PH12015501225A1 - Protective-membrane-forming film - Google Patents

Protective-membrane-forming film

Info

Publication number
PH12015501225A1
PH12015501225A1 PH12015501225A PH12015501225A PH12015501225A1 PH 12015501225 A1 PH12015501225 A1 PH 12015501225A1 PH 12015501225 A PH12015501225 A PH 12015501225A PH 12015501225 A PH12015501225 A PH 12015501225A PH 12015501225 A1 PH12015501225 A1 PH 12015501225A1
Authority
PH
Philippines
Prior art keywords
acrylic polymer
membrane
protective
forming film
monomers
Prior art date
Application number
PH12015501225A
Other languages
English (en)
Inventor
Takano Ken
Shinoda Tomonori
Azuma Yuichiro
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of PH12015501225A1 publication Critical patent/PH12015501225A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/308—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4021—Ureas; Thioureas; Guanidines; Dicyandiamides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5435—Silicon-containing compounds containing oxygen containing oxygen in a ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • C08L33/062—Copolymers with monomers not covered by C08L33/06
    • C08L33/068—Copolymers with monomers not covered by C08L33/06 containing glycidyl groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/296—Organo-silicon compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/14—Semiconductor wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
PH12015501225A 2012-12-03 2015-06-01 Protective-membrane-forming film PH12015501225A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012264578 2012-12-03
PCT/JP2013/082289 WO2014087947A1 (ja) 2012-12-03 2013-11-29 保護膜形成用フィルム

Publications (1)

Publication Number Publication Date
PH12015501225A1 true PH12015501225A1 (en) 2015-08-17

Family

ID=50883365

Family Applications (1)

Application Number Title Priority Date Filing Date
PH12015501225A PH12015501225A1 (en) 2012-12-03 2015-06-01 Protective-membrane-forming film

Country Status (6)

Country Link
JP (1) JP6302843B2 (ja)
KR (1) KR102108776B1 (ja)
CN (1) CN104838490B (ja)
PH (1) PH12015501225A1 (ja)
TW (1) TWI616507B (ja)
WO (1) WO2014087947A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015146936A1 (ja) * 2014-03-24 2015-10-01 リンテック株式会社 保護膜形成フィルム、保護膜形成用シート、ワークまたは加工物の製造方法、検査方法、良品と判断されたワーク、および良品と判断された加工物
CN104592714A (zh) * 2015-01-13 2015-05-06 潮州三环（集团）股份有限公司 一种模塑料组合物及其制备方法
KR102466692B1 (ko) * 2015-03-31 2022-11-14 도레이 카부시키가이샤 전자 부품용 수지 시트, 보호 필름 부착 전자 부품용 수지 시트, 및 반도체 장치 및 그 제조 방법
KR102364359B1 (ko) * 2015-08-21 2022-02-17 주식회사 케이씨씨 반도체 봉지용 에폭시 수지 조성물

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0812859A (ja) * 1994-06-28 1996-01-16 Matsushita Electric Works Ltd 封止用エポキシ樹脂組成物
JP3441382B2 (ja) * 1998-10-14 2003-09-02 日本電信電話株式会社 半導体装置の製造方法
JP3601443B2 (ja) 1999-11-30 2004-12-15 日立化成工業株式会社 接着フィルムとその製造方法、半導体搭載用配線基板及び半導体装置
JP3604988B2 (ja) * 2000-02-14 2004-12-22 シャープ株式会社 半導体装置およびその製造方法
JP3544362B2 (ja) 2001-03-21 2004-07-21 リンテック株式会社 半導体チップの製造方法
JP4364508B2 (ja) * 2002-12-27 2009-11-18 リンテック株式会社 チップ裏面用保護膜形成用シートおよび保護膜付きチップの製造方法
JP2007250970A (ja) * 2006-03-17 2007-09-27 Hitachi Chem Co Ltd 半導体素子裏面保護用フィルム及びそれを用いた半導体装置とその製造法
JP2009130233A (ja) * 2007-11-27 2009-06-11 Furukawa Electric Co Ltd:The チップ保護用フィルム
JP2013256547A (ja) * 2010-10-05 2013-12-26 Sumitomo Bakelite Co Ltd 液状封止樹脂組成物および半導体パッケージ
JP5774322B2 (ja) * 2011-01-28 2015-09-09 リンテック株式会社 半導体用接着剤組成物、半導体用接着シートおよび半導体装置の製造方法
JP5893250B2 (ja) * 2011-01-31 2016-03-23 リンテック株式会社 チップ用保護膜形成用シート、半導体チップの製造方法および半導体装置
WO2012117822A1 (ja) * 2011-02-28 2012-09-07 横浜ゴム株式会社 加熱硬化性光半導体封止用シリコーン樹脂組成物およびこれを用いる光半導体パッケージ

Also Published As

Publication number Publication date
TWI616507B (zh) 2018-03-01
JP6302843B2 (ja) 2018-03-28
CN104838490B (zh) 2018-09-25
KR102108776B1 (ko) 2020-05-11
KR20150092132A (ko) 2015-08-12
TW201428078A (zh) 2014-07-16
WO2014087947A1 (ja) 2014-06-12
JPWO2014087947A1 (ja) 2017-01-05
CN104838490A (zh) 2015-08-12

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