NO944784L - Fremgangsmåte og anordning for å måle filmtykkelsen ved en stabel av multisjikt-tynnfilm - Google Patents

Fremgangsmåte og anordning for å måle filmtykkelsen ved en stabel av multisjikt-tynnfilm

Info

Publication number
NO944784L
NO944784L NO944784A NO944784A NO944784L NO 944784 L NO944784 L NO 944784L NO 944784 A NO944784 A NO 944784A NO 944784 A NO944784 A NO 944784A NO 944784 L NO944784 L NO 944784L
Authority
NO
Norway
Prior art keywords
layer
thickness
measured
signature
signatures
Prior art date
Application number
NO944784A
Other languages
English (en)
Norwegian (no)
Other versions
NO944784D0 (no
Inventor
Paul J Clapis
Original Assignee
Hughes Aircraft Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hughes Aircraft Co filed Critical Hughes Aircraft Co
Publication of NO944784D0 publication Critical patent/NO944784D0/no
Publication of NO944784L publication Critical patent/NO944784L/no

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/02Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
    • G01B11/0625Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating with measurement of absorption or reflection

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Length Measuring Devices By Optical Means (AREA)
NO944784A 1993-12-22 1994-12-09 Fremgangsmåte og anordning for å måle filmtykkelsen ved en stabel av multisjikt-tynnfilm NO944784L (no)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/179,594 US5555472A (en) 1993-12-22 1993-12-22 Method and apparatus for measuring film thickness in multilayer thin film stack by comparison to a reference library of theoretical signatures

Publications (2)

Publication Number Publication Date
NO944784D0 NO944784D0 (no) 1994-12-09
NO944784L true NO944784L (no) 1995-06-23

Family

ID=22657217

Family Applications (1)

Application Number Title Priority Date Filing Date
NO944784A NO944784L (no) 1993-12-22 1994-12-09 Fremgangsmåte og anordning for å måle filmtykkelsen ved en stabel av multisjikt-tynnfilm

Country Status (5)

Country Link
US (1) US5555472A (fr)
EP (1) EP0660076A3 (fr)
JP (1) JPH07260437A (fr)
IL (1) IL111808A0 (fr)
NO (1) NO944784L (fr)

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US5725617A (en) * 1994-10-07 1998-03-10 Minnesota Mining And Manufacturing Company Abrasive articles with encapsulated lubricant
WO1997045698A1 (fr) * 1996-05-31 1997-12-04 Tropel Corporation Interferometre destine a la mesure des variations d'epaisseur de plaquettes de semi-conducteurs
US5872633A (en) * 1996-07-26 1999-02-16 Speedfam Corporation Methods and apparatus for detecting removal of thin film layers during planarization
US5958148A (en) 1996-07-26 1999-09-28 Speedfam-Ipec Corporation Method for cleaning workpiece surfaces and monitoring probes during workpiece processing
US5717490A (en) * 1996-10-17 1998-02-10 Lsi Logic Corporation Method for identifying order skipping in spectroreflective film measurement equipment
US6366861B1 (en) * 1997-04-25 2002-04-02 Applied Materials, Inc. Method of determining a wafer characteristic using a film thickness monitor
US5972162A (en) * 1998-01-06 1999-10-26 Speedfam Corporation Wafer polishing with improved end point detection
US6483580B1 (en) 1998-03-06 2002-11-19 Kla-Tencor Technologies Corporation Spectroscopic scatterometer system
US6236459B1 (en) 1998-11-05 2001-05-22 University Of Miami Thin film measuring device and method
JP2000311334A (ja) * 1999-04-27 2000-11-07 Victor Co Of Japan Ltd 磁気記録媒体の特性評価方法及び磁気記録媒体
US6392756B1 (en) 1999-06-18 2002-05-21 N&K Technology, Inc. Method and apparatus for optically determining physical parameters of thin films deposited on a complex substrate
US6091485A (en) * 1999-12-15 2000-07-18 N & K Technology, Inc. Method and apparatus for optically determining physical parameters of underlayers
DE10123470B4 (de) * 2001-05-15 2010-08-19 Carl Zeiss Jena Gmbh Verfahren und Anordnung zur berührungslosen Ermittlung von Produkteigenschaften
US6677170B1 (en) * 2001-05-23 2004-01-13 Advanced Micro Devices, Inc. Method for determining process layer thickness using scatterometry measurements
US6975386B2 (en) 2001-06-01 2005-12-13 Kabushiki Kaisha Toshiba Film quality inspecting method and film quality inspecting apparatus
US7286242B2 (en) * 2001-09-21 2007-10-23 Kmac Apparatus for measuring characteristics of thin film by means of two-dimensional detector and method of measuring the same
US7049156B2 (en) * 2003-03-19 2006-05-23 Verity Instruments, Inc. System and method for in-situ monitor and control of film thickness and trench depth
US7068363B2 (en) * 2003-06-06 2006-06-27 Kla-Tencor Technologies Corp. Systems for inspection of patterned or unpatterned wafers and other specimen
DE102004017232A1 (de) * 2004-04-05 2005-10-20 Bosch Gmbh Robert Interferometrische Messvorrichtung
US7444198B2 (en) 2006-12-15 2008-10-28 Applied Materials, Inc. Determining physical property of substrate
US7952708B2 (en) 2007-04-02 2011-05-31 Applied Materials, Inc. High throughput measurement system
KR101010189B1 (ko) * 2008-06-30 2011-01-21 에스엔유 프리시젼 주식회사 두께 또는 표면형상 측정방법
JP4796161B2 (ja) * 2009-02-27 2011-10-19 三菱重工業株式会社 薄膜検査装置及びその方法
JP5365581B2 (ja) * 2010-05-28 2013-12-11 信越半導体株式会社 薄膜付ウェーハの評価方法
JP5660026B2 (ja) * 2011-12-28 2015-01-28 信越半導体株式会社 膜厚分布測定方法
JP6107353B2 (ja) * 2013-04-12 2017-04-05 株式会社島津製作所 表面処理状況モニタリング装置
JP2016114506A (ja) * 2014-12-16 2016-06-23 信越半導体株式会社 薄膜付ウェーハの評価方法
WO2018066360A1 (fr) * 2016-10-07 2018-04-12 パイオニア株式会社 Dispositif d'examen, procédé d'examen, programme informatique et support d'enregistrement
JP7160779B2 (ja) * 2019-10-03 2022-10-25 信越半導体株式会社 薄膜付ウェーハの膜厚分布の測定方法
CN118335642B (zh) * 2024-06-14 2024-09-27 北京特思迪半导体设备有限公司 薄膜厚度确定方法及设备

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US4555767A (en) * 1982-05-27 1985-11-26 International Business Machines Corporation Method and apparatus for measuring thickness of epitaxial layer by infrared reflectance
US4625114A (en) * 1985-07-15 1986-11-25 At&T Technologies, Inc. Method and apparatus for nondestructively determining the characteristics of a multilayer thin film structure
JPH0731049B2 (ja) * 1986-07-25 1995-04-10 オリンパス光学工業株式会社 光学式膜厚測定装置
JPH0731050B2 (ja) * 1988-12-29 1995-04-10 オリンパス光学工業株式会社 光学式膜厚測定装置
US5042949A (en) * 1989-03-17 1991-08-27 Greenberg Jeffrey S Optical profiler for films and substrates
JP2637820B2 (ja) * 1989-03-27 1997-08-06 オリンパス光学工業株式会社 光学式膜厚測定装置
US5101111A (en) * 1989-07-13 1992-03-31 Dainippon Screen Mfg. Co., Ltd. Method of measuring thickness of film with a reference sample having a known reflectance
JP2883192B2 (ja) * 1990-11-05 1999-04-19 オリンパス光学工業株式会社 光学式膜厚測定装置
US5291269A (en) * 1991-12-06 1994-03-01 Hughes Aircraft Company Apparatus and method for performing thin film layer thickness metrology on a thin film layer having shape deformations and local slope variations
US5293214A (en) * 1991-12-06 1994-03-08 Hughes Aircraft Company Apparatus and method for performing thin film layer thickness metrology by deforming a thin film layer into a reflective condenser
US5337150A (en) * 1992-08-04 1994-08-09 Hughes Aircraft Company Apparatus and method for performing thin film layer thickness metrology using a correlation reflectometer
US5365340A (en) * 1992-12-10 1994-11-15 Hughes Aircraft Company Apparatus and method for measuring the thickness of thin films

Also Published As

Publication number Publication date
NO944784D0 (no) 1994-12-09
JPH07260437A (ja) 1995-10-13
EP0660076A3 (fr) 1996-01-10
IL111808A0 (en) 1995-01-24
EP0660076A2 (fr) 1995-06-28
US5555472A (en) 1996-09-10

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