PL2786647T3 - Układ chłodzenia dla serwera - Google Patents

Układ chłodzenia dla serwera

Info

Publication number
PL2786647T3
PL2786647T3 PL12819130T PL12819130T PL2786647T3 PL 2786647 T3 PL2786647 T3 PL 2786647T3 PL 12819130 T PL12819130 T PL 12819130T PL 12819130 T PL12819130 T PL 12819130T PL 2786647 T3 PL2786647 T3 PL 2786647T3
Authority
PL
Poland
Prior art keywords
server
cooling system
cooling
Prior art date
Application number
PL12819130T
Other languages
English (en)
Inventor
Andre Sloth Eriksen
Original Assignee
Asetek Danmark A/S
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asetek Danmark A/S filed Critical Asetek Danmark A/S
Publication of PL2786647T3 publication Critical patent/PL2786647T3/pl

Links

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763Liquid cooling without phase change
    • H05K7/20781Liquid cooling without phase change within cabinets for removing heat from server blades
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/14Mounting supporting structure in casing or on frame or rack
    • H05K7/1485Servers; Data center rooms, e.g. 19-inch computer racks
    • H05K7/1488Cabinets therefor, e.g. chassis or racks or mechanical interfaces between blades and support structures
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20254Cold plates transferring heat from heat source to coolant
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20263Heat dissipaters releasing heat from coolant
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20272Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763Liquid cooling without phase change
    • H05K7/20772Liquid cooling without phase change within server blades for removing heat from heat source
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20Indexing scheme relating to G06F1/20
    • G06F2200/201Cooling arrangements using cooling fluid
PL12819130T 2011-11-28 2012-10-23 Układ chłodzenia dla serwera PL2786647T3 (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/304,813 US9155230B2 (en) 2011-11-28 2011-11-28 Cooling system for a server
PCT/IB2012/002702 WO2013080037A2 (en) 2011-11-28 2012-10-23 Cooling system for a server
EP12819130.1A EP2786647B1 (en) 2011-11-28 2012-10-23 Cooling system for a server

Publications (1)

Publication Number Publication Date
PL2786647T3 true PL2786647T3 (pl) 2020-03-31

Family

ID=46199195

Family Applications (1)

Application Number Title Priority Date Filing Date
PL12819130T PL2786647T3 (pl) 2011-11-28 2012-10-23 Układ chłodzenia dla serwera

Country Status (8)

Country Link
US (4) US9155230B2 (pl)
EP (2) EP2786647B1 (pl)
CN (2) CN104054407B (pl)
DK (1) DK2786647T3 (pl)
ES (1) ES2731728T3 (pl)
HK (1) HK1202212A1 (pl)
PL (1) PL2786647T3 (pl)
WO (1) WO2013080037A2 (pl)

Families Citing this family (68)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9496200B2 (en) 2011-07-27 2016-11-15 Coolit Systems, Inc. Modular heat-transfer systems
US9943014B2 (en) 2013-03-15 2018-04-10 Coolit Systems, Inc. Manifolded heat exchangers and related systems
JP5531571B2 (ja) * 2009-11-12 2014-06-25 富士通株式会社 機能拡張ユニットシステム
DK2609800T3 (da) * 2010-08-26 2020-02-24 Asetek Danmark As Væskekølesystem til en server
US9069532B2 (en) 2011-07-25 2015-06-30 International Business Machines Corporation Valve controlled, node-level vapor condensation for two-phase heat sink(s)
US8564952B2 (en) 2011-07-25 2013-10-22 International Business Machines Corporation Flow boiling heat sink structure with vapor venting and condensing
US9061382B2 (en) 2011-07-25 2015-06-23 International Business Machines Corporation Heat sink structure with a vapor-permeable membrane for two-phase cooling
US10365667B2 (en) 2011-08-11 2019-07-30 Coolit Systems, Inc. Flow-path controllers and related systems
US9155230B2 (en) * 2011-11-28 2015-10-06 Asetek Danmark A/S Cooling system for a server
US9606588B2 (en) 2012-11-08 2017-03-28 Silicon Graphics International Corp. Closed-loop cooling system for high-density clustered computer system
TWI531795B (zh) 2013-03-15 2016-05-01 水冷系統公司 感測器、多工通信技術及相關系統
CN103365385A (zh) * 2013-07-10 2013-10-23 北京百度网讯科技有限公司 用于整机柜的服务器组件及具有其的整机柜
US10201116B1 (en) * 2013-12-02 2019-02-05 Amazon Technologies, Inc. Cooling system for data center rack
WO2015083256A1 (ja) * 2013-12-04 2015-06-11 富士通株式会社 混合作動液を用いた冷却装置及び電子装置の冷却装置
CN106165556B (zh) * 2014-04-11 2020-07-28 慧与发展有限责任合伙企业 计算盒体
EP3185663A1 (en) * 2014-08-18 2017-06-28 Murakumo Corporation System, information processing device and rack
EP3237992B1 (en) * 2015-03-24 2020-10-21 Hewlett-Packard Enterprise Development LP Liquid cooling with a cooling chamber
US9801313B2 (en) 2015-06-26 2017-10-24 Microsoft Technology Licensing, Llc Underwater container cooling via integrated heat exchanger
US9655281B2 (en) 2015-06-26 2017-05-16 Seagate Technology Llc Modular cooling system
US9844167B2 (en) * 2015-06-26 2017-12-12 Microsoft Technology Licensing, Llc Underwater container cooling via external heat exchanger
US10237999B2 (en) * 2015-10-30 2019-03-19 Hewlett Packard Enterprise Development Lp Configurable node expansion space
US10455735B2 (en) 2016-03-03 2019-10-22 Coolanyp, LLC Self-organizing thermodynamic system
DE102016204175A1 (de) * 2016-03-14 2017-09-14 Thomas-Krenn.AG System, vorzugsweise für eine Temperaturregulierung eines Volumens
FR3057344B1 (fr) * 2016-10-10 2019-05-24 Bull Sas Armoire informatique avec modules de refroidissement liquide
CA3090944A1 (en) * 2017-02-08 2018-08-16 Upstream Data Inc. Blockchain mine at oil or gas facility
US10551806B2 (en) 2017-03-16 2020-02-04 International Business Machines Corporation System for providing an access area for a data storage library
US10566023B2 (en) 2017-03-16 2020-02-18 International Business Machines Corporation Data storage library with service mode for protecting data storage drives
US10890955B2 (en) 2017-03-16 2021-01-12 International Business Machines Corporation System for controlling environmental conditions within an automated data storage library
US9940976B1 (en) 2017-03-16 2018-04-10 International Business Machines Corporation Data storage library with component locker for environmental acclimation
US11500430B2 (en) 2017-03-16 2022-11-15 International Business Machines Corporation Data storage library with service mode for protecting data storage drives
US10431254B2 (en) 2017-03-16 2019-10-01 International Business Machines Corporation System for providing an acclimation enclosure for a data storage library
US10026445B1 (en) 2017-03-16 2018-07-17 International Business Machines Corporation Data storage library with interior access regulation
US9916871B1 (en) 2017-03-16 2018-03-13 International Business Machines Corporation Data storage library with acclimation chamber
US10417851B2 (en) 2017-03-16 2019-09-17 International Business Machines Corporation Data storage library with service mode
US10026455B1 (en) 2017-03-16 2018-07-17 International Business Machines Corporation System and method for controlling environmental conditions within an automated data storage library
US9916869B1 (en) 2017-03-16 2018-03-13 International Business Machines Corporation Method for servicing a self-cooled data storage library
US10418071B2 (en) 2017-03-16 2019-09-17 International Business Machines Corporation Data storage library with positive pressure system
US10045457B1 (en) 2017-03-16 2018-08-07 International Business Machines Corporation System for maintaining the environment of a self-cooled data storage library
US10509421B2 (en) 2017-03-16 2019-12-17 International Business Machines Corproation Method for controlling environmental conditions within an automated data storage library
US10303376B2 (en) 2017-03-16 2019-05-28 International Business Machines Corporation Data storage library with pass-through connected media acclimation chamber
US10395695B2 (en) 2017-03-16 2019-08-27 International Business Machines Corporation Data storage library with media acclimation device and methods of acclimating data storage media
US10660240B2 (en) 2017-03-16 2020-05-19 International Business Machines Corporation Method for providing an access area for a data storage library
JP6939034B2 (ja) * 2017-04-05 2021-09-22 富士通株式会社 冷却システム、冷却装置、及び電子システム
JP6888469B2 (ja) * 2017-08-04 2021-06-16 富士通株式会社 情報処理装置
CN107613732A (zh) * 2017-09-28 2018-01-19 深圳兴奇宏科技有限公司 机箱散热结构
US11452243B2 (en) 2017-10-12 2022-09-20 Coolit Systems, Inc. Cooling system, controllers and methods
JP6969721B2 (ja) * 2017-12-30 2021-11-24 ヒタチ・エナジー・スウィツァーランド・アクチェンゲゼルシャフトHitachi Energy Switzerland Ag 変圧冷却回路中でのセンサ利用のためのシステム
US10667437B2 (en) * 2018-04-12 2020-05-26 Baidu Usa Llc Liquid distribution unit design for liquid cooling of electronic racks of a data center
US10925190B2 (en) 2018-06-04 2021-02-16 Baidu Usa Llc Leak detection and response system for liquid cooling of electronic racks of a data center
US11467637B2 (en) * 2018-07-31 2022-10-11 Wuxi Kalannipu Thermal Management Technology Co., Ltd. Modular computer cooling system
US10921070B2 (en) 2018-12-14 2021-02-16 Quanta Computer Inc. Connector assembly for liquid cooling
US11662037B2 (en) * 2019-01-18 2023-05-30 Coolit Systems, Inc. Fluid flow control valve for fluid flow systems, and methods
US11473860B2 (en) 2019-04-25 2022-10-18 Coolit Systems, Inc. Cooling module with leak detector and related systems
CN114144743A (zh) 2019-05-15 2022-03-04 上游数据公司 移动式区块链挖矿系统和使用方法
US11490546B2 (en) 2019-05-21 2022-11-01 Iceotope Group Limited Cooling system for electronic modules
US11089715B2 (en) * 2019-09-17 2021-08-10 Baidu Usa Llc Cooling chassis design for server liquid cooling of electronic racks of a data center
US11032949B2 (en) * 2019-09-30 2021-06-08 Baidu Usa Llc Method for deploying liquid cooling solution in an air-cooled data center room
CN111077957B (zh) * 2019-11-14 2021-07-30 苏州浪潮智能科技有限公司 一种多途径服务器冷却系统
US11330741B2 (en) * 2020-03-26 2022-05-10 Baidu Usa Llc Modular design of blind mate interface for liquid cooling
US11395443B2 (en) 2020-05-11 2022-07-19 Coolit Systems, Inc. Liquid pumping units, and related systems and methods
US11388832B2 (en) * 2020-05-28 2022-07-12 Baidu Usa Llc Blind-mate connection design for liquid-cooled electronic racks
US11822398B2 (en) * 2020-11-30 2023-11-21 Nvidia Corporation Intelligent and redundant air-cooled cooling loop for datacenter cooling systems
US11829215B2 (en) * 2020-11-30 2023-11-28 Nvidia Corporation Intelligent and redundant liquid-cooled cooling loop for datacenter cooling systems
US11924998B2 (en) 2021-04-01 2024-03-05 Ovh Hybrid immersion cooling system for rack-mounted electronic assemblies
CA3151725A1 (en) 2021-04-01 2022-10-01 Ovh Immersion cooling system with dual dielectric cooling liquid circulation
CN113115574B (zh) * 2021-04-19 2021-10-15 佛山市液冷时代科技有限公司 一种数据中心相变传热模组分离式液冷系统及其控制方法
US11868189B2 (en) * 2021-09-01 2024-01-09 Quanta Computer Inc. Systems and methods for controlling leaks in liquid cooling systems for computer devices
US20230389230A1 (en) * 2022-05-27 2023-11-30 Baidu Usa Llc Server and cooling system for enhanced immersion cooling

Family Cites Families (61)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6796372B2 (en) * 2001-06-12 2004-09-28 Liebert Corporation Single or dual buss thermal transfer system
US6981543B2 (en) 2001-09-20 2006-01-03 Intel Corporation Modular capillary pumped loop cooling system
US6700785B2 (en) * 2002-01-04 2004-03-02 Intel Corporation Computer system which locks a server unit subassembly in a selected position in a support frame
US6807056B2 (en) 2002-09-24 2004-10-19 Hitachi, Ltd. Electronic equipment
US6970355B2 (en) 2002-11-20 2005-11-29 International Business Machines Corporation Frame level partial cooling boost for drawer and/or node level processors
JP4199018B2 (ja) 2003-02-14 2008-12-17 株式会社日立製作所 ラックマウントサーバシステム
DE20308158U1 (de) 2003-03-07 2003-07-31 Rittal Gmbh & Co Kg Flüssigkeits-Kühlsystem
DE10310282A1 (de) * 2003-03-07 2004-09-16 Rittal Gmbh & Co. Kg Flüssigkeits-Kühlsystem
US6763880B1 (en) 2003-06-26 2004-07-20 Evserv Tech Corporation Liquid cooled radiation module for servers
US6819563B1 (en) 2003-07-02 2004-11-16 International Business Machines Corporation Method and system for cooling electronics racks using pre-cooled air
US7012807B2 (en) 2003-09-30 2006-03-14 International Business Machines Corporation Thermal dissipation assembly and fabrication method for electronics drawer of a multiple-drawer electronics rack
EP1682995A2 (en) 2003-11-07 2006-07-26 Asetek A/S Cooling system for a computer system
US20050128705A1 (en) 2003-12-16 2005-06-16 International Business Machines Corporation Composite cold plate assembly
US6896612B1 (en) 2004-01-26 2005-05-24 Sun Microsystems, Inc. Self-cooled electronic equipment enclosure with failure tolerant cooling system and method of operation
US7359197B2 (en) * 2004-04-12 2008-04-15 Nvidia Corporation System for efficiently cooling a processor
US7420804B2 (en) 2004-06-30 2008-09-02 Intel Corporation Liquid cooling system including hot-swappable components
US7380409B2 (en) * 2004-09-30 2008-06-03 International Business Machines Corporation Isolation valve and coolant connect/disconnect assemblies and methods of fabrication for interfacing a liquid cooled electronics subsystem and an electronics housing
US7277282B2 (en) 2004-12-27 2007-10-02 Intel Corporation Integrated circuit cooling system including heat pipes and external heat sink
US7345877B2 (en) * 2005-01-06 2008-03-18 The Boeing Company Cooling apparatus, system, and associated method
US20060187638A1 (en) 2005-02-24 2006-08-24 Vinson Wade D System and method for liquid cooling of an electronic device
DK3056968T3 (en) 2005-05-06 2018-10-08 Asetek Danmark As Cooling system for a computer system
US7438124B2 (en) 2005-10-04 2008-10-21 Delphi Technologies, Inc. Evaporative cooling system for a data-communications cabinet
US7551442B2 (en) * 2005-12-05 2009-06-23 Nvidia Corporation Embedded heat pipe in a hybrid cooling system
TW200805042A (en) 2006-02-16 2008-01-16 Cooligy Inc Liquid cooling loops for server applications
US8289710B2 (en) * 2006-02-16 2012-10-16 Liebert Corporation Liquid cooling systems for server applications
CN101523119B (zh) 2006-06-01 2012-12-19 埃克弗洛普公司 用于向电子设备提供冷却的空气的系统及方法
US20070297136A1 (en) * 2006-06-23 2007-12-27 Sun Micosystems, Inc. Modular liquid cooling of electronic components while preserving data center integrity
JP4789760B2 (ja) 2006-09-19 2011-10-12 富士通株式会社 電子機器及びラック状装置
US7372698B1 (en) 2006-12-21 2008-05-13 Isothermal Systems Research, Inc. Electronics equipment heat exchanger system
US7525207B2 (en) 2007-02-26 2009-04-28 Google Inc. Water-based data center
US7957132B2 (en) 2007-04-16 2011-06-07 Fried Stephen S Efficiently cool data centers and electronic enclosures using loop heat pipes
US20090027856A1 (en) 2007-07-26 2009-01-29 Mccoy Scott Blade cooling system using wet and dry heat sinks
US9496200B2 (en) 2011-07-27 2016-11-15 Coolit Systems, Inc. Modular heat-transfer systems
US8051672B2 (en) 2007-08-30 2011-11-08 Afco Systems Fluid cooled cabinet for electronic equipment
DE102007045733B3 (de) * 2007-09-25 2009-02-05 Qimonda Ag Speichermodul, Hauptplatine, Computersystem und Wärmeübertragungssystem
US9025330B2 (en) 2007-09-30 2015-05-05 Alcatel Lucent Recirculating gas rack cooling architecture
US7757506B2 (en) * 2007-11-19 2010-07-20 International Business Machines Corporation System and method for facilitating cooling of a liquid-cooled electronics rack
US8387249B2 (en) 2007-11-19 2013-03-05 International Business Machines Corporation Apparatus and method for facilitating servicing of a liquid-cooled electronics rack
US7660109B2 (en) 2007-12-17 2010-02-09 International Business Machines Corporation Apparatus and method for facilitating cooling of an electronics system
US8164901B2 (en) 2008-04-16 2012-04-24 Julius Neudorfer High efficiency heat removal system for rack mounted computer equipment
TWI559843B (zh) 2008-04-21 2016-11-21 液體冷卻解決方案股份有限公司 用於電子裝置液體浸沒冷卻之陣列連接式殼體及機架系統
US7626820B1 (en) * 2008-05-15 2009-12-01 Sun Microsystems, Inc. Thermal transfer technique using heat pipes with integral rack rails
EP3270261A1 (en) 2008-05-21 2018-01-17 Asetek A/S Graphics card thermal interposer
US7639499B1 (en) 2008-07-07 2009-12-29 International Business Machines Corporation Liquid cooling apparatus and method for facilitating cooling of an electronics system
US20100032140A1 (en) 2008-08-06 2010-02-11 Sun Microsystems, Inc. Liquid cooled rack with optimized liquid flow path driven by electronic cooling demand
US20100085708A1 (en) 2008-10-07 2010-04-08 Liebert Corporation High-efficiency, fluid-cooled ups converter
US7944694B2 (en) * 2008-10-23 2011-05-17 International Business Machines Corporation Liquid cooling apparatus and method for cooling blades of an electronic system chassis
CN102217432B (zh) 2008-11-14 2014-06-11 克尼尔有限责任公司 调节设备机箱中冷却气体的方法和传感器装置
CN101902895A (zh) 2009-05-27 2010-12-01 鸿富锦精密工业(深圳)有限公司 散热系统
US20110056675A1 (en) 2009-09-09 2011-03-10 International Business Machines Corporation Apparatus and method for adjusting coolant flow resistance through liquid-cooled electronics rack(s)
US8094453B2 (en) 2009-09-30 2012-01-10 International Business Machines Corporation Compliant conduction rail assembly and method facilitating cooling of an electronics structure
DK2609800T3 (da) 2010-08-26 2020-02-24 Asetek Danmark As Væskekølesystem til en server
TW201212798A (en) 2010-09-02 2012-03-16 Hon Hai Prec Ind Co Ltd Computer server cabinet
US8358505B2 (en) 2010-10-28 2013-01-22 Asetek A/S Integrated liquid cooling system
US8432691B2 (en) 2010-10-28 2013-04-30 Asetek A/S Liquid cooling system for an electronic system
TWI422318B (zh) * 2010-10-29 2014-01-01 Ind Tech Res Inst 數據機房
US8456833B2 (en) * 2010-11-02 2013-06-04 International Business Machines Corporation Fluid cooling system and associated fitting assembly for electronic component
TWI392432B (zh) * 2010-11-23 2013-04-01 Inventec Corp 一種伺服器機櫃
US8493738B2 (en) 2011-05-06 2013-07-23 International Business Machines Corporation Cooled electronic system with thermal spreaders coupling electronics cards to cold rails
US9155230B2 (en) * 2011-11-28 2015-10-06 Asetek Danmark A/S Cooling system for a server
US9795065B2 (en) * 2015-12-21 2017-10-17 Dell Products, L.P. Integrated air-spring for hydraulic force damping of a rigid liquid cooling subsystem

Also Published As

Publication number Publication date
EP3531812A1 (en) 2019-08-28
EP2786647A2 (en) 2014-10-08
US20150382514A1 (en) 2015-12-31
EP2786647B1 (en) 2019-04-17
CN104054407A (zh) 2014-09-17
DK2786647T3 (da) 2019-07-15
WO2013080037A2 (en) 2013-06-06
US20120147553A1 (en) 2012-06-14
WO2013080037A3 (en) 2013-11-07
US9717166B2 (en) 2017-07-25
US20170332520A1 (en) 2017-11-16
CN104054407B (zh) 2017-07-18
ES2731728T3 (es) 2019-11-18
US9155230B2 (en) 2015-10-06
US10212857B2 (en) 2019-02-19
US20190150322A1 (en) 2019-05-16
CN107102711A (zh) 2017-08-29
HK1202212A1 (en) 2015-10-02

Similar Documents

Publication Publication Date Title
HK1202212A1 (en) Cooling system for a server
HK1187191A1 (zh) 用於服務器的液體冷卻系統
AP3465A (en) Subsea cooling system
EP2673739A4 (en) INVENTORY MANAGEMENT SYSTEM
GB201105902D0 (en) Location system
GB2513492B (en) Tape drive system server
EP2751747A4 (en) REGAL MONITORING SYSTEM
EP2549388A4 (en) COMPUTER SYSTEM
GB201117289D0 (en) An oil cooling system
EP2756576A4 (en) CENTRIC SYSTEM MANAGEMENT
EP2719500A4 (en) PART PROCESSING SYSTEM
EP2773011A4 (en) POWER STORAGE SYSTEM
AP2013007315A0 (en) A mounting system
GB2489082B (en) Transport system for heavy-duty equipment
EP2681696A4 (en) PROJECT MANAGEMENT SYSTEM
GB2495599B (en) Database management system
EP2695031A4 (en) HEAT CONTROL SYSTEM
GB201102347D0 (en) Positioning system
IL231112A0 (en) A cooling system based on a desiccant
PL2768638T3 (pl) Układ tnący maszynki do strzyżenia włosów
EP2691304A4 (en) AIR-SUPPORTED COOLING SYSTEM
GB201118417D0 (en) Engine cooling system
EP2741811A4 (en) SYSTEM FOR THE TREATMENT OF SYMPTOMS
GB201200599D0 (en) Air-catching apparatus for a refrigerated cabiinet
GB2496419B (en) An enclosure for a HVAC system