NL8103574A - Werkwijze en inrichting voor het plaatsen van elektrische en/of elektronische onderdelen op een substraat. - Google Patents

Werkwijze en inrichting voor het plaatsen van elektrische en/of elektronische onderdelen op een substraat. Download PDF

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Publication number
NL8103574A
NL8103574A NL8103574A NL8103574A NL8103574A NL 8103574 A NL8103574 A NL 8103574A NL 8103574 A NL8103574 A NL 8103574A NL 8103574 A NL8103574 A NL 8103574A NL 8103574 A NL8103574 A NL 8103574A
Authority
NL
Netherlands
Prior art keywords
parts
transfer
transfer arms
program plate
substrate
Prior art date
Application number
NL8103574A
Other languages
English (en)
Dutch (nl)
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Priority to NL8103574A priority Critical patent/NL8103574A/nl
Priority to US06/345,881 priority patent/US4480780A/en
Priority to AT82200921T priority patent/ATE16552T1/de
Priority to EP82200921A priority patent/EP0071303B1/fr
Priority to DE8282200921T priority patent/DE3267420D1/de
Priority to CA000407845A priority patent/CA1206327A/fr
Priority to KR8203358A priority patent/KR880002065B1/ko
Priority to ES514415A priority patent/ES514415A0/es
Priority to JP57131323A priority patent/JPS5827393A/ja
Publication of NL8103574A publication Critical patent/NL8103574A/nl
Priority to ES523201A priority patent/ES523201A0/es
Priority to HK587/86A priority patent/HK58786A/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0478—Simultaneously mounting of different components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53191—Means to apply vacuum directly to position or hold work part
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53261—Means to align and advance work part

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Structure Of Printed Boards (AREA)
  • Wire Bonding (AREA)
  • Manipulator (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Automatic Analysis And Handling Materials Therefor (AREA)
NL8103574A 1981-07-29 1981-07-29 Werkwijze en inrichting voor het plaatsen van elektrische en/of elektronische onderdelen op een substraat. NL8103574A (nl)

Priority Applications (11)

Application Number Priority Date Filing Date Title
NL8103574A NL8103574A (nl) 1981-07-29 1981-07-29 Werkwijze en inrichting voor het plaatsen van elektrische en/of elektronische onderdelen op een substraat.
US06/345,881 US4480780A (en) 1981-07-29 1982-02-04 Method of and device for positioning electrical and/or electronic components on a substrate
AT82200921T ATE16552T1 (de) 1981-07-29 1982-07-20 Verfahren und vorrichtung zur positionierung von elektrischen und/oder elektronischen bauelementen auf einem traeger.
EP82200921A EP0071303B1 (fr) 1981-07-29 1982-07-20 Procédé et dispositif de positionnement de composants électriques et/ou électroniques sur un substrat
DE8282200921T DE3267420D1 (en) 1981-07-29 1982-07-20 Method of and device for positioning electrical and or electronic components on a substrate
CA000407845A CA1206327A (fr) 1981-07-29 1982-07-22 Methode et dispositif de positionnement de composants electriques et electroniques sur un support
KR8203358A KR880002065B1 (ko) 1981-07-29 1982-07-27 기판상에 전기 및 전자소자 위치설정방법 및 장치
ES514415A ES514415A0 (es) 1981-07-29 1982-07-27 Metodo de posicionar componentes electricos y-o electronicos sobre un substrato, tal como una placa de circuito impresos y substrato correspondiente.
JP57131323A JPS5827393A (ja) 1981-07-29 1982-07-29 電気及び／又は電子部品を基板上に位置決めする方法並びにそのための装置
ES523201A ES523201A0 (es) 1981-07-29 1983-06-13 "un dispositivo para posicionar componentes electricos yno electronicos sobre un substrato, tal como una placa de circuito impreso"
HK587/86A HK58786A (en) 1981-07-29 1986-08-07 Method of and device for positioning electrical and or electronic components on a substrate

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL8103574A NL8103574A (nl) 1981-07-29 1981-07-29 Werkwijze en inrichting voor het plaatsen van elektrische en/of elektronische onderdelen op een substraat.
NL8103574 1981-07-29

Publications (1)

Publication Number Publication Date
NL8103574A true NL8103574A (nl) 1983-02-16

Family

ID=19837866

Family Applications (1)

Application Number Title Priority Date Filing Date
NL8103574A NL8103574A (nl) 1981-07-29 1981-07-29 Werkwijze en inrichting voor het plaatsen van elektrische en/of elektronische onderdelen op een substraat.

Country Status (10)

Country Link
US (1) US4480780A (fr)
EP (1) EP0071303B1 (fr)
JP (1) JPS5827393A (fr)
KR (1) KR880002065B1 (fr)
AT (1) ATE16552T1 (fr)
CA (1) CA1206327A (fr)
DE (1) DE3267420D1 (fr)
ES (2) ES514415A0 (fr)
HK (1) HK58786A (fr)
NL (1) NL8103574A (fr)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL8303816A (nl) * 1983-11-05 1985-06-03 Philips Nv Inrichting voor het toevoeren van in band verpakte electronische onderdelen naar een opneempositie.
JPS6052668A (ja) * 1983-08-24 1985-03-25 サカタインクス株式会社 染液自動調製調液装置
NL8303797A (nl) * 1983-11-04 1985-06-03 Philips Nv Inrichting voor het aanbrengen van een bevestigingsmiddel op electronische onderdelen, in het bijzonder op chipvormige onderdelen.
NL8304185A (nl) * 1983-12-06 1985-07-01 Philips Nv Stempel en inrichting voor het aanbrengen van druppels van een viskeuze vloeistof op een substraat.
DE3532500C2 (de) * 1984-09-17 1996-03-14 Tdk Corp Pneumatisch betätigter Bestückungskopf mit Saugkammer für eine Saugpipette
GB2173426A (en) * 1985-04-09 1986-10-15 Dynapert Precima Ltd Component placement machine
US4670981A (en) * 1986-03-17 1987-06-09 Nitto Kogyo Kabushiki Kaisha Method of mounting electronic parts on the predetermined positions of a printed circuit board
EP0243543B1 (fr) * 1986-04-28 1990-12-12 International Business Machines Corporation Robot d'assemblage avec outil de robot pour le placement d'une pluralité de composants sur une pièce
US4817273A (en) * 1987-04-30 1989-04-04 Reliability Incorporated Burn-in board loader and unloader
CA1320005C (fr) * 1988-06-16 1993-07-06 Kotaro Harigane Dispositif de montage d'element electronique
NL8900027A (nl) * 1989-01-06 1990-08-01 Philips Nv Werkwijze en inrichting voor het plaatsen van onderdelen op een drager.
DE59002636D1 (de) * 1989-06-01 1993-10-14 Siemens Ag Vorrichtung zum handhaben von objekten und anwendung der vorrichtung.
US5058263A (en) * 1989-12-21 1991-10-22 U.S. Philips Corporation Manipulation device
US6536427B2 (en) 1990-03-02 2003-03-25 Glaxo Group Limited Inhalation device
UA26230A (uk) 1990-03-02 1999-07-19 Глексо Груп Лімітед Іhгалятор для спільhого використаhhя з лікувальhим блоком і лікувальhий блок
GB9004781D0 (en) * 1990-03-02 1990-04-25 Glaxo Group Ltd Device
HU213221B (en) 1990-03-02 1997-03-28 Glaxo Group Ltd Inhalation device and medicine packet for device
US5040291A (en) * 1990-05-04 1991-08-20 Universal Instruments Corporation Multi-spindle pick and place method and apparatus
US5377405A (en) * 1992-07-01 1995-01-03 Yamaha Hatsudoki Kabushiki Kaisha Method for mounting components and an apparatus therefor
US5657528A (en) * 1994-08-25 1997-08-19 Matsushita Electric Industrial Co., Ltd. Method of transferring conductive balls
US7100278B2 (en) 1995-11-06 2006-09-05 Matsushita Electric Industrial Co., Ltd. Component mounting apparatus and method
US6789310B1 (en) * 1995-11-06 2004-09-14 Matsushita Electric Industrial Co., Ltd. Component mounting apparatus
JPH09130084A (ja) * 1995-11-06 1997-05-16 Matsushita Electric Ind Co Ltd 部品実装装置および部品実装設備
US6145901A (en) * 1996-03-11 2000-11-14 Rich; Donald S. Pick and place head construction
WO2001024598A1 (fr) * 1999-09-27 2001-04-05 Matsushita Electric Industrial Co., Ltd. Procede et dispositif de montage de composants
JP2001135995A (ja) * 1999-11-05 2001-05-18 Matsushita Electric Ind Co Ltd 部品実装装置及び方法
JP3828807B2 (ja) * 2000-01-14 2006-10-04 芝浦メカトロニクス株式会社 部品実装装置および部品実装方法
KR100348400B1 (ko) * 2000-05-20 2002-08-10 미래산업 주식회사 표면실장장치의 모듈헤드의 노즐회전장치
US20030106210A1 (en) * 2000-05-22 2003-06-12 Yoshiyuki Arai Chip-mounting device and method of alignment
DE10057787A1 (de) * 2000-11-22 2002-06-06 Siemens Ag Einrichtung zum Wechseln von Saugpipetten
DE10114717A1 (de) * 2001-03-26 2002-10-02 Sillner Georg Vorrichtung zum Einbringen von elektrischen Bauelementen in einen Gurt
JP4582525B2 (ja) * 2004-07-30 2010-11-17 アセムブレオン エヌ ヴィ 部品載置装置
NL1027319C2 (nl) * 2004-10-22 2006-05-01 Cats Beheer B V Werkwijze en inrichting voor het plaatsen van elektronische componenten op een substraat.
US8905478B2 (en) * 2010-03-17 2014-12-09 Britax Child Safety, Inc. Child safety seat with structural support

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3958740A (en) * 1974-07-08 1976-05-25 Dixon Automation, Inc. Automatic component assembly machine and method relating thereto
US4119211A (en) * 1976-10-22 1978-10-10 Western Electric Company, Inc. Method and apparatus for transferring articles while re-establishing their orientation
US4151945A (en) * 1977-12-08 1979-05-01 Universal Instruments Corporation Automated hybrid circuit board assembly apparatus
GB2034613B (en) * 1978-11-09 1983-01-19 Tokyo Shibaura Electric Co Method and apparatus for mounting electronic components
JPS5599795A (en) * 1979-01-25 1980-07-30 Matsushita Electric Ind Co Ltd Device for mounting electronic part
JPS55118698A (en) * 1979-03-05 1980-09-11 Matsushita Electric Ind Co Ltd Device for mounting electronic part
US4267003A (en) * 1979-08-14 1981-05-12 Trw Inc. Automatic solar cell glassing machine and method
JPS5636196A (en) * 1979-09-03 1981-04-09 Sony Corp Apparatus for assembling electronic device circuit
JPS6311756Y2 (fr) * 1980-04-25 1988-04-05
US4342090A (en) * 1980-06-27 1982-07-27 International Business Machines Corp. Batch chip placement system

Also Published As

Publication number Publication date
ES8400649A1 (es) 1983-10-16
ES514415A0 (es) 1983-10-16
EP0071303B1 (fr) 1985-11-13
DE3267420D1 (en) 1985-12-19
JPH0345559B2 (fr) 1991-07-11
ATE16552T1 (de) 1985-11-15
KR840001051A (ko) 1984-03-26
US4480780A (en) 1984-11-06
EP0071303A1 (fr) 1983-02-09
HK58786A (en) 1986-08-15
JPS5827393A (ja) 1983-02-18
KR880002065B1 (ko) 1988-10-14
ES8403690A1 (es) 1984-03-16
ES523201A0 (es) 1984-03-16
CA1206327A (fr) 1986-06-24

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Legal Events

Date Code Title Description
A1B A search report has been drawn up
A85 Still pending on 85-01-01
BV The patent application has lapsed