NO884228L - Bad og fremgangsmaate for polering av en kobberflate. - Google Patents

Bad og fremgangsmaate for polering av en kobberflate.

Info

Publication number
NO884228L
NO884228L NO88884228A NO884228A NO884228L NO 884228 L NO884228 L NO 884228L NO 88884228 A NO88884228 A NO 88884228A NO 884228 A NO884228 A NO 884228A NO 884228 L NO884228 L NO 884228L
Authority
NO
Norway
Prior art keywords
polishing
bath
procedure
copper surface
copper
Prior art date
Application number
NO88884228A
Other languages
English (en)
Other versions
NO884228D0 (no
Inventor
Daniel Tytgat
Stefaan Magnus
Original Assignee
Solvay
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Solvay filed Critical Solvay
Publication of NO884228D0 publication Critical patent/NO884228D0/no
Publication of NO884228L publication Critical patent/NO884228L/no

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23FNON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F3/00Brightening metals by chemical means
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23FNON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F3/00Brightening metals by chemical means
    • C23F3/04Heavy metals
    • C23F3/06Heavy metals with acidic solutions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
NO88884228A 1987-09-25 1988-09-23 Bad og fremgangsmaate for polering av en kobberflate. NO884228L (no)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8713407A FR2621052A1 (fr) 1987-09-25 1987-09-25 Bains et procede pour le polissage chimique de surfaces en cuivre ou en alliage de cuivre

Publications (2)

Publication Number Publication Date
NO884228D0 NO884228D0 (no) 1988-09-23
NO884228L true NO884228L (no) 1989-03-28

Family

ID=9355301

Family Applications (1)

Application Number Title Priority Date Filing Date
NO88884228A NO884228L (no) 1987-09-25 1988-09-23 Bad og fremgangsmaate for polering av en kobberflate.

Country Status (9)

Country Link
US (1) US4981553A (no)
EP (1) EP0309031A1 (no)
JP (1) JPH01159385A (no)
KR (1) KR890005300A (no)
BR (1) BR8804929A (no)
DK (1) DK529488A (no)
FI (1) FI884332A (no)
FR (1) FR2621052A1 (no)
NO (1) NO884228L (no)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE1003761A3 (fr) * 1989-10-24 1992-06-09 Solvay Bains et procede pour le polissage chimique de surfaces en cuivre ou en alliage de cuivre.
DE4026015A1 (de) * 1990-08-17 1992-02-20 Hoechst Ag Verfahren zur herstellung von formkoerpern aus vorstufen oxidischer hochtemperatursupraleiter
BE1003944A3 (fr) * 1990-10-02 1992-07-22 Interox Sa Polymeres organophosphoniques et leur utilisation comme stabilisants de solutions aqueuses de peroxyde d'hydrogene.
US5454876A (en) * 1994-08-02 1995-10-03 21St Century Companies, Inc. Process for reducing lead leachate in brass plumbing components
US5609972A (en) * 1996-03-04 1997-03-11 Polystor Corporation Cell cap assembly having frangible tab disconnect mechanism
US5916453A (en) * 1996-09-20 1999-06-29 Fujitsu Limited Methods of planarizing structures on wafers and substrates by polishing
US6830627B1 (en) 1999-03-23 2004-12-14 International Business Machines Corporation Copper cleaning compositions, processes and products derived therefrom

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2834659A (en) * 1957-03-25 1958-05-13 Du Pont Chemical polishing of metals
US3345217A (en) * 1964-06-01 1967-10-03 Fremont Ind Inc Method of cleaning and phosphatizing copper circuits
US3779842A (en) * 1972-04-21 1973-12-18 Macdermid Inc Method of and composition for dissolving metallic copper
GB1449525A (en) * 1974-08-21 1976-09-15 Tokai Electro Chemical Co Method of stabilizing acid aqueous solutions of hydrogen peroxide
JPS5221223A (en) * 1975-08-13 1977-02-17 Mitsubishi Gas Chemical Co Chemical polishing solution for copper and its alloy
JPS5265725A (en) * 1975-11-27 1977-05-31 Mitsubishi Gas Chemical Co Method of chemically polishing metals
IT1083401B (it) * 1977-05-27 1985-05-21 Alfachimici Spa Soluzione acida per l'attacco selettivo del rame
US4144119A (en) * 1977-09-30 1979-03-13 Dutkewych Oleh B Etchant and process
CA1209886A (en) * 1982-01-11 1986-08-19 Thomas W. Bleeks Peroxide selective stripping compositions and method
FR2539140A1 (fr) * 1983-01-07 1984-07-13 Ugine Kuhlmann Stabilisation de solutions aqueuses contenant du peroxyde d'hydrogene, de l'acide fluorhydrique et des ions metalliques
US4788086A (en) * 1984-07-14 1988-11-29 Nippondenso Co., Ltd. Copper-based metallic member having a chemical conversion film and method for producing same
SU1211338A1 (ru) * 1984-07-18 1986-02-15 Ордена Трудового Красного Знамени Институт Органической И Физической Химии Им.А.Е.Арбузова Раствор дл химического полировани меди и ее сплавов
JPS61124585A (ja) * 1984-11-21 1986-06-12 Kosaku:Kk プリント基板製造用銅エツチング液の濃度管理法
JPS62237447A (ja) * 1986-04-08 1987-10-17 Mitsubishi Paper Mills Ltd 一液型エツチングブリ−チ液
DE3623504A1 (de) * 1986-07-09 1988-01-21 Schering Ag Kupferaetzloesungen

Also Published As

Publication number Publication date
US4981553A (en) 1991-01-01
DK529488D0 (da) 1988-09-23
FI884332A0 (fi) 1988-09-21
FR2621052A1 (fr) 1989-03-31
JPH01159385A (ja) 1989-06-22
EP0309031A1 (fr) 1989-03-29
BR8804929A (pt) 1989-05-02
KR890005300A (ko) 1989-05-13
NO884228D0 (no) 1988-09-23
DK529488A (da) 1989-03-26
FI884332A (fi) 1989-03-26

Similar Documents

Publication Publication Date Title
GB2209221B (en) Hydrophone demodulator circuit and method
NO890817L (no) Blekende vaskemiddel og forloeper for dette.
EP0313466A3 (en) Wafer positioning apparatus
EP0275469A3 (en) Surface inspection
GB8706554D0 (en) Boundary layer devices
JPS6465292A (en) Electroplating method
GB8727248D0 (en) Multi-level circuits
EP0278166A3 (en) Soldering apparatus
GB8710353D0 (en) Removing solder
DK263388A (da) Vaerktoej til overfladebehandling og fremgangsmaade til fremstilling af dette
NO884228L (no) Bad og fremgangsmaate for polering av en kobberflate.
GB2207890B (en) Etching apparatus
GB8710213D0 (en) Substrates
SG26295G (en) Semiconductor laser apparatus
GB2247124B (en) Demodulator circuit
GB2207289B (en) Metal film patterns on substrates
GB2206825B (en) Gemstone polishing apparatus
GB2147008B (en) Surface treatment
EP0484318A3 (en) Polishing method
GB8722057D0 (en) Soldering apparatus
GB8723237D0 (en) Onion peeling machine
GB8629794D0 (en) Voice pattern matching method
GB8713050D0 (en) Positioning apparatus
GB8705769D0 (en) Surface treatment
GB8718734D0 (en) Semiconductor surface treatment method