section 1 before, cell piece 40 is transported to by conveyer belt 10, at this point, the first plummer 4, which is located at cell piece, receives work Position, the second plummer 5 are located at conductive glue station.As shown in Figures 4 to 6, step device is by the battery on the first plummer 4 Piece 40 is delivered to rear delivery section 2, while cell piece being lifted from preceding delivery section 1, and be moved to the first plummer 4 and put down.
2), lifting device drives preceding delivery section 1 and rear delivery section 2 to decline.
3), rotating device 3 drives the first plummer 4 and the second plummer 5 to rotate 180 °, is located at the first plummer 4 and leads Electric glue coats station, and the second plummer 5 is located at cell piece receiving station.
4), lifting device drives preceding delivery section 1 and rear delivery section 2 to rise.
5), conductive glue mechanism coats conducting resinl to the cell piece on the first plummer 4, and step device is carried second Cell piece on platform 5 is moved to rear delivery section 2, and the cell piece in preceding delivery section 1 moves to the second plummer 5.
6), lifting device drives preceding delivery section 1 and rear delivery section 2 to decline.
7), rotating device 3 drives the first plummer 4 and the second plummer 5 to rotate 180 °, and the first plummer 4 is made to be located at electricity Pond piece receiving station, the second plummer 5 are located at conductive glue station.
8), lifting device drives preceding delivery section 1 and the rising of rear delivery section 2, and step device is by the battery on the first plummer 4 Piece is moved to rear delivery section 2, then re-execute the steps 1).
Embodiment three
Present embodiment discloses a kind of stacked wafer moudle process units, and stacked wafer moudle process units includes above-mentioned double-station Conductive glue device, stacked wafer moudle process units further include cell piece lamination device and heating conveyor;Cell piece lamination Cell piece after double-station conductive glue device coating conducting resinl can be stacked into a predetermined sequence battery strings by device; Heating conveyor can carry out battery strings to convey and heat conducting resinl, so that the welding of battery film in battery strings exists Together.
Stacked wafer moudle process units further include cell piece can break into small pieces break sheet devices.It breaks sheet devices and is set to and lead The electric preceding road station of glue coating mechanism is broken into small pieces and is placed into delivery section for will break after cell piece laser grooving and scribing;Alternatively, breaking Sheet devices are set to road station after conductive glue mechanism, disconnected for breaking after the cell piece laser grooving and scribing by the complete conducting resinl of silk-screen At small pieces and it is placed into delivery section.
It is particularly shown and described exemplary embodiments of the present invention above.It should be understood that the present invention is not limited to institute Disclosed embodiment, on the contrary, it is intended to cover comprising various modifications in the spirit and scope of the appended claims And equivalent arrangements.

Claims (10)

1. a kind of double-station conductive glue device, coats conducting resinl in the main gate line to cell piece, which is characterized in that institute Stating double-station conductive glue device includes at least one set of conductive glue component, and every group of conductive glue component includes conveying Portion, cell piece moving portion and conductive glue mechanism, the delivery section include preceding delivery section and rear delivery section, in which:
The preceding delivery section is set to the preceding road station of the cell piece moving portion, for the cell piece of conducting resinl to be coated is defeated It send to the cell piece moving portion;
The cell piece moving portion includes a rotating device and the first plummer for being respectively arranged in the rotating device two sides and Two plummers, the rotating device drive first plummer and the second plummer conductive in a cell piece receiving station and one Exchange position is received with mobile battery piece, first plummer and the second plummer in the cell piece between glue coating station Station receives the cell piece in the preceding delivery section;
The conductive glue mechanism coats conducting resinl to the main gate line for the cell piece for being located at the conductive glue station;
Delivery site is in the rear road station of the cell piece moving portion after described, for receiving simultaneously from the cell piece receiving station Convey the cell piece after the conductive glue mechanism coating conducting resinl.
2. double-station conductive glue device according to claim 1, which is characterized in that the conductive glue component is set There are two groups, and the delivery section of conductive glue component described in two groups is in arranged in parallel, conductive glue component described in two groups In conductive glue mechanism be set between two delivery sections.
3. double-station conductive glue device according to claim 1, which is characterized in that the preceding delivery section, rear conveying The conveyer belt for conveying the cell piece is equipped on portion, the first plummer and the second plummer, and the conveyer belt is defeated Face is sent to be in the same plane.
4. double-station conductive glue device according to claim 3, which is characterized in that the delivery section and rear delivery section Lifting device is installed on oscilaltion.
5. double-station conductive glue device according to claim 1, which is characterized in that the preceding delivery section and rear conveying Portion includes the step device for driving the cell piece to move by turn.
6. double-station conductive glue device according to claim 5, which is characterized in that the step device includes lifting Unit and cell piece lift unit, the lifting unit drive the cell piece lift unit mobile.
7. according to claim 1 to any double-station conductive glue device in 6, which is characterized in that the conducting resinl Coating mechanism is screen printing device;Alternatively, the conductive glue mechanism includes for the spray to cell piece spraying conducting resinl Head.
8. a kind of stacked wafer moudle process units, which is characterized in that the stacked wafer moudle process units include the claims 1 to Any double-station conductive glue device in 7, the stacked wafer moudle process units further include cell piece lamination device and Heating conveyor;The double-station conductive glue device can be coated the electricity after conducting resinl by the cell piece lamination device Pond piece stacks into battery strings in a predetermined sequence;The heating conveyor can carry out conveying to the battery strings and to leading Electric glue is heated, so that the welding of battery film in the battery strings is together.
9. stacked wafer moudle process units according to claim 8, which is characterized in that the stacked wafer moudle process units also wraps Include the cell piece can break into small pieces break sheet devices.
10. stacked wafer moudle process units according to claim 9, which is characterized in that it is described break sheet devices be set to it is described The preceding road station of conductive glue mechanism is broken into small pieces and is placed into the delivery section for will break after cell piece laser grooving and scribing;
Alternatively,
The sheet devices of breaking are set to road station after the conductive glue mechanism, for using the cell piece of the complete conducting resinl of silk-screen It is broken after laser grooving and scribing and is broken into small pieces and is placed into the delivery section.
CN201910345682.2A 2019-04-26 2019-04-26 Double-station conductive glue device and stacked wafer moudle process units Pending CN110060946A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201910345682.2A CN110060946A (en) 2019-04-26 2019-04-26 Double-station conductive glue device and stacked wafer moudle process units

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201910345682.2A CN110060946A (en) 2019-04-26 2019-04-26 Double-station conductive glue device and stacked wafer moudle process units

Publications (1)

Publication Number Publication Date
CN110060946A true CN110060946A (en) 2019-07-26

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN205650979U (en) * 2016-03-31 2016-10-19 东莞市星火太阳能科技股份有限公司 Handling device of solar wafer cluster
CN108878334A (en) * 2017-05-16 2018-11-23 先进装配系统新加坡有限公司 workpiece transfer and printing
CN209804608U (en) * 2019-04-26 2019-12-17 无锡奥特维科技股份有限公司 double-station conductive adhesive coating device and laminated piece assembly production device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN205650979U (en) * 2016-03-31 2016-10-19 东莞市星火太阳能科技股份有限公司 Handling device of solar wafer cluster
CN108878334A (en) * 2017-05-16 2018-11-23 先进装配系统新加坡有限公司 workpiece transfer and printing
CN209804608U (en) * 2019-04-26 2019-12-17 无锡奥特维科技股份有限公司 double-station conductive adhesive coating device and laminated piece assembly production device

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