TWI676559B - 具有基於色彩的線性三維擷取系統之材料施用器 - Google Patents
具有基於色彩的線性三維擷取系統之材料施用器 Download PDFInfo
- Publication number
- TWI676559B TWI676559B TW103105674A TW103105674A TWI676559B TW I676559 B TWI676559 B TW I676559B TW 103105674 A TW103105674 A TW 103105674A TW 103105674 A TW103105674 A TW 103105674A TW I676559 B TWI676559 B TW I676559B
- Authority
- TW
- Taiwan
- Prior art keywords
- imaging system
- electronic substrate
- circuit board
- screen
- spectrum
- Prior art date
Links
- 239000000463 material Substances 0.000 title claims abstract description 91
- 239000000758 substrate Substances 0.000 claims abstract description 95
- 238000003384 imaging method Methods 0.000 claims abstract description 76
- 238000001228 spectrum Methods 0.000 claims abstract description 34
- 230000008021 deposition Effects 0.000 claims description 49
- 229910000679 solder Inorganic materials 0.000 claims description 43
- 230000003287 optical effect Effects 0.000 claims description 24
- 239000003086 colorant Substances 0.000 claims description 7
- 230000000694 effects Effects 0.000 claims description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 2
- 238000004587 chromatography analysis Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 33
- 238000000151 deposition Methods 0.000 description 54
- 238000007650 screen-printing Methods 0.000 description 24
- 238000007639 printing Methods 0.000 description 22
- 238000009826 distribution Methods 0.000 description 14
- 230000032258 transport Effects 0.000 description 11
- 238000011179 visual inspection Methods 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 238000007689 inspection Methods 0.000 description 6
- 239000011345 viscous material Substances 0.000 description 6
- 230000009471 action Effects 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 4
- 230000008901 benefit Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 239000005022 packaging material Substances 0.000 description 3
- 230000000750 progressive effect Effects 0.000 description 3
- 238000012876 topography Methods 0.000 description 3
- 235000012431 wafers Nutrition 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000013615 primer Substances 0.000 description 2
- 239000002987 primer (paints) Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- -1 50-100 centipoise) Substances 0.000 description 1
- 241000723369 Cocculus trilobus Species 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000000976 ink Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000006072 paste Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 230000007723 transport mechanism Effects 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
- G01B11/25—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object
- G01B11/2509—Color coding
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
- H05K13/0469—Surface mounting by applying a glue or viscous material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0817—Monitoring of soldering processes
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Operations Research (AREA)
- Analytical Chemistry (AREA)
- Immunology (AREA)
- Pathology (AREA)
- General Health & Medical Sciences (AREA)
- Biochemistry (AREA)
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/796,512 US8939074B2 (en) | 2013-03-12 | 2013-03-12 | Color-based linear three dimensional acquisition system and method |
| US13/796,512 | 2013-03-12 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201437043A TW201437043A (zh) | 2014-10-01 |
| TWI676559B true TWI676559B (zh) | 2019-11-11 |
Family
ID=50190847
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW103105674A TWI676559B (zh) | 2013-03-12 | 2014-02-20 | 具有基於色彩的線性三維擷取系統之材料施用器 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US8939074B2 (https=) |
| EP (1) | EP2972074A1 (https=) |
| JP (1) | JP6431029B2 (https=) |
| KR (1) | KR102090856B1 (https=) |
| CN (1) | CN105026882A (https=) |
| PH (1) | PH12015501652B1 (https=) |
| TW (1) | TWI676559B (https=) |
| WO (1) | WO2014158483A1 (https=) |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11176635B2 (en) | 2013-01-25 | 2021-11-16 | Cyberoptics Corporation | Automatic programming of solder paste inspection system |
| US9743527B2 (en) * | 2013-08-09 | 2017-08-22 | CyberOptics Corporaiton | Stencil programming and inspection using solder paste inspection system |
| US9370925B1 (en) | 2015-03-25 | 2016-06-21 | Illinois Tool Works Inc. | Stencil printer having stencil shuttle assembly |
| US9370924B1 (en) | 2015-03-25 | 2016-06-21 | Illinois Tool Works Inc. | Dual action stencil wiper assembly for stencil printer |
| US9370923B1 (en) | 2015-04-07 | 2016-06-21 | Illinois Tool Works Inc. | Lift tool assembly for stencil printer |
| US10703089B2 (en) | 2015-04-07 | 2020-07-07 | Illinois Tool Works Inc. | Edge lock assembly for a stencil printer |
| US10723117B2 (en) | 2015-04-07 | 2020-07-28 | Illinois Tool Works Inc. | Lift tool assembly for stencil printer |
| TWI571714B (zh) * | 2015-06-15 | 2017-02-21 | Printing Tech Res Inst | Method of making multi - angle color guide table |
| US11557048B2 (en) | 2015-11-16 | 2023-01-17 | Applied Materials, Inc. | Thickness measurement of substrate using color metrology |
| US10565701B2 (en) | 2015-11-16 | 2020-02-18 | Applied Materials, Inc. | Color imaging for CMP monitoring |
| KR102508426B1 (ko) * | 2016-01-29 | 2023-03-09 | 삼성전자주식회사 | 경도 검출이 가능한 센싱장치, 이를 구비한 모바일 기기, 및 이를 이용한 3차원 인쇄장치 |
| JP6718502B2 (ja) * | 2016-03-29 | 2020-07-08 | 株式会社Ｆｕｊｉ | 電子部品装着機の動作確認装置 |
| CN106879249A (zh) * | 2017-04-26 | 2017-06-20 | 航天科技控股集团股份有限公司 | 印制板组件自动检测设备 |
| CN114777682A (zh) * | 2017-10-06 | 2022-07-22 | 先进扫描仪公司 | 生成一个或多个亮度边缘以形成物体的三维模型 |
| EP3480585A1 (en) * | 2017-11-07 | 2019-05-08 | ASM Assembly Systems GmbH & Co. KG | Stencil inspection by means of a solder paste inspection device |
| KR102091935B1 (ko) * | 2018-08-29 | 2020-03-20 | 주식회사 프로텍 | 3차원 스캐너를 이용한 점성 용액 디스펜싱 방법 |
| US11100628B2 (en) | 2019-02-07 | 2021-08-24 | Applied Materials, Inc. | Thickness measurement of substrate using color metrology |
| CN110399878B (zh) * | 2019-06-14 | 2023-05-26 | 南京火眼锐视信息科技有限公司 | 表格版式恢复方法，计算机可读介质以及计算机 |
| US12135353B2 (en) * | 2019-11-15 | 2024-11-05 | Tektronix, Inc. | Indirect acquisition of a signal from a device under test |
| EP4064813A1 (de) * | 2021-03-26 | 2022-09-28 | Siemens Aktiengesellschaft | Verfahren zur überwachung einer smd-fertigung und smd-fertigungsstrasse |
| CN113183608B (zh) * | 2021-04-23 | 2022-04-22 | 广州诚鼎机器人有限公司 | 一种浆料补充设备和椭圆印花机 |
| DE102022132162A1 (de) * | 2022-12-05 | 2024-06-06 | Witrins S.R.O. | Verfahren zur Fehleranalyse und Inspektionssystem |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040145753A1 (en) * | 2001-04-06 | 2004-07-29 | Ssang-Gun Lim | Method and apparatus for measuring the three-dimensional surface shape of an object using color informations of light reflected by the object |
| CN101606448A (zh) * | 2007-02-16 | 2009-12-16 | 伊利诺斯工具制品有限公司 | 单一和多光谱照明系统和方法 |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3173050B2 (ja) * | 1991-07-30 | 2001-06-04 | オムロン株式会社 | 教示データ作成方法およびその方法を用いた教示データ作成装置 |
| JPH09201558A (ja) * | 1996-01-29 | 1997-08-05 | Techno Kapura:Kk | 塗布装置 |
| US7570798B2 (en) * | 1998-01-16 | 2009-08-04 | Beaty Elwin M | Method of manufacturing ball array devices using an inspection apparatus having one or more cameras and ball array devices produced according to the method |
| US6738505B1 (en) | 1999-05-04 | 2004-05-18 | Speedline Technologies, Inc. | Method and apparatus for detecting solder paste deposits on substrates |
| US6891967B2 (en) | 1999-05-04 | 2005-05-10 | Speedline Technologies, Inc. | Systems and methods for detecting defects in printed solder paste |
| US7072503B2 (en) | 1999-05-04 | 2006-07-04 | Speedline Technologies, Inc. | Systems and methods for detecting defects in printed solder paste |
| US6541063B1 (en) | 1999-11-04 | 2003-04-01 | Speedline Technologies, Inc. | Calibration of a dispensing system |
| US7404861B2 (en) | 2004-04-23 | 2008-07-29 | Speedline Technologies, Inc. | Imaging and inspection system for a dispenser and method for same |
| US20050268799A1 (en) | 2004-06-02 | 2005-12-08 | Speedline Technologies, Inc. | Solder paste lateral flow and redistribution system and methods of same |
| US7961912B2 (en) * | 2004-10-14 | 2011-06-14 | Stevick Glen R | Method and apparatus for dynamic space-time imaging system |
| US20070102477A1 (en) | 2005-11-10 | 2007-05-10 | Speedline Technologies, Inc. | Imaging system and method for a stencil printer |
| US7458318B2 (en) | 2006-02-01 | 2008-12-02 | Speedline Technologies, Inc. | Off-axis illumination assembly and method |
| JP2007271395A (ja) * | 2006-03-30 | 2007-10-18 | Brother Ind Ltd | ３次元色形状計測装置 |
| US20080156207A1 (en) | 2006-12-28 | 2008-07-03 | Dan Ellenbogen | Stencil printers and the like, optical systems therefor, and methods of printing and inspection |
| US7923056B2 (en) * | 2007-06-01 | 2011-04-12 | Illinois Tool Works Inc. | Method and apparatus for dispensing material on a substrate |
| WO2009049272A2 (en) * | 2007-10-10 | 2009-04-16 | Gerard Dirk Smits | Image projector with reflected light tracking |
| EP2196765A1 (en) | 2008-12-09 | 2010-06-16 | WiTrins s.r.o. | Measuring the outer dimensions of an object |
| CZ2009133A3 (cs) * | 2009-03-03 | 2009-07-08 | Witrins S.R.O. | Zarízení, zpusob merení vnejších rozmeru testovaného výrobku a použití tohoto zarízení |
| US8872912B2 (en) * | 2009-09-22 | 2014-10-28 | Cyberoptics Corporation | High speed distributed optical sensor inspection system |
| US20130136850A1 (en) | 2011-11-29 | 2013-05-30 | Illinois Tool Works Inc. | Method for depositing materials on a substrate |
| US20130133574A1 (en) | 2011-11-29 | 2013-05-30 | Illinois Tool Works Inc. | Material deposition system for depositing materials on a substrate |
-
2013
- 2013-03-12 US US13/796,512 patent/US8939074B2/en active Active
-
2014
- 2014-02-19 JP JP2016500305A patent/JP6431029B2/ja active Active
- 2014-02-19 EP EP14707621.0A patent/EP2972074A1/en not_active Ceased
- 2014-02-19 KR KR1020157023541A patent/KR102090856B1/ko active Active
- 2014-02-19 CN CN201480013198.5A patent/CN105026882A/zh active Pending
- 2014-02-19 WO PCT/US2014/017225 patent/WO2014158483A1/en not_active Ceased
- 2014-02-20 TW TW103105674A patent/TWI676559B/zh active
-
2015
- 2015-07-24 PH PH12015501652A patent/PH12015501652B1/en unknown
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040145753A1 (en) * | 2001-04-06 | 2004-07-29 | Ssang-Gun Lim | Method and apparatus for measuring the three-dimensional surface shape of an object using color informations of light reflected by the object |
| CN101606448A (zh) * | 2007-02-16 | 2009-12-16 | 伊利诺斯工具制品有限公司 | 单一和多光谱照明系统和方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2016512330A (ja) | 2016-04-25 |
| US20140272103A1 (en) | 2014-09-18 |
| WO2014158483A1 (en) | 2014-10-02 |
| KR20150123817A (ko) | 2015-11-04 |
| JP6431029B2 (ja) | 2018-11-28 |
| CN105026882A (zh) | 2015-11-04 |
| PH12015501652A1 (en) | 2015-10-19 |
| TW201437043A (zh) | 2014-10-01 |
| EP2972074A1 (en) | 2016-01-20 |
| US8939074B2 (en) | 2015-01-27 |
| PH12015501652B1 (en) | 2015-10-19 |
| KR102090856B1 (ko) | 2020-05-27 |
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