PL2786647T3 - Układ chłodzenia dla serwera - Google Patents

Układ chłodzenia dla serwera

Info

Publication number
PL2786647T3
PL2786647T3 PL12819130T PL12819130T PL2786647T3 PL 2786647 T3 PL2786647 T3 PL 2786647T3 PL 12819130 T PL12819130 T PL 12819130T PL 12819130 T PL12819130 T PL 12819130T PL 2786647 T3 PL2786647 T3 PL 2786647T3
Authority
PL
Poland
Prior art keywords
server
cooling system
cooling
Prior art date
Application number
PL12819130T
Other languages
English (en)
Inventor
Andre Sloth Eriksen
Original Assignee
Asetek Danmark A/S
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asetek Danmark A/S filed Critical Asetek Danmark A/S
Publication of PL2786647T3 publication Critical patent/PL2786647T3/pl

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change
    • H05K7/20781—Liquid cooling without phase change within cabinets for removing heat from server blades
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1485—Servers; Data center rooms, e.g. 19-inch computer racks
    • H05K7/1488—Cabinets therefor, e.g. chassis or racks or mechanical interfaces between blades and support structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20254—Cold plates transferring heat from heat source to coolant
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20263—Heat dissipaters releasing heat from coolant
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change
    • H05K7/20772—Liquid cooling without phase change within server blades for removing heat from heat source
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
PL12819130T 2011-11-28 2012-10-23 Układ chłodzenia dla serwera PL2786647T3 (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/304,813 US9155230B2 (en) 2011-11-28 2011-11-28 Cooling system for a server
PCT/IB2012/002702 WO2013080037A2 (en) 2011-11-28 2012-10-23 Cooling system for a server
EP12819130.1A EP2786647B1 (en) 2011-11-28 2012-10-23 Cooling system for a server

Publications (1)

Publication Number Publication Date
PL2786647T3 true PL2786647T3 (pl) 2020-03-31

Family

ID=46199195

Family Applications (1)

Application Number Title Priority Date Filing Date
PL12819130T PL2786647T3 (pl) 2011-11-28 2012-10-23 Układ chłodzenia dla serwera

Country Status (8)

Country Link
US (4) US9155230B2 (pl)
EP (2) EP3531812A1 (pl)
CN (2) CN107102711A (pl)
DK (1) DK2786647T3 (pl)
ES (1) ES2731728T3 (pl)
HK (1) HK1202212A1 (pl)
PL (1) PL2786647T3 (pl)
WO (1) WO2013080037A2 (pl)

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Also Published As

Publication number Publication date
ES2731728T3 (es) 2019-11-18
US20190150322A1 (en) 2019-05-16
EP2786647A2 (en) 2014-10-08
EP3531812A1 (en) 2019-08-28
EP2786647B1 (en) 2019-04-17
US9717166B2 (en) 2017-07-25
US9155230B2 (en) 2015-10-06
WO2013080037A2 (en) 2013-06-06
CN104054407A (zh) 2014-09-17
HK1202212A1 (en) 2015-10-02
US20150382514A1 (en) 2015-12-31
US20170332520A1 (en) 2017-11-16
CN104054407B (zh) 2017-07-18
DK2786647T3 (da) 2019-07-15
CN107102711A (zh) 2017-08-29
US20120147553A1 (en) 2012-06-14
US10212857B2 (en) 2019-02-19
WO2013080037A3 (en) 2013-11-07

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