PL3072153T3 - Urządzenie z modułem energoelektronicznym do zasilania elektrycznego odbiornika sprzętu gospodarstwa domowego elektrycznym napięciem zasilającym, sprzęt gospodarstwa domowego i sposób wytwarzania tego rodzaju urządzenia - Google Patents
Urządzenie z modułem energoelektronicznym do zasilania elektrycznego odbiornika sprzętu gospodarstwa domowego elektrycznym napięciem zasilającym, sprzęt gospodarstwa domowego i sposób wytwarzania tego rodzaju urządzeniaInfo
- Publication number
- PL3072153T3 PL3072153T3 PL14796113T PL14796113T PL3072153T3 PL 3072153 T3 PL3072153 T3 PL 3072153T3 PL 14796113 T PL14796113 T PL 14796113T PL 14796113 T PL14796113 T PL 14796113T PL 3072153 T3 PL3072153 T3 PL 3072153T3
- Authority
- PL
- Poland
- Prior art keywords
- household appliance
- supplying
- producing
- supply voltage
- power electronics
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Ceramic Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Inverter Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102013223430.9A DE102013223430A1 (de) | 2013-11-18 | 2013-11-18 | Vorrichtung mit einem Leistungselektronikmodul zum Versorgen eines elektrischen Verbrauchers eines Haushaltsgeräts mit elektrischer Versorgungsspannung, Haushaltsgerät und Verfahren zum Herstellen einer derartigen Vorrichtung |
| EP14796113.0A EP3072153B1 (de) | 2013-11-18 | 2014-11-11 | Vorrichtung mit einem leistungselektronikmodul zum versorgen eines elektrischen verbrauchers eines haushaltsgeräts mit elektrischer versorgungsspannung, haushaltsgerät und verfahren zum herstellen einer derartigen vorrichtung |
| PCT/EP2014/074226 WO2015071238A1 (de) | 2013-11-18 | 2014-11-11 | Vorrichtung mit einem leistungselektronikmodul zum versorgen eines elektrischen verbrauchers eines haushaltsgeräts mit elektrischer versorgungsspannung, haushaltsgerät und verfahren zum herstellen einer derartigen vorrichtung |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| PL3072153T3 true PL3072153T3 (pl) | 2018-06-29 |
Family
ID=51871056
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PL14796113T PL3072153T3 (pl) | 2013-11-18 | 2014-11-11 | Urządzenie z modułem energoelektronicznym do zasilania elektrycznego odbiornika sprzętu gospodarstwa domowego elektrycznym napięciem zasilającym, sprzęt gospodarstwa domowego i sposób wytwarzania tego rodzaju urządzenia |
Country Status (7)
| Country | Link |
|---|---|
| EP (1) | EP3072153B1 (pl) |
| CN (1) | CN105745751B (pl) |
| DE (1) | DE102013223430A1 (pl) |
| ES (1) | ES2657703T3 (pl) |
| PL (1) | PL3072153T3 (pl) |
| RU (1) | RU2636415C1 (pl) |
| WO (1) | WO2015071238A1 (pl) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR3082306B1 (fr) * | 2018-06-08 | 2020-09-18 | Valeo Equip Electr Moteur | Systeme de mesure d'une temperature d'un composant electrique et bras de commutation comportant un tel systeme |
| RU187623U1 (ru) * | 2018-10-24 | 2019-03-14 | Акционерное общество "Научно-исследовательский институт Приборостроения имени В.В. Тихомирова" | Радиоэлектронный узел |
| EP4318554A1 (de) * | 2022-08-02 | 2024-02-07 | Siemens Aktiengesellschaft | Halbleitermodul mit zumindest einer ersten halbleiteranordnung, einer zweiten halbleiteranordnung und einem kühlkörper |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04273150A (ja) * | 1991-02-28 | 1992-09-29 | Fuji Electric Co Ltd | 半導体装置 |
| DE4418426B4 (de) * | 1993-09-08 | 2007-08-02 | Mitsubishi Denki K.K. | Halbleiterleistungsmodul und Verfahren zur Herstellung des Halbleiterleistungsmoduls |
| JP2781329B2 (ja) * | 1992-10-21 | 1998-07-30 | 三菱電機株式会社 | 半導体パワーモジュールおよびその製造方法 |
| JPH07263621A (ja) * | 1994-03-18 | 1995-10-13 | Toshiba Corp | 半導体装置 |
| JP3206717B2 (ja) * | 1996-04-02 | 2001-09-10 | 富士電機株式会社 | 電力用半導体モジュール |
| JP2954908B2 (ja) * | 1997-09-30 | 1999-09-27 | エスエムシー株式会社 | 基板の温度調整装置 |
| JP3846699B2 (ja) * | 2001-10-10 | 2006-11-15 | 富士電機ホールディングス株式会社 | 半導体パワーモジュールおよびその製造方法 |
| DE10309302B4 (de) * | 2003-03-04 | 2007-09-27 | Semikron Elektronik Gmbh & Co. Kg | Leistungshalbleitermodul mit Sensorbauteil |
| JP2005109100A (ja) * | 2003-09-30 | 2005-04-21 | Mitsubishi Electric Corp | 半導体装置およびその製造方法 |
| DE102004019431A1 (de) * | 2004-04-19 | 2005-11-10 | Siemens Ag | Hybrider Leiterplattenaufbau zur kompakten Aufbautechnik von elektrischen Bauelementen |
| DE102004040773B3 (de) * | 2004-08-23 | 2005-05-25 | Siemens Ag | Halbleiterschaltgeräte mit Temeratursensor |
| DE102005013762C5 (de) * | 2005-03-22 | 2012-12-20 | Sew-Eurodrive Gmbh & Co. Kg | Elektronisches Gerät und Verfahren zur Bestimmung der Temperatur eines Leistungshalbleiters |
| DE102006056363B4 (de) * | 2006-11-29 | 2010-12-09 | Infineon Technologies Ag | Halbleitermodul mit mindestens zwei Substraten und Verfahren zur Herstellung eines Halbleitermoduls mit zwei Substraten |
| DE102007005233B4 (de) | 2007-01-30 | 2021-09-16 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Leistungsmodul |
| DE102007052630B4 (de) * | 2007-11-05 | 2019-08-14 | Infineon Technologies Ag | Leistungshalbleitermodul mit Temperatursensor |
| JP5127929B2 (ja) * | 2007-11-13 | 2013-01-23 | シーメンス アクチエンゲゼルシヤフト | パワー半導体素子モジュール |
| US8057094B2 (en) * | 2007-11-16 | 2011-11-15 | Infineon Technologies Ag | Power semiconductor module with temperature measurement |
| JP4947135B2 (ja) * | 2009-12-04 | 2012-06-06 | 株式会社デンソー | 半導体パッケージおよびその製造方法 |
| DE102011007171A1 (de) | 2011-04-12 | 2012-10-18 | BSH Bosch und Siemens Hausgeräte GmbH | Kühlvorrichtung für ein Elektronikmodul eines Haushaltsgeräts sowie Baugruppe und Haushaltsgerät mit einer Kühlvorrichtung |
| DE102011080153A1 (de) * | 2011-07-29 | 2013-01-31 | Infineon Technologies Ag | Flexible verbindung von substraten in leistungshalbleitermodulen |
| DE102011088969A1 (de) * | 2011-12-19 | 2013-06-20 | Robert Bosch Gmbh | Getriebesteuermodul |
| RU124458U1 (ru) * | 2012-07-25 | 2013-01-20 | Открытое Акционерное Общество Научно-Производственное Объединение "Энергомодуль" (Оао Нпо "Энергомодуль") | Силовой модуль |
-
2013
- 2013-11-18 DE DE102013223430.9A patent/DE102013223430A1/de not_active Withdrawn
-
2014
- 2014-11-11 ES ES14796113.0T patent/ES2657703T3/es active Active
- 2014-11-11 PL PL14796113T patent/PL3072153T3/pl unknown
- 2014-11-11 RU RU2016121113A patent/RU2636415C1/ru active
- 2014-11-11 EP EP14796113.0A patent/EP3072153B1/de active Active
- 2014-11-11 CN CN201480062736.XA patent/CN105745751B/zh active Active
- 2014-11-11 WO PCT/EP2014/074226 patent/WO2015071238A1/de active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| WO2015071238A1 (de) | 2015-05-21 |
| EP3072153B1 (de) | 2018-01-10 |
| CN105745751B (zh) | 2019-03-29 |
| ES2657703T3 (es) | 2018-03-06 |
| CN105745751A (zh) | 2016-07-06 |
| EP3072153A1 (de) | 2016-09-28 |
| RU2636415C1 (ru) | 2017-11-23 |
| DE102013223430A1 (de) | 2015-05-21 |
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