PH12015501652A1 - Color-based linear three dimensional acquisition system and method - Google Patents

Color-based linear three dimensional acquisition system and method

Info

Publication number
PH12015501652A1
PH12015501652A1 PH12015501652A PH12015501652A PH12015501652A1 PH 12015501652 A1 PH12015501652 A1 PH 12015501652A1 PH 12015501652 A PH12015501652 A PH 12015501652A PH 12015501652 A PH12015501652 A PH 12015501652A PH 12015501652 A1 PH12015501652 A1 PH 12015501652A1
Authority
PH
Philippines
Prior art keywords
imaging system
electronic substrate
sensor assembly
image sensor
dimensional image
Prior art date
Application number
PH12015501652A
Other languages
English (en)
Other versions
PH12015501652B1 (en
Inventor
David P Prince
Original Assignee
Illinois Tool Works
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Illinois Tool Works filed Critical Illinois Tool Works
Publication of PH12015501652B1 publication Critical patent/PH12015501652B1/en
Publication of PH12015501652A1 publication Critical patent/PH12015501652A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/225—Correcting or repairing of printed circuits
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G01B11/25—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object
    • G01B11/2509—Color coding
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0469—Surface mounting by applying a glue or viscous material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0817—Monitoring of soldering processes

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Operations Research (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Supply And Installment Of Electrical Components (AREA)
PH12015501652A 2013-03-12 2015-07-24 Color-based linear three dimensional acquisition system and method PH12015501652A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/796,512 US8939074B2 (en) 2013-03-12 2013-03-12 Color-based linear three dimensional acquisition system and method
PCT/US2014/017225 WO2014158483A1 (en) 2013-03-12 2014-02-19 Color-based linear three dimensional acquisition system and method

Publications (2)

Publication Number Publication Date
PH12015501652B1 PH12015501652B1 (en) 2015-10-19
PH12015501652A1 true PH12015501652A1 (en) 2015-10-19

Family

ID=50190847

Family Applications (1)

Application Number Title Priority Date Filing Date
PH12015501652A PH12015501652A1 (en) 2013-03-12 2015-07-24 Color-based linear three dimensional acquisition system and method

Country Status (8)

Country Link
US (1) US8939074B2 (https=)
EP (1) EP2972074A1 (https=)
JP (1) JP6431029B2 (https=)
KR (1) KR102090856B1 (https=)
CN (1) CN105026882A (https=)
PH (1) PH12015501652A1 (https=)
TW (1) TWI676559B (https=)
WO (1) WO2014158483A1 (https=)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11176635B2 (en) 2013-01-25 2021-11-16 Cyberoptics Corporation Automatic programming of solder paste inspection system
US9743527B2 (en) * 2013-08-09 2017-08-22 CyberOptics Corporaiton Stencil programming and inspection using solder paste inspection system
US9370925B1 (en) 2015-03-25 2016-06-21 Illinois Tool Works Inc. Stencil printer having stencil shuttle assembly
US9370924B1 (en) 2015-03-25 2016-06-21 Illinois Tool Works Inc. Dual action stencil wiper assembly for stencil printer
US10723117B2 (en) 2015-04-07 2020-07-28 Illinois Tool Works Inc. Lift tool assembly for stencil printer
US9370923B1 (en) 2015-04-07 2016-06-21 Illinois Tool Works Inc. Lift tool assembly for stencil printer
US10703089B2 (en) 2015-04-07 2020-07-07 Illinois Tool Works Inc. Edge lock assembly for a stencil printer
TWI571714B (zh) * 2015-06-15 2017-02-21 Printing Tech Res Inst Method of making multi - angle color guide table
US10565701B2 (en) * 2015-11-16 2020-02-18 Applied Materials, Inc. Color imaging for CMP monitoring
US11557048B2 (en) 2015-11-16 2023-01-17 Applied Materials, Inc. Thickness measurement of substrate using color metrology
KR102508426B1 (ko) 2016-01-29 2023-03-09 삼성전자주식회사 경도 검출이 가능한 센싱장치, 이를 구비한 모바일 기기, 및 이를 이용한 3차원 인쇄장치
EP3439449B1 (en) * 2016-03-29 2021-06-30 Fuji Corporation Operation checking device of electronic component mounting machine
CN106879249A (zh) * 2017-04-26 2017-06-20 航天科技控股集团股份有限公司 印制板组件自动检测设备
EP4268757B1 (en) * 2017-10-06 2025-03-26 VISIE Inc. Generation of one or more edges of luminosity to form three-dimensional models of objects
EP3480585A1 (en) * 2017-11-07 2019-05-08 ASM Assembly Systems GmbH & Co. KG Stencil inspection by means of a solder paste inspection device
KR102091935B1 (ko) * 2018-08-29 2020-03-20 주식회사 프로텍 3차원 스캐너를 이용한 점성 용액 디스펜싱 방법
US11100628B2 (en) 2019-02-07 2021-08-24 Applied Materials, Inc. Thickness measurement of substrate using color metrology
CN110399878B (zh) * 2019-06-14 2023-05-26 南京火眼锐视信息科技有限公司 表格版式恢复方法，计算机可读介质以及计算机
US12135353B2 (en) * 2019-11-15 2024-11-05 Tektronix, Inc. Indirect acquisition of a signal from a device under test
EP4064813A1 (de) * 2021-03-26 2022-09-28 Siemens Aktiengesellschaft Verfahren zur überwachung einer smd-fertigung und smd-fertigungsstrasse
CN113183608B (zh) * 2021-04-23 2022-04-22 广州诚鼎机器人有限公司 一种浆料补充设备和椭圆印花机
DE102022132162A1 (de) * 2022-12-05 2024-06-06 Witrins S.R.O. Verfahren zur Fehleranalyse und Inspektionssystem

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3173050B2 (ja) * 1991-07-30 2001-06-04 オムロン株式会社 教示データ作成方法およびその方法を用いた教示データ作成装置
JPH09201558A (ja) * 1996-01-29 1997-08-05 Techno Kapura:Kk 塗布装置
US7570798B2 (en) * 1998-01-16 2009-08-04 Beaty Elwin M Method of manufacturing ball array devices using an inspection apparatus having one or more cameras and ball array devices produced according to the method
US7072503B2 (en) 1999-05-04 2006-07-04 Speedline Technologies, Inc. Systems and methods for detecting defects in printed solder paste
US6738505B1 (en) 1999-05-04 2004-05-18 Speedline Technologies, Inc. Method and apparatus for detecting solder paste deposits on substrates
US6891967B2 (en) 1999-05-04 2005-05-10 Speedline Technologies, Inc. Systems and methods for detecting defects in printed solder paste
US6541063B1 (en) 1999-11-04 2003-04-01 Speedline Technologies, Inc. Calibration of a dispensing system
KR100406843B1 (ko) * 2001-04-06 2003-11-21 (주) 인텍플러스 색정보를 이용한 실시간 3차원 표면형상 측정방법 및 장치
US7404861B2 (en) 2004-04-23 2008-07-29 Speedline Technologies, Inc. Imaging and inspection system for a dispenser and method for same
US20050268799A1 (en) 2004-06-02 2005-12-08 Speedline Technologies, Inc. Solder paste lateral flow and redistribution system and methods of same
US7961912B2 (en) * 2004-10-14 2011-06-14 Stevick Glen R Method and apparatus for dynamic space-time imaging system
US20070102477A1 (en) 2005-11-10 2007-05-10 Speedline Technologies, Inc. Imaging system and method for a stencil printer
US7458318B2 (en) 2006-02-01 2008-12-02 Speedline Technologies, Inc. Off-axis illumination assembly and method
JP2007271395A (ja) * 2006-03-30 2007-10-18 Brother Ind Ltd ３次元色形状計測装置
US20080156207A1 (en) 2006-12-28 2008-07-03 Dan Ellenbogen Stencil printers and the like, optical systems therefor, and methods of printing and inspection
US7710611B2 (en) 2007-02-16 2010-05-04 Illinois Tool Works, Inc. Single and multi-spectral illumination system and method
US7923056B2 (en) * 2007-06-01 2011-04-12 Illinois Tool Works Inc. Method and apparatus for dispensing material on a substrate
EP2208354A4 (en) * 2007-10-10 2010-12-22 Gerard Dirk Smits IMAGE PROJECTOR WITH REFLECTIVE LIGHT TRACKING
EP2196765A1 (en) 2008-12-09 2010-06-16 WiTrins s.r.o. Measuring the outer dimensions of an object
CZ2009133A3 (cs) * 2009-03-03 2009-07-08 Witrins S.R.O. Zarízení, zpusob merení vnejších rozmeru testovaného výrobku a použití tohoto zarízení
US8872912B2 (en) * 2009-09-22 2014-10-28 Cyberoptics Corporation High speed distributed optical sensor inspection system
US20130136850A1 (en) 2011-11-29 2013-05-30 Illinois Tool Works Inc. Method for depositing materials on a substrate
US20130133574A1 (en) 2011-11-29 2013-05-30 Illinois Tool Works Inc. Material deposition system for depositing materials on a substrate

Also Published As

Publication number Publication date
KR102090856B1 (ko) 2020-05-27
KR20150123817A (ko) 2015-11-04
TW201437043A (zh) 2014-10-01
US8939074B2 (en) 2015-01-27
CN105026882A (zh) 2015-11-04
TWI676559B (zh) 2019-11-11
PH12015501652B1 (en) 2015-10-19
WO2014158483A1 (en) 2014-10-02
EP2972074A1 (en) 2016-01-20
JP2016512330A (ja) 2016-04-25
JP6431029B2 (ja) 2018-11-28
US20140272103A1 (en) 2014-09-18

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