NL7909108A - Op een bord met gedrukte bedrading gemonteerde electronische schakeling. - Google Patents
Op een bord met gedrukte bedrading gemonteerde electronische schakeling. Download PDFInfo
- Publication number
- NL7909108A NL7909108A NL7909108A NL7909108A NL7909108A NL 7909108 A NL7909108 A NL 7909108A NL 7909108 A NL7909108 A NL 7909108A NL 7909108 A NL7909108 A NL 7909108A NL 7909108 A NL7909108 A NL 7909108A
- Authority
- NL
- Netherlands
- Prior art keywords
- wireless electronic
- solder
- parts
- electronic circuit
- connecting wireless
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09772—Conductors directly under a component but not electrically connected to the component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10363—Jumpers, i.e. non-printed cross-over connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/1053—Mounted components directly electrically connected to each other, i.e. not via the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10583—Cylindrically shaped component; Fixing means therefore
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15781778 | 1978-12-18 | ||
JP15781778A JPS5582487A (en) | 1978-12-18 | 1978-12-18 | Electronic circuit device |
Publications (1)
Publication Number | Publication Date |
---|---|
NL7909108A true NL7909108A (nl) | 1980-06-20 |
Family
ID=15657940
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL7909108A NL7909108A (nl) | 1978-12-18 | 1979-12-18 | Op een bord met gedrukte bedrading gemonteerde electronische schakeling. |
Country Status (6)
Country | Link |
---|---|
JP (1) | JPS5582487A (ja) |
CA (1) | CA1140680A (ja) |
DE (1) | DE2950450A1 (ja) |
GB (1) | GB2037489B (ja) |
IT (1) | IT1193457B (ja) |
NL (1) | NL7909108A (ja) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5724775U (ja) * | 1980-07-17 | 1982-02-08 | ||
GB2129223A (en) * | 1982-10-09 | 1984-05-10 | Welwyn Electronics Ltd | Printed circuit boards |
GB2147148A (en) * | 1983-09-27 | 1985-05-01 | John Patrick Burke | Electronic circuit assembly |
JPS61210601A (ja) * | 1985-03-14 | 1986-09-18 | 進工業株式会社 | チツプ抵抗器 |
FR2584887A1 (fr) * | 1985-07-12 | 1987-01-16 | Thomson Semi Conducteurs | Boitier bipole pour composant en surface et conditionnement de boitiers selon l'invention |
US4801904A (en) * | 1986-01-14 | 1989-01-31 | Murata Manufacturing Co., Ltd. | Chip-like LC filter |
DE3619212A1 (de) * | 1986-06-07 | 1987-12-10 | Philips Patentverwaltung | Passives elektrisches bauelement |
US4761881A (en) * | 1986-09-15 | 1988-08-09 | International Business Machines Corporation | Single step solder process |
US4755785A (en) * | 1987-01-29 | 1988-07-05 | Bel Fuse Inc. | Surface mounted fuse assembly |
DE4126913A1 (de) * | 1991-08-14 | 1993-02-18 | Siemens Ag | Verfahren zum beloten und montieren von leiterplatten mit bauelementen |
JP3152834B2 (ja) * | 1993-06-24 | 2001-04-03 | 株式会社東芝 | 電子回路装置 |
JP7390969B2 (ja) | 2020-05-12 | 2023-12-04 | 株式会社豊田中央研究所 | 精紡機用リングおよびその製造方法 |
-
1978
- 1978-12-18 JP JP15781778A patent/JPS5582487A/ja active Granted
-
1979
- 1979-12-14 DE DE19792950450 patent/DE2950450A1/de not_active Withdrawn
- 1979-12-14 GB GB7943132A patent/GB2037489B/en not_active Expired
- 1979-12-17 IT IT42915/79A patent/IT1193457B/it active
- 1979-12-17 CA CA000342057A patent/CA1140680A/en not_active Expired
- 1979-12-18 NL NL7909108A patent/NL7909108A/nl not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
GB2037489B (en) | 1983-05-05 |
IT1193457B (it) | 1988-06-22 |
JPS5582487A (en) | 1980-06-21 |
GB2037489A (en) | 1980-07-09 |
CA1140680A (en) | 1983-02-01 |
IT7942915A0 (it) | 1979-12-17 |
JPS6149838B2 (ja) | 1986-10-31 |
DE2950450A1 (de) | 1980-07-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A85 | Still pending on 85-01-01 | ||
BV | The patent application has lapsed |