PE20070092A1 - Unidad electronica de control y proceso para su produccion - Google Patents

Unidad electronica de control y proceso para su produccion

Info

Publication number
PE20070092A1
PE20070092A1 PE2006000694A PE2006000694A PE20070092A1 PE 20070092 A1 PE20070092 A1 PE 20070092A1 PE 2006000694 A PE2006000694 A PE 2006000694A PE 2006000694 A PE2006000694 A PE 2006000694A PE 20070092 A1 PE20070092 A1 PE 20070092A1
Authority
PE
Peru
Prior art keywords
electronic component
coating
injection
electronic
uec
Prior art date
Application number
PE2006000694A
Other languages
English (en)
Inventor
Ryuichi Kimata
Keiichuro Bungo
Original Assignee
Honda Motor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honda Motor Co Ltd filed Critical Honda Motor Co Ltd
Publication of PE20070092A1 publication Critical patent/PE20070092A1/es

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/165—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3135—Double encapsulation or coating and encapsulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/304—Protecting a component during manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Means For Warming Up And Starting Carburetors (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Casings For Electric Apparatus (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Control Of Throttle Valves Provided In The Intake System Or In The Exhaust System (AREA)

Abstract

DONDE LA UNIDAD ELECTRONICA DE CONTROL (UEC) INCLUYE: a) UNA PLAQUETA DE CIRCUITO IMPRESO, EL CUAL INCLUYE UN COMPONENTE ELECTRONICO MONTADO EN EL; Y, b) UN RECUBRIMIENTO DE RESINA SINTETICA, FORMADO POR MOLDEO POR INYECCION, PARA CUBRIR (a). EL COMPONENTE ELECTRONICO ESTA ALOJADO EN UNA CAJA PROTECTORA QUE PUEDE RESISTIR LA PRESION Y EL CALOR DURANTE EL MOLDEO POR INYECCION DEL RECUBRIMIENTO, DE MODO QUE EN LA (UEC) EL COMPONENTE ELECTRONICO NO SE DANA DEBIDO A LA FORMACION DEL RECUBRIMIENTO POR MOLDEO POR INYECCION, Y LA UEC PUEDE FUNCIONAR SIEMPRE NORMALMENTE. EL COMPONENTE ELECTRONICO SE LIMITA A UNO QUE TIENE UNA ALTURA PARTICULARMENTE ELEVADA ENTRE VARIOS TIPOS DE COMPONENTES ELECTRONICOS MONTADOS EN (a). EL PROCESO COMPRENDE: i) MONTAJE EN (a) DEL COMPONENTE ELECTRONICO, Y, ii) MOLDEO DEL RECUBRIMIENTO QUE CONSISTE EN COLOCAR DENTRO DE UN MOLDE (a), EN LA QUE SE MONTO EL COMPONENTE ELECTRONICO, INYECTANDO UN MATERIAL FUNDIDO CALIENTE EN UNA CAVIDAD QUE POSEE UN ESPACIO UNIFORME DEFINIDO POR EL MOLDE QUE RODEA (a) Y EL COMPONENTE ELECTRONICO
PE2006000694A 2005-06-23 2006-06-21 Unidad electronica de control y proceso para su produccion PE20070092A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005183609A JP4744947B2 (ja) 2005-06-23 2005-06-23 電子制御ユニット及びその製造方法

Publications (1)

Publication Number Publication Date
PE20070092A1 true PE20070092A1 (es) 2007-02-07

Family

ID=37570540

Family Applications (1)

Application Number Title Priority Date Filing Date
PE2006000694A PE20070092A1 (es) 2005-06-23 2006-06-21 Unidad electronica de control y proceso para su produccion

Country Status (14)

Country Link
US (1) US7829798B2 (es)
EP (1) EP1895583B1 (es)
JP (1) JP4744947B2 (es)
KR (1) KR101070720B1 (es)
CN (1) CN101203955B (es)
AR (1) AR054494A1 (es)
AU (1) AU2006260110B2 (es)
BR (1) BRPI0611776A2 (es)
CA (1) CA2608550C (es)
MY (1) MY150899A (es)
PA (1) PA8682101A1 (es)
PE (1) PE20070092A1 (es)
TW (1) TWI305035B (es)
WO (1) WO2006137523A1 (es)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006045146A1 (de) * 2006-07-17 2008-01-31 Diehl Ako Stiftung & Co. Kg Antriebsvorrichtung für eine Waschmaschine
GB2464475B (en) * 2008-10-15 2013-05-15 Haldex Brake Products Ltd Method of protecting electronic components
JP5256994B2 (ja) * 2008-10-24 2013-08-07 富士電機株式会社 半導体装置
JP2010245174A (ja) * 2009-04-02 2010-10-28 Denso Corp 電子制御ユニット及びその製造方法
CN104682722B (zh) 2013-11-26 2018-01-26 台达电子企业管理（上海）有限公司 电源转换装置及其组装方法
WO2015168578A1 (en) * 2014-05-01 2015-11-05 Briggs & Stratton Corporation Electronic governor system and load sensing system
DE102015225099A1 (de) * 2015-12-14 2017-06-14 Robert Bosch Gmbh Elektronikmodul, insbesondere für Getriebesteuergerät, und Verfahren zum Fertigen eines solchen
DE102018218783A1 (de) * 2018-11-05 2020-05-07 Zf Friedrichshafen Ag Elektronische Einheit mit elektronischen Bauelementen und einer Anordnung zum Schutz derselben vor Druckbeaufschlagung
KR20210158309A (ko) * 2020-06-23 2021-12-30 주식회사 엘지에너지솔루션 회로 기판 어셈블리 제조 방법, 이에 의해 제조된 회로 기판 어셈블리 및 이를 구비하는 전기 자동차

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2737010C2 (de) * 1977-08-17 1983-06-30 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Mit einer elektrisch isoloerenden Tauchumhüllung bedeckte, hybride Schichtschaltung mit zugänglichen Bauelementen
GB8323755D0 (en) 1983-09-05 1983-10-05 Marconi Avionics Encapsulation process
CN2105804U (zh) * 1991-08-05 1992-05-27 无锡市晶体管厂 电力电子控制驱动执行装置
JP3353526B2 (ja) * 1995-03-23 2002-12-03 株式会社デンソー 半導体パッケージ及びその製造方法
US6117382A (en) * 1998-02-05 2000-09-12 Micron Technology, Inc. Method for encasing array packages
US6259157B1 (en) 1998-03-11 2001-07-10 Sanyo Electric Co., Ltd. Hybrid integrated circuit device, and method of manufacturing thereof
JP3469804B2 (ja) * 1999-02-22 2003-11-25 株式会社コージン Ｉｃのパッケージ成形方法
JP2001054286A (ja) * 1999-08-06 2001-02-23 Mitsubishi Electric Corp 電子制御基板
JP4230679B2 (ja) * 2000-06-26 2009-02-25 株式会社東芝 半導体樹脂モールド装置および半導体樹脂モールド方法
DE10042636C1 (de) * 2000-08-30 2002-04-11 Epcos Ag Elektrisches Bauelement und Verfahren zu dessen Herstellung
US20050000726A1 (en) * 2003-06-06 2005-01-06 Honda Motor Co., Ltd. Resin encapsulated electronic component unit and method of manufacturing the same
JP2004363406A (ja) * 2003-06-06 2004-12-24 Honda Motor Co Ltd 樹脂封止電子部品ユニット及びその製造方法

Also Published As

Publication number Publication date
WO2006137523A1 (ja) 2006-12-28
KR101070720B1 (ko) 2011-10-07
CA2608550A1 (en) 2006-12-28
US7829798B2 (en) 2010-11-09
EP1895583A1 (en) 2008-03-05
CA2608550C (en) 2012-02-07
JP2007005551A (ja) 2007-01-11
MY150899A (en) 2014-03-14
CN101203955A (zh) 2008-06-18
TWI305035B (en) 2009-01-01
BRPI0611776A2 (pt) 2010-09-28
KR20080014022A (ko) 2008-02-13
AR054494A1 (es) 2007-06-27
PA8682101A1 (es) 2007-01-17
CN101203955B (zh) 2010-05-19
AU2006260110A1 (en) 2006-12-28
TW200703595A (en) 2007-01-16
EP1895583A4 (en) 2008-11-19
EP1895583B1 (en) 2014-05-07
AU2006260110B2 (en) 2010-05-27
JP4744947B2 (ja) 2011-08-10
US20090101390A1 (en) 2009-04-23

Similar Documents

Publication Publication Date Title
PE20070092A1 (es) Unidad electronica de control y proceso para su produccion
ES2076906T3 (es) Moldeo por inyeccion asistido por gas.
US8393772B2 (en) Vehicle lamp
TW200733431A (en) Method of sealing/molding optical element by resin
ATE534149T1 (de) Lichtemittierende vorrichtung
TW200733326A (en) Method of resin sealing electronic part
BRPI0512039A (pt) componente de veìculo e método para a feitura de um componente de veìculo
TW200711169A (en) Beam shutter in LED package
BRPI1007057A8 (pt) Processo para fabricação de um tanque de combustível de plástico equipado com pelo menos um componente de comunicação destinado a se comunicar com o lado de fora do tanque e que tem uma parede lateral, pela moldagem de uma pré-forma usando um molde compreendendo duas impressões e um núcleo
WO2018218948A1 (zh) 按键结构及电子设备
CN104360521A (zh) 一种胶框及显示装置
TW200713473A (en) Method of resin-seal-molding electronic component and apparatus therefor
TW200706591A (en) Flame retardant molding composition
WO2007131372A3 (de) Sensorgehäuse
GB2519191A9 (en) Method for manufacturing a printed circuit board, printed circuit board and rear view device
US20180169916A1 (en) Lens for a lighting and/or signaling device of a motor vehicle
TW200704309A (en) Manufacturing method of mounting substrate with reflector
US9056408B2 (en) Injection molding machine
FR2920253B3 (fr) Structure de conditionnement d'une diode electroluminescente
JP6181483B2 (ja) 射出成形品および射出成形装置
TWI606324B (zh) 電子裝置及其製造方法
WO2018074115A1 (ja) 電子制御装置
WO2003054920A3 (de) Verfahren zum herstellen von led-körpern
WO2015054962A1 (zh) 用于水族箱的灯体座
KR101626349B1 (ko) 방수형 엘이디 모듈 성형장치

Legal Events

Date Code Title Description
FG Grant, registration
FD Application declared void or lapsed