NL9101544A - Werkwijze en inrichting voor het langs electrolytische weg plaatselijk aanbrengen van uit metaal bestaande bedekkingen op producten. - Google Patents

Werkwijze en inrichting voor het langs electrolytische weg plaatselijk aanbrengen van uit metaal bestaande bedekkingen op producten. Download PDF

Info

Publication number
NL9101544A
NL9101544A NL9101544A NL9101544A NL9101544A NL 9101544 A NL9101544 A NL 9101544A NL 9101544 A NL9101544 A NL 9101544A NL 9101544 A NL9101544 A NL 9101544A NL 9101544 A NL9101544 A NL 9101544A
Authority
NL
Netherlands
Prior art keywords
product
metal
belt
tape
masking
Prior art date
Application number
NL9101544A
Other languages
English (en)
Dutch (nl)
Original Assignee
Meco Equip Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Meco Equip Eng filed Critical Meco Equip Eng
Priority to NL9101544A priority Critical patent/NL9101544A/nl
Priority to EP92202713A priority patent/EP0537813B1/de
Priority to DE69207334T priority patent/DE69207334T2/de
Priority to AT92202713T priority patent/ATE132546T1/de
Priority to US07/943,577 priority patent/US5372699A/en
Priority to JP24456392A priority patent/JP3226978B2/ja
Publication of NL9101544A publication Critical patent/NL9101544A/nl

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/022—Electroplating of selected surface areas using masking means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
NL9101544A 1991-09-13 1991-09-13 Werkwijze en inrichting voor het langs electrolytische weg plaatselijk aanbrengen van uit metaal bestaande bedekkingen op producten. NL9101544A (nl)

Priority Applications (6)

Application Number Priority Date Filing Date Title
NL9101544A NL9101544A (nl) 1991-09-13 1991-09-13 Werkwijze en inrichting voor het langs electrolytische weg plaatselijk aanbrengen van uit metaal bestaande bedekkingen op producten.
EP92202713A EP0537813B1 (de) 1991-09-13 1992-09-08 Verfahren und Vorrichtung zum selektiven Elektroplattieren von Metallen auf Gegenständen
DE69207334T DE69207334T2 (de) 1991-09-13 1992-09-08 Verfahren und Vorrichtung zum selektiven Elektroplattieren von Metallen auf Gegenständen
AT92202713T ATE132546T1 (de) 1991-09-13 1992-09-08 Verfahren und vorrichtung zum selektiven elektroplattieren von metallen auf gegenständen
US07/943,577 US5372699A (en) 1991-09-13 1992-09-11 Method and apparatus for selective electroplating of metals on products
JP24456392A JP3226978B2 (ja) 1991-09-13 1992-09-14 ストリップ部材の選択電気メッキ方法および装置およびその実施に用いるマスキングベルトの製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL9101544A NL9101544A (nl) 1991-09-13 1991-09-13 Werkwijze en inrichting voor het langs electrolytische weg plaatselijk aanbrengen van uit metaal bestaande bedekkingen op producten.
NL9101544 1991-09-13

Publications (1)

Publication Number Publication Date
NL9101544A true NL9101544A (nl) 1993-04-01

Family

ID=19859693

Family Applications (1)

Application Number Title Priority Date Filing Date
NL9101544A NL9101544A (nl) 1991-09-13 1991-09-13 Werkwijze en inrichting voor het langs electrolytische weg plaatselijk aanbrengen van uit metaal bestaande bedekkingen op producten.

Country Status (6)

Country Link
US (1) US5372699A (de)
EP (1) EP0537813B1 (de)
JP (1) JP3226978B2 (de)
AT (1) ATE132546T1 (de)
DE (1) DE69207334T2 (de)
NL (1) NL9101544A (de)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6375741B2 (en) 1991-03-06 2002-04-23 Timothy J. Reardon Semiconductor processing spray coating apparatus
US6143145A (en) 1997-10-02 2000-11-07 Precious Plate Inc. Apparatus for continuous masking for selective electroplating and method
US6159354A (en) * 1997-11-13 2000-12-12 Novellus Systems, Inc. Electric potential shaping method for electroplating
US6027631A (en) * 1997-11-13 2000-02-22 Novellus Systems, Inc. Electroplating system with shields for varying thickness profile of deposited layer
US6179983B1 (en) 1997-11-13 2001-01-30 Novellus Systems, Inc. Method and apparatus for treating surface including virtual anode
US6126798A (en) * 1997-11-13 2000-10-03 Novellus Systems, Inc. Electroplating anode including membrane partition system and method of preventing passivation of same
US6156167A (en) 1997-11-13 2000-12-05 Novellus Systems, Inc. Clamshell apparatus for electrochemically treating semiconductor wafers
US7097755B2 (en) * 1998-12-01 2006-08-29 Asm Nutool, Inc. Electrochemical mechanical processing with advancible sweeper
WO2000049655A1 (en) * 1999-02-18 2000-08-24 Seiko Epson Corporation Semiconductor device, circuit board, method of manufacturing circuit board, and electronic device
US6436604B1 (en) 2001-01-30 2002-08-20 Eastman Kodak Company Photographic label suitable for packaging
FR2828890B1 (fr) * 2001-08-24 2004-02-13 Itt Mfg Enterprises Inc Dispositif de depot en continu par electrodeposition et composants electriques ou electroniques fabriques en bande comportant une couche de placage par electrodeposition
DE102004001107B4 (de) * 2004-01-05 2005-12-29 Siemens Ag Strukturierung auf Oberflächen mittels Folie
US7655117B2 (en) * 2005-04-06 2010-02-02 Leviton Manufacturing Co., Inc. Continuous plating system and method with mask registration
US7744732B2 (en) * 2005-04-06 2010-06-29 Leviton Manufacturing Company, Inc. Continuous plating system and method with mask registration
US8444841B2 (en) * 2006-08-07 2013-05-21 Autonetworks Technologies, Ltd. Partial plating method, a laser plating device, and a plated material
CN101368284B (zh) * 2007-08-15 2010-10-06 富葵精密组件(深圳)有限公司 电镀装置
US8182655B2 (en) * 2007-09-05 2012-05-22 Leviton Manufacturing Co., Inc. Plating systems and methods
JP5412198B2 (ja) * 2009-07-15 2014-02-12 三友セミコンエンジニアリング株式会社 連続部分めっき装置及びそれを用いた連続部分めっき方法
SG191114A1 (en) * 2010-12-23 2013-07-31 Framatome Connectors Int Plating method and apparatus, and strip obtained by this method
EP2476784A1 (de) * 2011-01-18 2012-07-18 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Verfahren zur Herstellung einer elektronischen Vorrichtung durch Elektroablagerung aus einer Ionenflüssigkeit
CN112423483A (zh) * 2020-11-18 2021-02-26 深圳市艾诺信射频电路有限公司 一种印刷电路板的处理方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4376017A (en) * 1982-01-04 1983-03-08 Western Electric Co., Inc. Methods of electrolytically treating portions of digitated strips and treating cell
JPS5928591A (ja) * 1982-08-09 1984-02-15 Sumitomo Electric Ind Ltd マスキング方法
GB2214930A (en) * 1988-02-11 1989-09-13 Twickenham Plating & Enamellin Mask for use in electriplating on elongate substrate

Also Published As

Publication number Publication date
EP0537813B1 (de) 1996-01-03
ATE132546T1 (de) 1996-01-15
JPH05255887A (ja) 1993-10-05
US5372699A (en) 1994-12-13
EP0537813A3 (en) 1993-07-14
JP3226978B2 (ja) 2001-11-12
DE69207334D1 (de) 1996-02-15
EP0537813A2 (de) 1993-04-21
DE69207334T2 (de) 1996-05-15

Similar Documents

Publication Publication Date Title
NL9101544A (nl) Werkwijze en inrichting voor het langs electrolytische weg plaatselijk aanbrengen van uit metaal bestaande bedekkingen op producten.
US4089733A (en) Method of forming complex shaped metal-plastic composite lead frames for IC packaging
CA1137648A (en) Method of manufacturing flexible printed circuit sheets
AU2005249002A1 (en) Improvements in or relating to article tagging
EP0701280B1 (de) Leiterrahmen und Herstellungsverfahren
US5410124A (en) Tracking sensor fixture and method for tracking reference locations on a moving semiconductor leadframe strip
US5345039A (en) Film carrier
US5495780A (en) Method for sharpening an IC lead-frame punch
US7157309B2 (en) Manufacture of microelectronic fold packages
KR0128173B1 (ko) 아이씨(ic) 리이드의 구부러짐 교정장치
NL9100640A (nl) Inrichting voor het aanbrengen van vlekvormige bedekkingen.
US4787426A (en) High-speed electrical component lead forming apparatus and method
US6540927B2 (en) Semiconductor packaging part and method producing the same
JP2524645B2 (ja) リ―ドフレ―ムおよびその製造方法
JPH11186340A (ja) Ｔａｂテープの搬送位置決め機構
EP3923194A1 (de) Kartenherstellungsverfahren
JPH01145915A (ja) Ｉｃ基板搬送装置
JP2000025709A (ja) 半導体装置の製造方法，その方法で使用されるキャリヤテープおよび半導体製造装置
JPH09321205A (ja) 半導体装置の製造方法およびその方法で用いるリードフレームならびにリードフレームの製造方法
EP0225505A2 (de) Vorrichtung zur Folienentfernung
JP3018025B2 (ja) リードフレームの製造設備
JPH06177595A (ja) 電子部品認識実装機における装着精度測定方法と測定治具
JP2731292B2 (ja) 搬送テープ及びその製造方法
JP3005503B2 (ja) タイバー切断型用パンチガイドおよびその切断方法
JP3018024B2 (ja) リードフレームの製造方法

Legal Events

Date Code Title Description
A1B A search report has been drawn up
BV The patent application has lapsed