HK1187191A1 - 用於服務器的液體冷卻系統 - Google Patents

用於服務器的液體冷卻系統

Info

Publication number
HK1187191A1
HK1187191A1 HK13113747.4A HK13113747A HK1187191A1 HK 1187191 A1 HK1187191 A1 HK 1187191A1 HK 13113747 A HK13113747 A HK 13113747A HK 1187191 A1 HK1187191 A1 HK 1187191A1
Authority
HK
Hong Kong
Prior art keywords
server
cooling system
liquid cooling
liquid
cooling
Prior art date
Application number
HK13113747.4A
Other languages
English (en)
Inventor
．布蘭頓 斯蒂文．
Original Assignee
阿塞泰克丹麥公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=44545955&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=HK1187191(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 阿塞泰克丹麥公司 filed Critical 阿塞泰克丹麥公司
Publication of HK1187191A1 publication Critical patent/HK1187191A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20254—Cold plates transferring heat from heat source to coolant
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20754—Air circulating in closed loop within cabinets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20263—Heat dissipaters releasing heat from coolant
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change
    • H05K7/20781—Liquid cooling without phase change within cabinets for removing heat from server blades
HK13113747.4A 2010-08-26 2013-12-11 用於服務器的液體冷卻系統 HK1187191A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US37724910P 2010-08-26 2010-08-26
PCT/US2011/048735 WO2012027319A1 (en) 2010-08-26 2011-08-23 Liquid cooling system for a server

Publications (1)

Publication Number Publication Date
HK1187191A1 true HK1187191A1 (zh) 2014-03-28

Family

ID=44545955

Family Applications (2)

Application Number Title Priority Date Filing Date
HK13113747.4A HK1187191A1 (zh) 2010-08-26 2013-12-11 用於服務器的液體冷卻系統
HK16111002.5A HK1222973A1 (zh) 2010-08-26 2016-09-20 用於計算機服務器機架的冷卻系統

Family Applications After (1)

Application Number Title Priority Date Filing Date
HK16111002.5A HK1222973A1 (zh) 2010-08-26 2016-09-20 用於計算機服務器機架的冷卻系統

Country Status (8)

Country Link
US (5) US8724315B2 (zh)
EP (1) EP2609800B1 (zh)
CN (2) CN105828574B (zh)
DK (1) DK2609800T3 (zh)
ES (1) ES2769605T3 (zh)
HK (2) HK1187191A1 (zh)
PL (1) PL2609800T3 (zh)
WO (1) WO2012027319A1 (zh)

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Also Published As

Publication number Publication date
US20140246178A1 (en) 2014-09-04
US9907206B2 (en) 2018-02-27
WO2012027319A1 (en) 2012-03-01
US20140168889A1 (en) 2014-06-19
ES2769605T3 (es) 2020-06-26
CN105828574B (zh) 2018-09-21
US10136551B2 (en) 2018-11-20
CN105828574A (zh) 2016-08-03
EP2609800A1 (en) 2013-07-03
CN103168509A (zh) 2013-06-19
DK2609800T3 (da) 2020-02-24
US8724315B2 (en) 2014-05-13
US20180160566A1 (en) 2018-06-07
EP2609800B1 (en) 2019-11-20
US9089078B2 (en) 2015-07-21
US20150319883A1 (en) 2015-11-05
HK1222973A1 (zh) 2017-07-14
CN103168509B (zh) 2016-03-23
US20110303394A1 (en) 2011-12-15
WO2012027319A8 (en) 2012-05-18
US8749968B1 (en) 2014-06-10
PL2609800T3 (pl) 2020-05-18

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