NO873533L - Fremgangsmaate og anordning for elektroplettering av kobberfolie. - Google Patents

Fremgangsmaate og anordning for elektroplettering av kobberfolie.

Info

Publication number
NO873533L
NO873533L NO873533A NO873533A NO873533L NO 873533 L NO873533 L NO 873533L NO 873533 A NO873533 A NO 873533A NO 873533 A NO873533 A NO 873533A NO 873533 L NO873533 L NO 873533L
Authority
NO
Norway
Prior art keywords
current density
electrolyte
pulsed
zone
applying
Prior art date
Application number
NO873533A
Other languages
English (en)
Norwegian (no)
Other versions
NO873533D0 (no
Inventor
Betty M Luce
Betty L Berdan
Original Assignee
Gould Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gould Inc filed Critical Gould Inc
Publication of NO873533D0 publication Critical patent/NO873533D0/no
Publication of NO873533L publication Critical patent/NO873533L/no

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Physical Vapour Deposition (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Control Of El Displays (AREA)
  • Spinning Or Twisting Of Yarns (AREA)
  • Laminated Bodies (AREA)
NO873533A 1985-12-24 1987-08-21 Fremgangsmaate og anordning for elektroplettering av kobberfolie. NO873533L (no)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US81309785A 1985-12-24 1985-12-24
PCT/US1986/002797 WO1987003915A1 (en) 1985-12-24 1986-12-23 A process and apparatus for electroplating copper foil

Publications (2)

Publication Number Publication Date
NO873533D0 NO873533D0 (no) 1987-08-21
NO873533L true NO873533L (no) 1987-08-21

Family

ID=25211440

Family Applications (1)

Application Number Title Priority Date Filing Date
NO873533A NO873533L (no) 1985-12-24 1987-08-21 Fremgangsmaate og anordning for elektroplettering av kobberfolie.

Country Status (13)

Country Link
US (1) US4898647A (show.php)
EP (1) EP0252139B1 (show.php)
JP (1) JPS63241193A (show.php)
AT (1) ATE92544T1 (show.php)
AU (1) AU602673B2 (show.php)
BR (1) BR8607061A (show.php)
DE (1) DE3688840T2 (show.php)
DK (1) DK439887D0 (show.php)
FI (1) FI873643A7 (show.php)
HU (1) HU208556B (show.php)
IN (1) IN166842B (show.php)
NO (1) NO873533L (show.php)
WO (1) WO1987003915A1 (show.php)

Families Citing this family (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4661213A (en) * 1986-02-13 1987-04-28 Dorsett Terry E Electroplate to moving metal
US5215645A (en) * 1989-09-13 1993-06-01 Gould Inc. Electrodeposited foil with controlled properties for printed circuit board applications and procedures and electrolyte bath solutions for preparing the same
US5403465A (en) * 1990-05-30 1995-04-04 Gould Inc. Electrodeposited copper foil and process for making same using electrolyte solutions having controlled additions of chloride ions and organic additives
US5393396A (en) * 1990-10-30 1995-02-28 Gould Inc. Apparatus for electrodepositing metal
US5228965A (en) * 1990-10-30 1993-07-20 Gould Inc. Method and apparatus for applying surface treatment to metal foil
JP3207909B2 (ja) * 1992-02-07 2001-09-10 ティーディーケイ株式会社 電気めっき方法および電気めっき用分割型不溶性電極
US5215646A (en) * 1992-05-06 1993-06-01 Circuit Foil Usa, Inc. Low profile copper foil and process and apparatus for making bondable metal foils
US5685970A (en) * 1992-07-01 1997-11-11 Gould Electronics Inc. Method and apparatus for sequentially metalized polymeric films and products made thereby
US5646814A (en) 1994-07-15 1997-07-08 Applied Materials, Inc. Multi-electrode electrostatic chuck
US5592358A (en) 1994-07-18 1997-01-07 Applied Materials, Inc. Electrostatic chuck for magnetic flux processing
JP3281783B2 (ja) * 1995-12-06 2002-05-13 三井金属鉱業株式会社 プリント配線板用銅箔、その製造法及び電解装置
US6730387B2 (en) 1996-04-24 2004-05-04 The Procter & Gamble Company Absorbent materials having improved structural stability in dry and wet states and making methods therefor
JPH10195689A (ja) * 1996-12-27 1998-07-28 Fukuda Metal Foil & Powder Co Ltd 微細孔明き金属箔の製造方法
US5863410A (en) * 1997-06-23 1999-01-26 Circuit Foil Usa, Inc. Process for the manufacture of high quality very low profile copper foil and copper foil produced thereby
US7244677B2 (en) * 1998-02-04 2007-07-17 Semitool. Inc. Method for filling recessed micro-structures with metallization in the production of a microelectronic device
AU2233399A (en) * 1998-02-12 1999-08-30 Acm Research, Inc. Plating apparatus and method
TW593731B (en) * 1998-03-20 2004-06-21 Semitool Inc Apparatus for applying a metal structure to a workpiece
US6565729B2 (en) * 1998-03-20 2003-05-20 Semitool, Inc. Method for electrochemically depositing metal on a semiconductor workpiece
US6497801B1 (en) * 1998-07-10 2002-12-24 Semitool Inc Electroplating apparatus with segmented anode array
CN1184359C (zh) * 1998-09-14 2005-01-12 三井金属鉱业株式会社 多孔铜箔及其用途和制造方法
WO2000026444A1 (en) * 1998-11-03 2000-05-11 The John Hopkins University Copper metallization structure and method of construction
US6309969B1 (en) 1998-11-03 2001-10-30 The John Hopkins University Copper metallization structure and method of construction
US6916412B2 (en) * 1999-04-13 2005-07-12 Semitool, Inc. Adaptable electrochemical processing chamber
US7264698B2 (en) * 1999-04-13 2007-09-04 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US6368475B1 (en) * 2000-03-21 2002-04-09 Semitool, Inc. Apparatus for electrochemically processing a microelectronic workpiece
US7351315B2 (en) 2003-12-05 2008-04-01 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US7351314B2 (en) 2003-12-05 2008-04-01 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US7160421B2 (en) * 1999-04-13 2007-01-09 Semitool, Inc. Turning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US20030038035A1 (en) * 2001-05-30 2003-02-27 Wilson Gregory J. Methods and systems for controlling current in electrochemical processing of microelectronic workpieces
US7020537B2 (en) 1999-04-13 2006-03-28 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US7585398B2 (en) * 1999-04-13 2009-09-08 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US7189318B2 (en) * 1999-04-13 2007-03-13 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US7438788B2 (en) * 1999-04-13 2008-10-21 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
TWI226387B (en) * 1999-04-13 2005-01-11 Semitool Inc Workpiece processor having processing chamber with improved processing fluid flow
KR19990064747A (ko) * 1999-05-06 1999-08-05 이종구 Ｎｉ-Ｆｅ 합금 박판 제조방법 및 그 장치
US6183607B1 (en) * 1999-06-22 2001-02-06 Ga-Tek Inc. Anode structure for manufacture of metallic foil
US20050183959A1 (en) * 2000-04-13 2005-08-25 Wilson Gregory J. Tuning electrodes used in a reactor for electrochemically processing a microelectric workpiece
US6913680B1 (en) 2000-05-02 2005-07-05 Applied Materials, Inc. Method of application of electrical biasing to enhance metal deposition
EP1337693A2 (en) * 2000-05-23 2003-08-27 Applied Materials, Inc. Method and apparatus to overcome anomalies in copper seed layers and to tune for feature size and aspect ratio
WO2001090434A2 (en) * 2000-05-24 2001-11-29 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
CN100469948C (zh) * 2000-10-03 2009-03-18 应用材料有限公司 一旦进入金属沉积用来倾斜基片的方法和相关设备
AU2002343330A1 (en) 2001-08-31 2003-03-10 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US6911136B2 (en) * 2002-04-29 2005-06-28 Applied Materials, Inc. Method for regulating the electrical power applied to a substrate during an immersion process
US20040108212A1 (en) * 2002-12-06 2004-06-10 Lyndon Graham Apparatus and methods for transferring heat during chemical processing of microelectronic workpieces
US20040206628A1 (en) * 2003-04-18 2004-10-21 Applied Materials, Inc. Electrical bias during wafer exit from electrolyte bath
EP1598449B1 (en) * 2004-04-26 2010-08-04 Rohm and Haas Electronic Materials, L.L.C. Improved plating method
US20060175201A1 (en) * 2005-02-07 2006-08-10 Hooman Hafezi Immersion process for electroplating applications
CN102321895B (zh) * 2011-09-01 2013-10-23 西安航天动力机械厂 一种整体式阳极槽
CN104099652A (zh) * 2014-07-09 2014-10-15 山东金宝电子股份有限公司 一种电子铜箔的表面处理粗化工艺
KR102029139B1 (ko) * 2015-11-09 2019-10-07 케이씨에프테크놀로지스 주식회사 전해동박, 그것을 포함하는 전극, 그것을 포함하는 이차전지, 및 그것의 제조방법

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4318794A (en) * 1980-11-17 1982-03-09 Edward Adler Anode for production of electrodeposited foil
US4490218A (en) * 1983-11-07 1984-12-25 Olin Corporation Process and apparatus for producing surface treated metal foil
US4549941A (en) * 1984-11-13 1985-10-29 Olin Corporation Electrochemical surface preparation for improving the adhesive properties of metallic surfaces
IT1182818B (it) * 1985-08-12 1987-10-05 Centro Speriment Metallurg Dispositivo a cella radiale per elettrodeposizione

Also Published As

Publication number Publication date
DK439887A (da) 1987-08-24
EP0252139A1 (en) 1988-01-13
FI873643L (fi) 1987-08-24
BR8607061A (pt) 1988-02-23
DE3688840D1 (de) 1993-09-09
US4898647A (en) 1990-02-06
HU208556B (en) 1993-11-29
ATE92544T1 (de) 1993-08-15
EP0252139A4 (en) 1988-03-22
DE3688840T2 (de) 1993-11-25
NO873533D0 (no) 1987-08-21
DK439887D0 (da) 1987-08-24
JPS63241193A (ja) 1988-10-06
EP0252139B1 (en) 1993-08-04
IN166842B (show.php) 1990-07-28
AU602673B2 (en) 1990-10-25
HUT46083A (en) 1988-09-28
FI873643A0 (fi) 1987-08-24
JPH031391B2 (show.php) 1991-01-10
FI873643A7 (fi) 1987-08-24
AU6898187A (en) 1987-07-15
WO1987003915A1 (en) 1987-07-02

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