CN105026882A - 基于颜色的线性三维采集系统和方法 - Google Patents

基于颜色的线性三维采集系统和方法 Download PDF

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Publication number
CN105026882A
CN105026882A CN201480013198.5A CN201480013198A CN105026882A CN 105026882 A CN105026882 A CN 105026882A CN 201480013198 A CN201480013198 A CN 201480013198A CN 105026882 A CN105026882 A CN 105026882A
Authority
CN
China
Prior art keywords
electronic substrate
imaging system
spectrum
substrate
color
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201480013198.5A
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English (en)
Chinese (zh)
Inventor
大卫·P.·普林斯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Illinois Tool Works Inc
Original Assignee
Illinois Tool Works Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Illinois Tool Works Inc filed Critical Illinois Tool Works Inc
Publication of CN105026882A publication Critical patent/CN105026882A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/225—Correcting or repairing of printed circuits
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G01B11/25—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object
    • G01B11/2509—Color coding
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0469—Surface mounting by applying a glue or viscous material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0817—Monitoring of soldering processes

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Operations Research (AREA)
  • Analytical Chemistry (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • General Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
CN201480013198.5A 2013-03-12 2014-02-19 基于颜色的线性三维采集系统和方法 Pending CN105026882A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/796,512 US8939074B2 (en) 2013-03-12 2013-03-12 Color-based linear three dimensional acquisition system and method
US13/796,512 2013-03-12
PCT/US2014/017225 WO2014158483A1 (en) 2013-03-12 2014-02-19 Color-based linear three dimensional acquisition system and method

Publications (1)

Publication Number Publication Date
CN105026882A true CN105026882A (zh) 2015-11-04

Family

ID=50190847

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201480013198.5A Pending CN105026882A (zh) 2013-03-12 2014-02-19 基于颜色的线性三维采集系统和方法

Country Status (8)

Country Link
US (1) US8939074B2 (https=)
EP (1) EP2972074A1 (https=)
JP (1) JP6431029B2 (https=)
KR (1) KR102090856B1 (https=)
CN (1) CN105026882A (https=)
PH (1) PH12015501652B1 (https=)
TW (1) TWI676559B (https=)
WO (1) WO2014158483A1 (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110399878A (zh) * 2019-06-14 2019-11-01 南京火眼锐视信息科技有限公司 表格版式恢复方法，计算机可读介质以及计算机
CN113183608A (zh) * 2021-04-23 2021-07-30 广州诚鼎机器人有限公司 一种浆料补充设备和椭圆印花机
CN114777682A (zh) * 2017-10-06 2022-07-22 先进扫描仪公司 生成一个或多个亮度边缘以形成物体的三维模型
CN115023621A (zh) * 2019-11-15 2022-09-06 特克特朗尼克公司 从被测器件间接获取信号

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* Cited by examiner, † Cited by third party
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US11176635B2 (en) 2013-01-25 2021-11-16 Cyberoptics Corporation Automatic programming of solder paste inspection system
US9743527B2 (en) * 2013-08-09 2017-08-22 CyberOptics Corporaiton Stencil programming and inspection using solder paste inspection system
US9370925B1 (en) 2015-03-25 2016-06-21 Illinois Tool Works Inc. Stencil printer having stencil shuttle assembly
US9370924B1 (en) 2015-03-25 2016-06-21 Illinois Tool Works Inc. Dual action stencil wiper assembly for stencil printer
US9370923B1 (en) 2015-04-07 2016-06-21 Illinois Tool Works Inc. Lift tool assembly for stencil printer
US10703089B2 (en) 2015-04-07 2020-07-07 Illinois Tool Works Inc. Edge lock assembly for a stencil printer
US10723117B2 (en) 2015-04-07 2020-07-28 Illinois Tool Works Inc. Lift tool assembly for stencil printer
TWI571714B (zh) * 2015-06-15 2017-02-21 Printing Tech Res Inst Method of making multi - angle color guide table
US11557048B2 (en) 2015-11-16 2023-01-17 Applied Materials, Inc. Thickness measurement of substrate using color metrology
US10565701B2 (en) 2015-11-16 2020-02-18 Applied Materials, Inc. Color imaging for CMP monitoring
KR102508426B1 (ko) * 2016-01-29 2023-03-09 삼성전자주식회사 경도 검출이 가능한 센싱장치, 이를 구비한 모바일 기기, 및 이를 이용한 3차원 인쇄장치
JP6718502B2 (ja) * 2016-03-29 2020-07-08 株式会社Ｆｕｊｉ 電子部品装着機の動作確認装置
CN106879249A (zh) * 2017-04-26 2017-06-20 航天科技控股集团股份有限公司 印制板组件自动检测设备
EP3480585A1 (en) * 2017-11-07 2019-05-08 ASM Assembly Systems GmbH & Co. KG Stencil inspection by means of a solder paste inspection device
KR102091935B1 (ko) * 2018-08-29 2020-03-20 주식회사 프로텍 3차원 스캐너를 이용한 점성 용액 디스펜싱 방법
US11100628B2 (en) 2019-02-07 2021-08-24 Applied Materials, Inc. Thickness measurement of substrate using color metrology
EP4064813A1 (de) * 2021-03-26 2022-09-28 Siemens Aktiengesellschaft Verfahren zur überwachung einer smd-fertigung und smd-fertigungsstrasse
DE102022132162A1 (de) * 2022-12-05 2024-06-06 Witrins S.R.O. Verfahren zur Fehleranalyse und Inspektionssystem

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CN1161253A (zh) * 1996-01-29 1997-10-08 三星航空产业株式会社 涂敷设备
WO2002082009A1 (en) * 2001-04-06 2002-10-17 Intek Plus Co., Ltd. Method and apparatus for measuring the three-dimensional surface shape of an object using color informations of light reflected by the object
US20050235913A1 (en) * 2004-04-23 2005-10-27 Speedline Technologies, Inc. Imaging and inspection system for a dispenser and method for same
JP2007271395A (ja) * 2006-03-30 2007-10-18 Brother Ind Ltd ３次元色形状計測装置
US20080156207A1 (en) * 2006-12-28 2008-07-03 Dan Ellenbogen Stencil printers and the like, optical systems therefor, and methods of printing and inspection
CN101606448A (zh) * 2007-02-16 2009-12-16 伊利诺斯工具制品有限公司 单一和多光谱照明系统和方法
CN102037800A (zh) * 2008-03-25 2011-04-27 伊利诺斯工具制品有限公司 用于将材料分配到基板上的方法和装置
CN102282440A (zh) * 2009-03-03 2011-12-14 韦崔斯股份有限公司 用于光学地测量产品表面的方法和设备

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JP3173050B2 (ja) * 1991-07-30 2001-06-04 オムロン株式会社 教示データ作成方法およびその方法を用いた教示データ作成装置
US7570798B2 (en) * 1998-01-16 2009-08-04 Beaty Elwin M Method of manufacturing ball array devices using an inspection apparatus having one or more cameras and ball array devices produced according to the method
US6738505B1 (en) 1999-05-04 2004-05-18 Speedline Technologies, Inc. Method and apparatus for detecting solder paste deposits on substrates
US6891967B2 (en) 1999-05-04 2005-05-10 Speedline Technologies, Inc. Systems and methods for detecting defects in printed solder paste
US7072503B2 (en) 1999-05-04 2006-07-04 Speedline Technologies, Inc. Systems and methods for detecting defects in printed solder paste
US6541063B1 (en) 1999-11-04 2003-04-01 Speedline Technologies, Inc. Calibration of a dispensing system
US20050268799A1 (en) 2004-06-02 2005-12-08 Speedline Technologies, Inc. Solder paste lateral flow and redistribution system and methods of same
US7961912B2 (en) * 2004-10-14 2011-06-14 Stevick Glen R Method and apparatus for dynamic space-time imaging system
US20070102477A1 (en) 2005-11-10 2007-05-10 Speedline Technologies, Inc. Imaging system and method for a stencil printer
US7458318B2 (en) 2006-02-01 2008-12-02 Speedline Technologies, Inc. Off-axis illumination assembly and method
WO2009049272A2 (en) * 2007-10-10 2009-04-16 Gerard Dirk Smits Image projector with reflected light tracking
EP2196765A1 (en) 2008-12-09 2010-06-16 WiTrins s.r.o. Measuring the outer dimensions of an object
US8872912B2 (en) * 2009-09-22 2014-10-28 Cyberoptics Corporation High speed distributed optical sensor inspection system
US20130136850A1 (en) 2011-11-29 2013-05-30 Illinois Tool Works Inc. Method for depositing materials on a substrate
US20130133574A1 (en) 2011-11-29 2013-05-30 Illinois Tool Works Inc. Material deposition system for depositing materials on a substrate

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1161253A (zh) * 1996-01-29 1997-10-08 三星航空产业株式会社 涂敷设备
WO2002082009A1 (en) * 2001-04-06 2002-10-17 Intek Plus Co., Ltd. Method and apparatus for measuring the three-dimensional surface shape of an object using color informations of light reflected by the object
US20050235913A1 (en) * 2004-04-23 2005-10-27 Speedline Technologies, Inc. Imaging and inspection system for a dispenser and method for same
JP2007271395A (ja) * 2006-03-30 2007-10-18 Brother Ind Ltd ３次元色形状計測装置
US20080156207A1 (en) * 2006-12-28 2008-07-03 Dan Ellenbogen Stencil printers and the like, optical systems therefor, and methods of printing and inspection
CN101606448A (zh) * 2007-02-16 2009-12-16 伊利诺斯工具制品有限公司 单一和多光谱照明系统和方法
CN102037800A (zh) * 2008-03-25 2011-04-27 伊利诺斯工具制品有限公司 用于将材料分配到基板上的方法和装置
CN102282440A (zh) * 2009-03-03 2011-12-14 韦崔斯股份有限公司 用于光学地测量产品表面的方法和设备

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114777682A (zh) * 2017-10-06 2022-07-22 先进扫描仪公司 生成一个或多个亮度边缘以形成物体的三维模型
CN110399878A (zh) * 2019-06-14 2019-11-01 南京火眼锐视信息科技有限公司 表格版式恢复方法，计算机可读介质以及计算机
CN110399878B (zh) * 2019-06-14 2023-05-26 南京火眼锐视信息科技有限公司 表格版式恢复方法，计算机可读介质以及计算机
CN115023621A (zh) * 2019-11-15 2022-09-06 特克特朗尼克公司 从被测器件间接获取信号
CN113183608A (zh) * 2021-04-23 2021-07-30 广州诚鼎机器人有限公司 一种浆料补充设备和椭圆印花机
CN113183608B (zh) * 2021-04-23 2022-04-22 广州诚鼎机器人有限公司 一种浆料补充设备和椭圆印花机

Also Published As

Publication number Publication date
JP2016512330A (ja) 2016-04-25
US20140272103A1 (en) 2014-09-18
WO2014158483A1 (en) 2014-10-02
KR20150123817A (ko) 2015-11-04
JP6431029B2 (ja) 2018-11-28
PH12015501652A1 (en) 2015-10-19
TWI676559B (zh) 2019-11-11
TW201437043A (zh) 2014-10-01
EP2972074A1 (en) 2016-01-20
US8939074B2 (en) 2015-01-27
PH12015501652B1 (en) 2015-10-19
KR102090856B1 (ko) 2020-05-27

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C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication

Application publication date: 20151104

RJ01 Rejection of invention patent application after publication