NO850207L - Integrert kretsmodul og fremgangsmaate til dens fremstilling - Google Patents
Integrert kretsmodul og fremgangsmaate til dens fremstillingInfo
- Publication number
- NO850207L NO850207L NO850207A NO850207A NO850207L NO 850207 L NO850207 L NO 850207L NO 850207 A NO850207 A NO 850207A NO 850207 A NO850207 A NO 850207A NO 850207 L NO850207 L NO 850207L
- Authority
- NO
- Norway
- Prior art keywords
- conductors
- substrate
- chip
- recess
- flat side
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 24
- 238000004519 manufacturing process Methods 0.000 title claims description 17
- 239000004020 conductor Substances 0.000 claims description 234
- 239000000758 substrate Substances 0.000 claims description 117
- 238000007789 sealing Methods 0.000 claims description 28
- 239000000853 adhesive Substances 0.000 claims description 11
- 230000001070 adhesive effect Effects 0.000 claims description 11
- 238000005538 encapsulation Methods 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 6
- 239000011231 conductive filler Substances 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims 6
- 238000005452 bending Methods 0.000 claims 3
- 229920002799 BoPET Polymers 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000005041 Mylar™ Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000005304 joining Methods 0.000 description 4
- 238000005530 etching Methods 0.000 description 3
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 2
- 230000000873 masking effect Effects 0.000 description 2
- 239000002985 plastic film Substances 0.000 description 2
- 229920006255 plastic film Polymers 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000009429 electrical wiring Methods 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 239000011152 fibreglass Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 210000000056 organ Anatomy 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/585—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries comprising conductive layers or plates or strips or rods or rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49861—Lead-frames fixed on or encapsulated in insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US06/495,693 US4567545A (en) | 1983-05-18 | 1983-05-18 | Integrated circuit module and method of making same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NO850207L true NO850207L (no) | 1985-01-17 |
Family
ID=23969637
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NO850207A NO850207L (no) | 1983-05-18 | 1985-01-17 | Integrert kretsmodul og fremgangsmaate til dens fremstilling |
Country Status (16)
| Country | Link |
|---|---|
| US (1) | US4567545A (es) |
| EP (1) | EP0144343A4 (es) |
| JP (1) | JPS60501335A (es) |
| KR (1) | KR840009177A (es) |
| AU (1) | AU2819384A (es) |
| BR (1) | BR8406890A (es) |
| CA (1) | CA1214537A (es) |
| DK (1) | DK12385D0 (es) |
| ES (2) | ES8503196A1 (es) |
| GB (1) | GB2140205B (es) |
| IL (1) | IL71278A (es) |
| IT (1) | IT1173777B (es) |
| NO (1) | NO850207L (es) |
| PH (1) | PH21505A (es) |
| PT (1) | PT78587B (es) |
| WO (1) | WO1984004648A1 (es) |
Families Citing this family (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61296749A (ja) * | 1985-06-25 | 1986-12-27 | Toray Silicone Co Ltd | 半導体装置用リードフレームの製造方法 |
| FR2590052B1 (fr) * | 1985-11-08 | 1991-03-01 | Eurotechnique Sa | Procede de recyclage d'une carte comportant un composant, carte prevue pour etre recyclee |
| JPS62142850U (es) * | 1986-03-04 | 1987-09-09 | ||
| US4814943A (en) * | 1986-06-04 | 1989-03-21 | Oki Electric Industry Co., Ltd. | Printed circuit devices using thermoplastic resin cover plate |
| US4809135A (en) * | 1986-08-04 | 1989-02-28 | General Electric Company | Chip carrier and method of fabrication |
| US4791473A (en) * | 1986-12-17 | 1988-12-13 | Fairchild Semiconductor Corporation | Plastic package for high frequency semiconductor devices |
| US5255156A (en) * | 1989-02-22 | 1993-10-19 | The Boeing Company | Bonding pad interconnection on a multiple chip module having minimum channel width |
| US5008615A (en) * | 1989-11-03 | 1991-04-16 | Motorola, Inc. | Means and method for testing integrated circuits attached to a leadframe |
| JPH03211757A (ja) * | 1989-12-21 | 1991-09-17 | General Electric Co <Ge> | 気密封じの物体 |
| KR920018907A (ko) * | 1991-03-23 | 1992-10-22 | 김광호 | 반도체 리드 프레임 |
| DE4212948A1 (de) * | 1992-04-18 | 1993-10-21 | Telefunken Microelectron | Halbleiterbaugruppe, insbesondere Fernsteuer-Empfangsmodul |
| US5325268A (en) * | 1993-01-28 | 1994-06-28 | National Semiconductor Corporation | Interconnector for a multi-chip module or package |
| US5478420A (en) * | 1994-07-28 | 1995-12-26 | International Business Machines Corporation | Process for forming open-centered multilayer ceramic substrates |
| US6079332A (en) * | 1996-11-01 | 2000-06-27 | The Ensign-Bickford Company | Shock-resistant electronic circuit assembly |
| US6311621B1 (en) | 1996-11-01 | 2001-11-06 | The Ensign-Bickford Company | Shock-resistant electronic circuit assembly |
| JP3996668B2 (ja) | 1997-05-27 | 2007-10-24 | 富士通株式会社 | 半導体装置用ソケット |
| US6067594A (en) * | 1997-09-26 | 2000-05-23 | Rambus, Inc. | High frequency bus system |
| DE19962231A1 (de) * | 1999-12-22 | 2001-07-12 | Infineon Technologies Ag | Verfahren zur Herstellung mikromechanischer Strukturen |
| US6429385B1 (en) * | 2000-08-08 | 2002-08-06 | Micron Technology, Inc. | Non-continuous conductive layer for laminated substrates |
| US6853557B1 (en) * | 2000-09-20 | 2005-02-08 | Rambus, Inc. | Multi-channel memory architecture |
| US8391039B2 (en) * | 2001-04-24 | 2013-03-05 | Rambus Inc. | Memory module with termination component |
| US6675272B2 (en) * | 2001-04-24 | 2004-01-06 | Rambus Inc. | Method and apparatus for coordinating memory operations among diversely-located memory components |
| US7301831B2 (en) | 2004-09-15 | 2007-11-27 | Rambus Inc. | Memory systems with variable delays for write data signals |
| JP4806338B2 (ja) * | 2006-12-05 | 2011-11-02 | 富士通株式会社 | Ｃａｄ装置およびｃａｄプログラム |
Family Cites Families (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3385426A (en) * | 1966-03-18 | 1968-05-28 | Sprague Electric Co | Lead protecting structure |
| US3404215A (en) * | 1966-04-14 | 1968-10-01 | Sprague Electric Co | Hermetically sealed electronic module |
| US3544857A (en) * | 1966-08-16 | 1970-12-01 | Signetics Corp | Integrated circuit assembly with lead structure and method |
| FR2021484A1 (es) * | 1968-10-24 | 1970-07-24 | Inst Halvledarfors | |
| US3693252A (en) * | 1969-08-21 | 1972-09-26 | Globe Union Inc | A method of providing environmental protection for electrical circuit assemblies |
| CH518005A (de) * | 1970-01-21 | 1972-01-15 | Siemens Ag | Elektrisches Verbindungselement zur Verbindung einer mikroelektronischen Schaltung mit einer äusseren Verdrahtung |
| US3683105A (en) * | 1970-10-13 | 1972-08-08 | Westinghouse Electric Corp | Microcircuit modular package |
| US3691289A (en) * | 1970-10-22 | 1972-09-12 | Minnesota Mining & Mfg | Packaging of semiconductor devices |
| GB1376940A (en) * | 1970-12-10 | 1974-12-11 | Texas Instruments Inc | Panel board circuit systems |
| US3641401A (en) * | 1971-03-10 | 1972-02-08 | American Lava Corp | Leadless ceramic package for integrated circuits |
| US3735017A (en) * | 1971-04-12 | 1973-05-22 | Amp Inc | Lead frames and method of making same |
| US3702464A (en) * | 1971-05-04 | 1972-11-07 | Ibm | Information card |
| US3930115A (en) * | 1971-05-19 | 1975-12-30 | Philips Corp | Electric component assembly comprising insulating foil bearing conductor tracks |
| US3697666A (en) * | 1971-09-24 | 1972-10-10 | Diacon | Enclosure for incapsulating electronic components |
| GB1383297A (en) * | 1972-02-23 | 1974-02-12 | Plessey Co Ltd | Electrical integrated circuit package |
| US3836824A (en) * | 1972-10-24 | 1974-09-17 | Gen Electric | Mounting arrangement for flexible circuit |
| US3934336A (en) * | 1975-01-13 | 1976-01-27 | Burroughs Corporation | Electronic package assembly with capillary bridging connection |
| JPS51138165A (en) * | 1975-05-23 | 1976-11-29 | Mitsubishi Electric Corp | Package stracture for thermal resistance and shield |
| US4105861A (en) * | 1975-09-29 | 1978-08-08 | Semi-Alloys, Inc. | Hermetically sealed container for semiconductor and other electronic devices |
| US4079511A (en) * | 1976-07-30 | 1978-03-21 | Amp Incorporated | Method for packaging hermetically sealed integrated circuit chips on lead frames |
| CH623183A5 (en) * | 1976-11-26 | 1981-05-15 | Nitto Electric Ind Co | Circuit board and method for its production |
| JPS53149763A (en) * | 1977-06-01 | 1978-12-27 | Citizen Watch Co Ltd | Mounting method of semiconductor integrate circuit |
| US4164071A (en) * | 1977-12-27 | 1979-08-14 | Ford Motor Company | Method of forming a circuit board with integral terminals |
| JPS5724775U (es) * | 1980-07-17 | 1982-02-08 | ||
| JPS5729055A (en) * | 1980-07-29 | 1982-02-16 | Canon Inc | Automatic original feeder |
| DE3123198C2 (de) * | 1980-12-08 | 1993-10-07 | Gao Ges Automation Org | Trägerelemente für einen IC-Baustein |
| IT1212711B (it) * | 1983-03-09 | 1989-11-30 | Ates Componenti Elettron | Dispositivo a semiconduttore aforma di scheda piana con contatti elettrici su ambedue le facce eprocedimento per la sua fabbricazione. |
-
1983
- 1983-05-18 US US06/495,693 patent/US4567545A/en not_active Expired - Lifetime
-
1984
- 1984-03-19 IL IL71278A patent/IL71278A/xx not_active IP Right Cessation
- 1984-03-21 BR BR8406890A patent/BR8406890A/pt unknown
- 1984-03-21 WO PCT/US1984/000441 patent/WO1984004648A1/en not_active Application Discontinuation
- 1984-03-21 EP EP19840901652 patent/EP0144343A4/en not_active Withdrawn
- 1984-03-21 AU AU28193/84A patent/AU2819384A/en not_active Abandoned
- 1984-03-21 JP JP59501602A patent/JPS60501335A/ja active Pending
- 1984-03-28 CA CA000450649A patent/CA1214537A/en not_active Expired
- 1984-04-02 PH PH30485A patent/PH21505A/en unknown
- 1984-04-13 ES ES531587A patent/ES8503196A1/es not_active Expired
- 1984-05-10 GB GB08411969A patent/GB2140205B/en not_active Expired
- 1984-05-16 PT PT78587A patent/PT78587B/pt unknown
- 1984-05-16 IT IT20944/84A patent/IT1173777B/it active
- 1984-05-17 KR KR1019840002695A patent/KR840009177A/ko not_active Application Discontinuation
- 1984-08-28 ES ES535457A patent/ES535457A0/es active Granted
-
1985
- 1985-01-10 DK DK12385A patent/DK12385D0/da not_active Application Discontinuation
- 1985-01-17 NO NO850207A patent/NO850207L/no unknown
Also Published As
| Publication number | Publication date |
|---|---|
| PH21505A (en) | 1987-11-10 |
| US4567545A (en) | 1986-01-28 |
| BR8406890A (pt) | 1985-04-16 |
| GB2140205A (en) | 1984-11-21 |
| PT78587A (en) | 1984-06-01 |
| ES8601629A1 (es) | 1985-10-16 |
| WO1984004648A1 (en) | 1984-11-22 |
| CA1214537A (en) | 1986-11-25 |
| GB2140205B (en) | 1987-07-08 |
| ES531587A0 (es) | 1985-02-01 |
| IT8420944A1 (it) | 1985-11-16 |
| IT8420944A0 (it) | 1984-05-16 |
| AU2819384A (en) | 1984-12-04 |
| ES8503196A1 (es) | 1985-02-01 |
| GB8411969D0 (en) | 1984-06-13 |
| KR840009177A (ko) | 1984-12-24 |
| EP0144343A4 (en) | 1986-11-10 |
| IL71278A0 (en) | 1984-06-29 |
| EP0144343A1 (en) | 1985-06-19 |
| ES535457A0 (es) | 1985-10-16 |
| JPS60501335A (ja) | 1985-08-15 |
| PT78587B (en) | 1986-05-08 |
| DK12385A (da) | 1985-01-10 |
| IL71278A (en) | 1987-07-31 |
| IT1173777B (it) | 1987-06-24 |
| DK12385D0 (da) | 1985-01-10 |
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