AR054494A1 - Unidad electronica de control y proceso para su produccion - Google Patents

Unidad electronica de control y proceso para su produccion

Info

Publication number
AR054494A1
AR054494A1 ARP060102677A ARP060102677A AR054494A1 AR 054494 A1 AR054494 A1 AR 054494A1 AR P060102677 A ARP060102677 A AR P060102677A AR P060102677 A ARP060102677 A AR P060102677A AR 054494 A1 AR054494 A1 AR 054494A1
Authority
AR
Argentina
Prior art keywords
electronic control
control unit
printed circuit
injection molding
electronic
Prior art date
Application number
ARP060102677A
Other languages
English (en)
Original Assignee
Honda Motor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honda Motor Co Ltd filed Critical Honda Motor Co Ltd
Publication of AR054494A1 publication Critical patent/AR054494A1/es

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/165—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3135—Double encapsulation or coating and encapsulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/304—Protecting a component during manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Means For Warming Up And Starting Carburetors (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Casings For Electric Apparatus (AREA)
  • Control Of Throttle Valves Provided In The Intake System Or In The Exhaust System (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

Una unidad electronica de control incluye una plaqueta de circuito impreso (50), componentes electronicos (51 a 53) montados en la plaqueta de circuito impreso (50) y un recubrimiento de resina sintética (57) formado por moldeo por inyeccion para cubrir la plaqueta de circuito impreso (50) y el componente electronico (51 a 53). Los componentes electronicos (51 a 53) están alojados en una caja protectora (75) que puede resistir la presion y el calor durante el moldeo por inyeccion del recubrimiento (57). Así, la unidad electronica de control, los componentes electronicos no se danan debido a la formacion del recubrimiento por moldeo por inyeccion, de manera que la unidad electronica de control puede funcionar siempre normalmente.
ARP060102677A 2005-06-23 2006-06-22 Unidad electronica de control y proceso para su produccion AR054494A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005183609A JP4744947B2 (ja) 2005-06-23 2005-06-23 電子制御ユニット及びその製造方法

Publications (1)

Publication Number Publication Date
AR054494A1 true AR054494A1 (es) 2007-06-27

Family

ID=37570540

Family Applications (1)

Application Number Title Priority Date Filing Date
ARP060102677A AR054494A1 (es) 2005-06-23 2006-06-22 Unidad electronica de control y proceso para su produccion

Country Status (14)

Country Link
US (1) US7829798B2 (es)
EP (1) EP1895583B1 (es)
JP (1) JP4744947B2 (es)
KR (1) KR101070720B1 (es)
CN (1) CN101203955B (es)
AR (1) AR054494A1 (es)
AU (1) AU2006260110B2 (es)
BR (1) BRPI0611776A2 (es)
CA (1) CA2608550C (es)
MY (1) MY150899A (es)
PA (1) PA8682101A1 (es)
PE (1) PE20070092A1 (es)
TW (1) TWI305035B (es)
WO (1) WO2006137523A1 (es)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006045146A1 (de) * 2006-07-17 2008-01-31 Diehl Ako Stiftung & Co. Kg Antriebsvorrichtung für eine Waschmaschine
GB2464475B (en) * 2008-10-15 2013-05-15 Haldex Brake Products Ltd Method of protecting electronic components
JP5256994B2 (ja) * 2008-10-24 2013-08-07 富士電機株式会社 半導体装置
JP2010245174A (ja) * 2009-04-02 2010-10-28 Denso Corp 電子制御ユニット及びその製造方法
CN104682722B (zh) 2013-11-26 2018-01-26 台达电子企业管理（上海）有限公司 电源转换装置及其组装方法
WO2015168578A1 (en) * 2014-05-01 2015-11-05 Briggs & Stratton Corporation Electronic governor system and load sensing system
DE102015225099A1 (de) * 2015-12-14 2017-06-14 Robert Bosch Gmbh Elektronikmodul, insbesondere für Getriebesteuergerät, und Verfahren zum Fertigen eines solchen
DE102018218783A1 (de) * 2018-11-05 2020-05-07 Zf Friedrichshafen Ag Elektronische Einheit mit elektronischen Bauelementen und einer Anordnung zum Schutz derselben vor Druckbeaufschlagung
KR20210158309A (ko) * 2020-06-23 2021-12-30 주식회사 엘지에너지솔루션 회로 기판 어셈블리 제조 방법, 이에 의해 제조된 회로 기판 어셈블리 및 이를 구비하는 전기 자동차

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2737010C2 (de) * 1977-08-17 1983-06-30 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Mit einer elektrisch isoloerenden Tauchumhüllung bedeckte, hybride Schichtschaltung mit zugänglichen Bauelementen
GB8323755D0 (en) * 1983-09-05 1983-10-05 Marconi Avionics Encapsulation process
CN2105804U (zh) * 1991-08-05 1992-05-27 无锡市晶体管厂 电力电子控制驱动执行装置
JP3353526B2 (ja) * 1995-03-23 2002-12-03 株式会社デンソー 半導体パッケージ及びその製造方法
US6117382A (en) * 1998-02-05 2000-09-12 Micron Technology, Inc. Method for encasing array packages
US6259157B1 (en) 1998-03-11 2001-07-10 Sanyo Electric Co., Ltd. Hybrid integrated circuit device, and method of manufacturing thereof
JP3469804B2 (ja) * 1999-02-22 2003-11-25 株式会社コージン Ｉｃのパッケージ成形方法
JP2001054286A (ja) * 1999-08-06 2001-02-23 Mitsubishi Electric Corp 電子制御基板
JP4230679B2 (ja) * 2000-06-26 2009-02-25 株式会社東芝 半導体樹脂モールド装置および半導体樹脂モールド方法
DE10042636C1 (de) * 2000-08-30 2002-04-11 Epcos Ag Elektrisches Bauelement und Verfahren zu dessen Herstellung
JP2004363406A (ja) * 2003-06-06 2004-12-24 Honda Motor Co Ltd 樹脂封止電子部品ユニット及びその製造方法
US20050000726A1 (en) * 2003-06-06 2005-01-06 Honda Motor Co., Ltd. Resin encapsulated electronic component unit and method of manufacturing the same

Also Published As

Publication number Publication date
CA2608550A1 (en) 2006-12-28
WO2006137523A1 (ja) 2006-12-28
MY150899A (en) 2014-03-14
PE20070092A1 (es) 2007-02-07
EP1895583B1 (en) 2014-05-07
KR101070720B1 (ko) 2011-10-07
CA2608550C (en) 2012-02-07
AU2006260110B2 (en) 2010-05-27
KR20080014022A (ko) 2008-02-13
BRPI0611776A2 (pt) 2010-09-28
PA8682101A1 (es) 2007-01-17
TWI305035B (en) 2009-01-01
EP1895583A4 (en) 2008-11-19
US20090101390A1 (en) 2009-04-23
CN101203955A (zh) 2008-06-18
US7829798B2 (en) 2010-11-09
CN101203955B (zh) 2010-05-19
AU2006260110A1 (en) 2006-12-28
EP1895583A1 (en) 2008-03-05
JP4744947B2 (ja) 2011-08-10
TW200703595A (en) 2007-01-16
JP2007005551A (ja) 2007-01-11

Similar Documents

Publication Publication Date Title
AR054494A1 (es) Unidad electronica de control y proceso para su produccion
ATE448586T1 (de) Elektrisches/elektronisches installationsgerät
TW200642547A (en) A substantially continuous layer of embedded transient protection for printed circuit boards
TWI257184B (en) Lighting apparatus
MX2017014803A (es) Cubierta de plástico termoformado para componentes electronicos y método de fabricacion relacionado.
WO2009036478A3 (de) Leiterplattenelement und verfahren zu dessen herstellung
WO2014158560A3 (en) Luminaires and luminaire mounting structures
ATE554528T1 (de) Bedienvorrichtung mit wenigstens einem druckschalter
ATE483285T1 (de) Optisches transpondermodul mit flexibler schaltung mit doppelter platte
IN2012DN05096A (es)
ATE514035T1 (de) Montageanordnung für beleuchtungsvorrichtungen, entsprechende beleuchtungsvorrichtung und verfahren
ATE502399T1 (de) Schaltungsvorrichtung mit gebondetem smd-bauteil
ATE525612T1 (de) Led flachleuchte
TW200636309A (en) An optical sub-assembly
CA2945985A1 (en) Light emitting diode signal module
US20160192499A1 (en) Electronic device and manufacturing method thereof
JP6172539B2 (ja) 防水機能を有するｌｅｄモジュール
TWI606324B (zh) 電子裝置及其製造方法
JP1713167S (ja) 半導体モジュール
WO2009069236A1 (ja) 回路基板モジュールおよび電子機器
TW200716032A (en) A electronic incense with flexible display substrate
TWI265776B (en) Electronic device
JP1758147S (ja) 電子部品用パッケージ
ATE538630T1 (de) Sensorgehäuse für einen strichcodeleser
TW200718303A (en) Electronic device and circuit board thereof

Legal Events

Date Code Title Description
FG Grant, registration