NL9400768A - Inrichting voor het met kunststof omhullen van een leadframe met chips. - Google Patents

Inrichting voor het met kunststof omhullen van een leadframe met chips. Download PDF

Info

Publication number
NL9400768A
NL9400768A NL9400768A NL9400768A NL9400768A NL 9400768 A NL9400768 A NL 9400768A NL 9400768 A NL9400768 A NL 9400768A NL 9400768 A NL9400768 A NL 9400768A NL 9400768 A NL9400768 A NL 9400768A
Authority
NL
Netherlands
Prior art keywords
plunger
plastic
casing material
mold
groove
Prior art date
Application number
NL9400768A
Other languages
English (en)
Dutch (nl)
Inventor
Hendrikus Johannes Bern Peters
Original Assignee
Fico Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fico Bv filed Critical Fico Bv
Priority to NL9400768A priority Critical patent/NL9400768A/nl
Priority to KR1019960700054A priority patent/KR100426198B1/ko
Priority to JP7528858A priority patent/JP2938190B2/ja
Priority to PCT/NL1995/000163 priority patent/WO1995031004A1/en
Priority to EP95916859A priority patent/EP0708985B1/en
Priority to DE69531584T priority patent/DE69531584T2/de
Priority to TW084104598A priority patent/TW261570B/zh
Publication of NL9400768A publication Critical patent/NL9400768A/nl
Priority to US08/871,899 priority patent/US6200504B1/en
Priority to HK98115280A priority patent/HK1014079A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
    • B29C45/58—Details
    • B29C45/586—Injection or transfer plungers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
NL9400768A 1994-05-09 1994-05-09 Inrichting voor het met kunststof omhullen van een leadframe met chips. NL9400768A (nl)

Priority Applications (9)

Application Number Priority Date Filing Date Title
NL9400768A NL9400768A (nl) 1994-05-09 1994-05-09 Inrichting voor het met kunststof omhullen van een leadframe met chips.
KR1019960700054A KR100426198B1 (ko) 1994-05-09 1995-05-04 칩을구비한리이드프레임을플라스틱으로피복하는장치
JP7528858A JP2938190B2 (ja) 1994-05-09 1995-05-04 チップを有するリードフレームをプラスティックでカプセル封入するための装置
PCT/NL1995/000163 WO1995031004A1 (en) 1994-05-09 1995-05-04 Apparatus for encapsulating with plastic a lead frame with chips
EP95916859A EP0708985B1 (en) 1994-05-09 1995-05-04 Apparatus for encapsulating with plastic a lead frame with chips
DE69531584T DE69531584T2 (de) 1994-05-09 1995-05-04 Anordnung zum einkapseln eines leiterrahmens für chips mit kunststoff
TW084104598A TW261570B (en) 1994-05-09 1995-05-09 Apparatus for encapsulating with plastic a lead-frame with chips
US08/871,899 US6200504B1 (en) 1994-05-09 1997-06-09 Method for encapsulating with plastic a lead frame with chips
HK98115280A HK1014079A1 (en) 1994-05-09 1998-12-23 Apparatus for encapsulating with plastic a lead frame with chips

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL9400768 1994-05-09
NL9400768A NL9400768A (nl) 1994-05-09 1994-05-09 Inrichting voor het met kunststof omhullen van een leadframe met chips.

Publications (1)

Publication Number Publication Date
NL9400768A true NL9400768A (nl) 1995-12-01

Family

ID=19864176

Family Applications (1)

Application Number Title Priority Date Filing Date
NL9400768A NL9400768A (nl) 1994-05-09 1994-05-09 Inrichting voor het met kunststof omhullen van een leadframe met chips.

Country Status (8)

Country Link
EP (1) EP0708985B1 (ko)
JP (1) JP2938190B2 (ko)
KR (1) KR100426198B1 (ko)
DE (1) DE69531584T2 (ko)
HK (1) HK1014079A1 (ko)
NL (1) NL9400768A (ko)
TW (1) TW261570B (ko)
WO (1) WO1995031004A1 (ko)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL1004460C2 (nl) * 1996-11-06 1998-05-08 Fico Bv Ejectorpen, vormdeel en mal voor het omhullen van electronische componenten alsmede een werkwijze voor het afdichten van een tussenruimte.
EP1030349B2 (de) † 1999-01-07 2013-12-11 Kulicke & Soffa Die Bonding GmbH Verfahren und Vorrichtung zum Behandeln von auf einem Substrat angeordneten elektronischen Bauteilen, insbesondere von Halbleiterchips
NL1026000C2 (nl) * 2004-04-22 2005-10-25 Fico Bv Plunjer, omhulinrichting en werkwijze voor het afdichten van een aansluiting van een plunjer op een plunjerbehuizing.
JP5484209B2 (ja) * 2010-06-15 2014-05-07 パナソニック株式会社 トランスファー成型方法とトランスファー成型装置
CN116631927B (zh) * 2023-07-19 2024-02-02 广州丰江微电子有限公司 带清洁功能的引线框架输送系统

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6341035A (ja) * 1986-08-06 1988-02-22 Mitsubishi Electric Corp 半導体装置の樹脂封止成形装置
WO1993011925A1 (en) * 1991-12-17 1993-06-24 Asm-Fico Tooling B.V. Scraping plunger

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6341035A (ja) * 1986-08-06 1988-02-22 Mitsubishi Electric Corp 半導体装置の樹脂封止成形装置
WO1993011925A1 (en) * 1991-12-17 1993-06-24 Asm-Fico Tooling B.V. Scraping plunger

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 012, no. 254 (E - 634) 16 July 1988 (1988-07-16) *

Also Published As

Publication number Publication date
DE69531584D1 (de) 2003-10-02
EP0708985A1 (en) 1996-05-01
TW261570B (en) 1995-11-01
HK1014079A1 (en) 1999-09-17
JPH09500496A (ja) 1997-01-14
DE69531584T2 (de) 2004-06-24
KR100426198B1 (ko) 2004-06-11
WO1995031004A1 (en) 1995-11-16
EP0708985B1 (en) 2003-08-27
KR960704355A (ko) 1996-08-31
JP2938190B2 (ja) 1999-08-23

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A1B A search report has been drawn up
BV The patent application has lapsed