NO974001L - Halvledersubstrat med passiveringsfilm - Google Patents

Halvledersubstrat med passiveringsfilm

Info

Publication number
NO974001L
NO974001L NO974001A NO974001A NO974001L NO 974001 L NO974001 L NO 974001L NO 974001 A NO974001 A NO 974001A NO 974001 A NO974001 A NO 974001A NO 974001 L NO974001 L NO 974001L
Authority
NO
Norway
Prior art keywords
passivation film
layer
substrate
semiconductor substrate
sin
Prior art date
Application number
NO974001A
Other languages
English (en)
Other versions
NO974001D0 (no
NO320484B1 (no
Inventor
Hiroyuki Seto
Shogo Yoshida
Original Assignee
Murata Manufacturing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP23153596A external-priority patent/JP3246348B2/ja
Priority claimed from JP23153696A external-priority patent/JP3259641B2/ja
Application filed by Murata Manufacturing Co filed Critical Murata Manufacturing Co
Publication of NO974001D0 publication Critical patent/NO974001D0/no
Publication of NO974001L publication Critical patent/NO974001L/no
Publication of NO320484B1 publication Critical patent/NO320484B1/no

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H01L23/3192—Multilayer coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/291—Oxides or nitrides or carbides, e.g. ceramics, glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H01L23/3171—Partial encapsulation or coating the coating being directly applied to the semiconductor body, e.g. passivation layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13063—Metal-Semiconductor Field-Effect Transistor [MESFET]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H01L2924/141—Analog devices
    • H01L2924/1423—Monolithic Microwave Integrated Circuit [MMIC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Formation Of Insulating Films (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

Halvlederinnretning i form av et sub-strat (2) med en pålagt passiveringsfilm (3, 9) på en overflate. Filmen har et SiON-lag (4, 10) i kontakt med substrat-overflaten, og et SiN-lag (5, 11) på yttersiden av SiON-laget.Passiveringsfilmen har særlig et ytterste lag (11) av SiN, og dette lag har en del i kontakt med substratet (2) eller det blottlagte areal (111, 112) av SiON-laget (107) er nitrert.Substratet har god heftstyrke mellom passiveringsfilmen (3, 9) og substratover-flaten, og man har oppnådd god motstands-dyktighet overfor fuktighet.
NO19974001A 1996-09-02 1997-09-01 Halvlederinnretning med passiveringsfilm NO320484B1 (no)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP23153596A JP3246348B2 (ja) 1996-09-02 1996-09-02 半導体装置の保護膜構造
JP23153696A JP3259641B2 (ja) 1996-09-02 1996-09-02 半導体装置の保護膜構造

Publications (3)

Publication Number Publication Date
NO974001D0 NO974001D0 (no) 1997-09-01
NO974001L true NO974001L (no) 1998-03-03
NO320484B1 NO320484B1 (no) 2005-12-12

Family

ID=26529938

Family Applications (1)

Application Number Title Priority Date Filing Date
NO19974001A NO320484B1 (no) 1996-09-02 1997-09-01 Halvlederinnretning med passiveringsfilm

Country Status (5)

Country Link
US (1) US6388310B1 (no)
EP (1) EP0827199A3 (no)
KR (1) KR100370916B1 (no)
CA (1) CA2213034C (no)
NO (1) NO320484B1 (no)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2783530B1 (fr) * 1998-09-21 2001-08-31 Commissariat Energie Atomique Procede de preparation, par nitruration, d'un substrat de silicium pour la formation d'une couche isolante mince
EP1364405A4 (en) * 2001-01-30 2008-12-24 Ma Com Inc HIGH VOLTAGE SEMICONDUCTOR DEVICE
US7607560B2 (en) 2004-05-14 2009-10-27 Intevac, Inc. Semiconductor die attachment for high vacuum tubes
US7012328B2 (en) * 2004-05-14 2006-03-14 Intevac, Inc. Semiconductor die attachment for high vacuum tubes
JP2006043813A (ja) * 2004-08-04 2006-02-16 Denso Corp 保護膜付きマイクロシステム構造体及びその製造方法
JP4898497B2 (ja) * 2006-03-27 2012-03-14 キヤノン株式会社 有機発光装置およびその製造方法
US20070262379A1 (en) * 2006-05-15 2007-11-15 Chin-Chuan Lai Metal structure of glass substrate and formation thereof
US10297557B2 (en) * 2017-06-30 2019-05-21 Sanken Electric Co., Ltd. Semiconductor device and method for manufacturing the semiconductor device
JP6846687B2 (ja) * 2017-09-12 2021-03-24 パナソニックＩｐマネジメント株式会社 半導体装置およびその製造方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4097889A (en) * 1976-11-01 1978-06-27 Rca Corporation Combination glass/low temperature deposited Siw Nx Hy O.sub.z
EP0072603B1 (en) * 1978-06-14 1986-10-01 Fujitsu Limited Process for producing a semiconductor device having an insulating layer of silicon dioxide covered by a film of silicon oxynitride
US4438157A (en) * 1980-12-05 1984-03-20 Ncr Corporation Process for forming MNOS dual dielectric structure
JPS63184340A (ja) * 1986-09-08 1988-07-29 Nec Corp 半導体装置
JPH01187933A (ja) * 1988-01-22 1989-07-27 Mitsubishi Electric Corp 半導体装置の製造方法
JPH01228135A (ja) 1988-03-09 1989-09-12 Nec Corp 半導体装置
US4959705A (en) * 1988-10-17 1990-09-25 Ford Microelectronics, Inc. Three metal personalization of application specific monolithic microwave integrated circuit
JPH03268430A (ja) 1990-03-19 1991-11-29 Kawasaki Steel Corp 半導体装置の保護膜構造
JP2814009B2 (ja) * 1990-06-05 1998-10-22 三菱電機株式会社 半導体装置の製造方法
JPH0645316A (ja) 1992-07-23 1994-02-18 Nec Corp 半導体装置およびその製造方法
JPH0845926A (ja) * 1994-07-26 1996-02-16 Sony Corp 半導体装置およびその製造方法
US5472913A (en) * 1994-08-05 1995-12-05 Texas Instruments Incorporated Method of fabricating porous dielectric material with a passivation layer for electronics applications
US5710067A (en) * 1995-06-07 1998-01-20 Advanced Micro Devices, Inc. Silicon oxime film
US5686329A (en) * 1995-12-29 1997-11-11 Taiwan Semiconductor Manufacturing Company, Ltd. Method for forming a metal oxide semiconductor field effect transistor (MOSFET) having improved hot carrier immunity
US5869396A (en) * 1996-07-15 1999-02-09 Chartered Semiconductor Manufacturing Ltd. Method for forming a polycide gate electrode

Also Published As

Publication number Publication date
NO974001D0 (no) 1997-09-01
CA2213034A1 (en) 1998-03-02
NO320484B1 (no) 2005-12-12
EP0827199A3 (en) 2005-10-19
KR100370916B1 (ko) 2003-03-15
KR19980024277A (ko) 1998-07-06
CA2213034C (en) 2002-12-17
US6388310B1 (en) 2002-05-14
EP0827199A2 (en) 1998-03-04

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