JP6431029B2 - 色に基づく線形３次元捕捉システム及び方法 - Google Patents

色に基づく線形３次元捕捉システム及び方法 Download PDF

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JP6431029B2
JP6431029B2 JP2016500305A JP2016500305A JP6431029B2 JP 6431029 B2 JP6431029 B2 JP 6431029B2 JP 2016500305 A JP2016500305 A JP 2016500305A JP 2016500305 A JP2016500305 A JP 2016500305A JP 6431029 B2 JP6431029 B2 JP 6431029B2
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circuit board
stencil
spectrum
electronic substrate
light
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Japanese (ja)
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JP2016512330A (ja
JP2016512330A5 (https=
Inventor
ピー．プリンス デイビッド
ピー．プリンス デイビッド
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イリノイ トゥール ワークス インコーポレイティド
イリノイ トゥール ワークス インコーポレイティド
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/225—Correcting or repairing of printed circuits
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G01B11/25—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object
    • G01B11/2509—Color coding
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0469—Surface mounting by applying a glue or viscous material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0817—Monitoring of soldering processes

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Operations Research (AREA)
  • Analytical Chemistry (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • General Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
JP2016500305A 2013-03-12 2014-02-19 色に基づく線形３次元捕捉システム及び方法 Active JP6431029B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/796,512 US8939074B2 (en) 2013-03-12 2013-03-12 Color-based linear three dimensional acquisition system and method
US13/796,512 2013-03-12
PCT/US2014/017225 WO2014158483A1 (en) 2013-03-12 2014-02-19 Color-based linear three dimensional acquisition system and method

Publications (3)

Publication Number Publication Date
JP2016512330A JP2016512330A (ja) 2016-04-25
JP2016512330A5 JP2016512330A5 (https=) 2017-03-23
JP6431029B2 true JP6431029B2 (ja) 2018-11-28

Family

ID=50190847

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Application Number Title Priority Date Filing Date
JP2016500305A Active JP6431029B2 (ja) 2013-03-12 2014-02-19 色に基づく線形３次元捕捉システム及び方法

Country Status (8)

Country Link
US (1) US8939074B2 (https=)
EP (1) EP2972074A1 (https=)
JP (1) JP6431029B2 (https=)
KR (1) KR102090856B1 (https=)
CN (1) CN105026882A (https=)
PH (1) PH12015501652B1 (https=)
TW (1) TWI676559B (https=)
WO (1) WO2014158483A1 (https=)

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US11176635B2 (en) 2013-01-25 2021-11-16 Cyberoptics Corporation Automatic programming of solder paste inspection system
US9743527B2 (en) * 2013-08-09 2017-08-22 CyberOptics Corporaiton Stencil programming and inspection using solder paste inspection system
US9370925B1 (en) 2015-03-25 2016-06-21 Illinois Tool Works Inc. Stencil printer having stencil shuttle assembly
US9370924B1 (en) 2015-03-25 2016-06-21 Illinois Tool Works Inc. Dual action stencil wiper assembly for stencil printer
US9370923B1 (en) 2015-04-07 2016-06-21 Illinois Tool Works Inc. Lift tool assembly for stencil printer
US10703089B2 (en) 2015-04-07 2020-07-07 Illinois Tool Works Inc. Edge lock assembly for a stencil printer
US10723117B2 (en) 2015-04-07 2020-07-28 Illinois Tool Works Inc. Lift tool assembly for stencil printer
TWI571714B (zh) * 2015-06-15 2017-02-21 Printing Tech Res Inst Method of making multi - angle color guide table
US11557048B2 (en) 2015-11-16 2023-01-17 Applied Materials, Inc. Thickness measurement of substrate using color metrology
US10565701B2 (en) 2015-11-16 2020-02-18 Applied Materials, Inc. Color imaging for CMP monitoring
KR102508426B1 (ko) * 2016-01-29 2023-03-09 삼성전자주식회사 경도 검출이 가능한 센싱장치, 이를 구비한 모바일 기기, 및 이를 이용한 3차원 인쇄장치
JP6718502B2 (ja) * 2016-03-29 2020-07-08 株式会社Ｆｕｊｉ 電子部品装着機の動作確認装置
CN106879249A (zh) * 2017-04-26 2017-06-20 航天科技控股集团股份有限公司 印制板组件自动检测设备
CN114777682A (zh) * 2017-10-06 2022-07-22 先进扫描仪公司 生成一个或多个亮度边缘以形成物体的三维模型
EP3480585A1 (en) * 2017-11-07 2019-05-08 ASM Assembly Systems GmbH & Co. KG Stencil inspection by means of a solder paste inspection device
KR102091935B1 (ko) * 2018-08-29 2020-03-20 주식회사 프로텍 3차원 스캐너를 이용한 점성 용액 디스펜싱 방법
US11100628B2 (en) 2019-02-07 2021-08-24 Applied Materials, Inc. Thickness measurement of substrate using color metrology
CN110399878B (zh) * 2019-06-14 2023-05-26 南京火眼锐视信息科技有限公司 表格版式恢复方法，计算机可读介质以及计算机
US12135353B2 (en) * 2019-11-15 2024-11-05 Tektronix, Inc. Indirect acquisition of a signal from a device under test
EP4064813A1 (de) * 2021-03-26 2022-09-28 Siemens Aktiengesellschaft Verfahren zur überwachung einer smd-fertigung und smd-fertigungsstrasse
CN113183608B (zh) * 2021-04-23 2022-04-22 广州诚鼎机器人有限公司 一种浆料补充设备和椭圆印花机
DE102022132162A1 (de) * 2022-12-05 2024-06-06 Witrins S.R.O. Verfahren zur Fehleranalyse und Inspektionssystem

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JP3173050B2 (ja) * 1991-07-30 2001-06-04 オムロン株式会社 教示データ作成方法およびその方法を用いた教示データ作成装置
JPH09201558A (ja) * 1996-01-29 1997-08-05 Techno Kapura:Kk 塗布装置
US7570798B2 (en) * 1998-01-16 2009-08-04 Beaty Elwin M Method of manufacturing ball array devices using an inspection apparatus having one or more cameras and ball array devices produced according to the method
US6738505B1 (en) 1999-05-04 2004-05-18 Speedline Technologies, Inc. Method and apparatus for detecting solder paste deposits on substrates
US6891967B2 (en) 1999-05-04 2005-05-10 Speedline Technologies, Inc. Systems and methods for detecting defects in printed solder paste
US7072503B2 (en) 1999-05-04 2006-07-04 Speedline Technologies, Inc. Systems and methods for detecting defects in printed solder paste
US6541063B1 (en) 1999-11-04 2003-04-01 Speedline Technologies, Inc. Calibration of a dispensing system
KR100406843B1 (ko) * 2001-04-06 2003-11-21 (주) 인텍플러스 색정보를 이용한 실시간 3차원 표면형상 측정방법 및 장치
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JP2007271395A (ja) * 2006-03-30 2007-10-18 Brother Ind Ltd ３次元色形状計測装置
US20080156207A1 (en) 2006-12-28 2008-07-03 Dan Ellenbogen Stencil printers and the like, optical systems therefor, and methods of printing and inspection
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US7923056B2 (en) * 2007-06-01 2011-04-12 Illinois Tool Works Inc. Method and apparatus for dispensing material on a substrate
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CZ2009133A3 (cs) * 2009-03-03 2009-07-08 Witrins S.R.O. Zarízení, zpusob merení vnejších rozmeru testovaného výrobku a použití tohoto zarízení
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US20130133574A1 (en) 2011-11-29 2013-05-30 Illinois Tool Works Inc. Material deposition system for depositing materials on a substrate

Also Published As

Publication number Publication date
JP2016512330A (ja) 2016-04-25
US20140272103A1 (en) 2014-09-18
WO2014158483A1 (en) 2014-10-02
KR20150123817A (ko) 2015-11-04
CN105026882A (zh) 2015-11-04
PH12015501652A1 (en) 2015-10-19
TWI676559B (zh) 2019-11-11
TW201437043A (zh) 2014-10-01
EP2972074A1 (en) 2016-01-20
US8939074B2 (en) 2015-01-27
PH12015501652B1 (en) 2015-10-19
KR102090856B1 (ko) 2020-05-27

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