NO319693B1 - Herdbar blanding inneholdende varmeherdbar harpiks samt fremgangsmate for herding derav - Google Patents
Herdbar blanding inneholdende varmeherdbar harpiks samt fremgangsmate for herding derav Download PDFInfo
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- NO319693B1 NO319693B1 NO19985830A NO985830A NO319693B1 NO 319693 B1 NO319693 B1 NO 319693B1 NO 19985830 A NO19985830 A NO 19985830A NO 985830 A NO985830 A NO 985830A NO 319693 B1 NO319693 B1 NO 319693B1
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- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 238000012994 industrial processing Methods 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- 239000012705 liquid precursor Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 238000009740 moulding (composite fabrication) Methods 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229930014626 natural product Natural products 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 150000001282 organosilanes Chemical class 0.000 description 1
- 150000002924 oxiranes Chemical group 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 229920002959 polymer blend Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920001021 polysulfide Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 229910000027 potassium carbonate Inorganic materials 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 239000012783 reinforcing fiber Substances 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 230000002459 sustained effect Effects 0.000 description 1
- 125000006836 terphenylene group Chemical group 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- DHCDFWKWKRSZHF-UHFFFAOYSA-L thiosulfate(2-) Chemical compound [O-]S([S-])(=O)=O DHCDFWKWKRSZHF-UHFFFAOYSA-L 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 238000007666 vacuum forming Methods 0.000 description 1
- 239000003039 volatile agent Substances 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Reinforced Plastic Materials (AREA)
- Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GBGB9612523.2A GB9612523D0 (en) | 1996-06-14 | 1996-06-14 | Improvements relating to resin compositions |
| PCT/IB1997/000701 WO1997047689A1 (fr) | 1996-06-14 | 1997-06-13 | Composition de resine thermodurcissable |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| NO985830D0 NO985830D0 (no) | 1998-12-11 |
| NO985830L NO985830L (no) | 1999-02-12 |
| NO319693B1 true NO319693B1 (no) | 2005-09-05 |
Family
ID=10795338
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NO19985830A NO319693B1 (no) | 1996-06-14 | 1998-12-11 | Herdbar blanding inneholdende varmeherdbar harpiks samt fremgangsmate for herding derav |
Country Status (13)
| Country | Link |
|---|---|
| US (1) | US6265491B1 (fr) |
| EP (1) | EP0929608B1 (fr) |
| JP (1) | JP3939356B2 (fr) |
| AT (1) | ATE234899T1 (fr) |
| AU (1) | AU729903B2 (fr) |
| BR (1) | BR9710850A (fr) |
| CA (1) | CA2258040C (fr) |
| DE (1) | DE69720014T2 (fr) |
| ES (1) | ES2191179T3 (fr) |
| GB (1) | GB9612523D0 (fr) |
| HK (1) | HK1023783A1 (fr) |
| NO (1) | NO319693B1 (fr) |
| WO (1) | WO1997047689A1 (fr) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19905448A1 (de) * | 1999-02-09 | 2000-08-10 | Bakelite Ag | Cyanatharze und Epoxidverbindungen enthaltende härtbare Mischungen |
| JP2003514057A (ja) * | 1999-11-04 | 2003-04-15 | サイテク・テクノロジー・コーポレーシヨン | 可変温度硬化性組成物 |
| US6294259B1 (en) | 2000-07-06 | 2001-09-25 | 3M Innovative Properties Company | Polyimide hybrid adhesives |
| KR100849289B1 (ko) * | 2000-08-22 | 2008-07-29 | 사이텍 테크놀러지 코포레이션 | 경화성 조성물내 가용화제로서 사용하기 위한 가요성 중합체 부재 |
| GB0028341D0 (en) * | 2000-11-21 | 2001-01-03 | Cytec Tech Corp | Thermally stable resin binder composition and method for binding fibres |
| JP2009511727A (ja) * | 2005-10-18 | 2009-03-19 | シンベンション アーゲー | 熱硬化粒子及びその製造方法 |
| BRPI0813210A2 (pt) | 2007-08-02 | 2014-12-23 | Dow Global Technologies Inc | "processo para amortecer vibrações num artigo, compósito tendo propriedades de amortecimento melhoradas em temperaturas elevadas e composição termofixa tendo propriedades de amortecimento melhoradas em temperaturas elevadas" |
| DE102008047657A1 (de) * | 2008-09-12 | 2010-03-25 | BAM Bundesanstalt für Materialforschung und -prüfung | Verfahren zur Erhöhung der Temperaturstabilität von Bauteilen aus Duroplast |
| US9567426B2 (en) | 2009-05-29 | 2017-02-14 | Cytec Technology Corp. | Engineered crosslinked thermoplastic particles for interlaminar toughening |
| GB201101302D0 (en) | 2011-01-25 | 2011-03-09 | Cytec Tech Corp | Benzoxazine resins |
| GB201113196D0 (en) | 2011-08-01 | 2011-09-14 | Cytec Tech Corp | Thermoset resin compositions with increased toughness |
| EP3508523A1 (fr) * | 2011-12-22 | 2019-07-10 | Cytec Industries Inc. | Résines de maléiimide |
| GB201122296D0 (en) | 2011-12-23 | 2012-02-01 | Cytec Tech Corp | Composite materials |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3776978A (en) * | 1972-01-07 | 1973-12-04 | M Markovitz | Epoxy resins containing phenolic accel-erators and organic titanates |
| JPS51129498A (en) | 1975-04-02 | 1976-11-11 | Hitachi Ltd | Thermosetting resin composition |
| JPS60243113A (ja) | 1984-05-17 | 1985-12-03 | Sumitomo Chem Co Ltd | 強靭性に優れたエポキシ樹脂組成物 |
| JPS62153349A (ja) * | 1985-12-27 | 1987-07-08 | Toray Ind Inc | 繊維強化プリプレグ用樹脂組成物の製法 |
| US5231150A (en) * | 1987-10-05 | 1993-07-27 | Imperial Chemical Industries Plc | Polymer composition |
| JPH01144437A (ja) * | 1987-12-01 | 1989-06-06 | Toshiba Corp | エポキシ樹脂組成物 |
| JP2791438B2 (ja) | 1988-09-09 | 1998-08-27 | 関西ペイント株式会社 | 樹脂組成物及びその硬化方法 |
| JPH04351626A (ja) | 1991-05-29 | 1992-12-07 | Kanegafuchi Chem Ind Co Ltd | 硬化性樹脂組成物 |
| US5741879A (en) * | 1995-03-03 | 1998-04-21 | Minnesota Mining And Manufacturing Company | Energy-polymerizable compositions comprising a cyanate ester monomer or oligomer and a polyol |
-
1996
- 1996-06-14 GB GBGB9612523.2A patent/GB9612523D0/en active Pending
-
1997
- 1997-06-13 DE DE69720014T patent/DE69720014T2/de not_active Expired - Lifetime
- 1997-06-13 CA CA002258040A patent/CA2258040C/fr not_active Expired - Lifetime
- 1997-06-13 EP EP97925214A patent/EP0929608B1/fr not_active Expired - Lifetime
- 1997-06-13 AT AT97925214T patent/ATE234899T1/de active
- 1997-06-13 US US09/202,280 patent/US6265491B1/en not_active Expired - Lifetime
- 1997-06-13 BR BR9710850-2A patent/BR9710850A/pt not_active IP Right Cessation
- 1997-06-13 WO PCT/IB1997/000701 patent/WO1997047689A1/fr active IP Right Grant
- 1997-06-13 ES ES97925214T patent/ES2191179T3/es not_active Expired - Lifetime
- 1997-06-13 JP JP50139998A patent/JP3939356B2/ja not_active Expired - Lifetime
- 1997-06-13 AU AU30440/97A patent/AU729903B2/en not_active Expired
-
1998
- 1998-12-11 NO NO19985830A patent/NO319693B1/no unknown
-
2000
- 2000-01-21 HK HK00100416A patent/HK1023783A1/xx not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| WO1997047689A1 (fr) | 1997-12-18 |
| DE69720014D1 (de) | 2003-04-24 |
| US6265491B1 (en) | 2001-07-24 |
| GB9612523D0 (en) | 1996-08-14 |
| NO985830L (no) | 1999-02-12 |
| EP0929608A1 (fr) | 1999-07-21 |
| AU3044097A (en) | 1998-01-07 |
| DE69720014T2 (de) | 2003-11-27 |
| BR9710850A (pt) | 2001-11-27 |
| NO985830D0 (no) | 1998-12-11 |
| JP3939356B2 (ja) | 2007-07-04 |
| AU729903B2 (en) | 2001-02-15 |
| EP0929608B1 (fr) | 2003-03-19 |
| JP2001501981A (ja) | 2001-02-13 |
| CA2258040C (fr) | 2007-07-31 |
| CA2258040A1 (fr) | 1997-12-18 |
| ES2191179T3 (es) | 2003-09-01 |
| HK1023783A1 (en) | 2000-09-22 |
| ATE234899T1 (de) | 2003-04-15 |
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