NL7604903A - Chipverbindingsinrichting. - Google Patents

Chipverbindingsinrichting.

Info

Publication number
NL7604903A
NL7604903A NL7604903A NL7604903A NL7604903A NL 7604903 A NL7604903 A NL 7604903A NL 7604903 A NL7604903 A NL 7604903A NL 7604903 A NL7604903 A NL 7604903A NL 7604903 A NL7604903 A NL 7604903A
Authority
NL
Netherlands
Prior art keywords
link device
chip link
chip
link
Prior art date
Application number
NL7604903A
Other languages
English (en)
Other versions
NL175958B (nl
NL175958C (nl
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Publication of NL7604903A publication Critical patent/NL7604903A/nl
Publication of NL175958B publication Critical patent/NL175958B/nl
Application granted granted Critical
Publication of NL175958C publication Critical patent/NL175958C/nl

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/83801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01073—Tantalum [Ta]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
NLAANVRAGE7604903,A 1975-05-10 1976-05-07 Inrichting voor het nauwkeurig op de opneempositie van een opneemorgaan plaatsen van een op te nemen blokvormig halfgeleiderelement. NL175958C (nl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50056621A JPS51131274A (en) 1975-05-10 1975-05-10 Tip bonding method

Publications (3)

Publication Number Publication Date
NL7604903A true NL7604903A (nl) 1976-11-12
NL175958B NL175958B (nl) 1984-08-16
NL175958C NL175958C (nl) 1985-01-16

Family

ID=13032342

Family Applications (1)

Application Number Title Priority Date Filing Date
NLAANVRAGE7604903,A NL175958C (nl) 1975-05-10 1976-05-07 Inrichting voor het nauwkeurig op de opneempositie van een opneemorgaan plaatsen van een op te nemen blokvormig halfgeleiderelement.

Country Status (7)

Country Link
US (1) US4103814A (nl)
JP (1) JPS51131274A (nl)
DE (1) DE2620599C2 (nl)
FR (1) FR2311403A1 (nl)
GB (1) GB1528996A (nl)
IT (1) IT1063266B (nl)
NL (1) NL175958C (nl)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4644642A (en) * 1982-04-21 1987-02-24 U.S. Philips Corporation Method of and device for placing chip-type electrical and/or electronic components on a substrate

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS524178A (en) * 1975-06-27 1977-01-13 Nec Corp Small object automatic positioning apparatus
JPS5482168A (en) * 1977-12-14 1979-06-30 Fujitsu Ltd Diboinding method for semiconductor chip
US4977361A (en) * 1978-06-26 1990-12-11 Eaton Corporation X-Y addressable workpiece positioner and mask aligner using same
US4687980A (en) * 1980-10-20 1987-08-18 Eaton Corporation X-Y addressable workpiece positioner and mask aligner using same
JPS55165643A (en) * 1979-06-12 1980-12-24 Fujitsu Ltd Device for bonding pellet
US4450579A (en) * 1980-06-10 1984-05-22 Fujitsu Limited Recognition method and apparatus
JPS57160134A (en) * 1981-03-28 1982-10-02 Shinkawa Ltd Pellet bonding apparatus
JPS58112387A (ja) * 1981-12-26 1983-07-04 池上通信機株式会社 電子部品のプリント基板への自動插入装置
JPS58200550A (ja) * 1982-05-18 1983-11-22 Marine Instr Co Ltd Ｉｃチツプの摘出方法及びその装置
JPS5942039U (ja) * 1982-09-10 1984-03-17 日本電気株式会社 半導体部品の組立装置
JPS6012550A (ja) * 1983-07-04 1985-01-22 Nippon Kogaku Kk <Nikon> 露光転写装置用マスク供給装置
DE3672631D1 (de) * 1985-02-28 1990-08-23 Siemens Ag Verfahren zur lagebestimmung eines objekts in einem automatisierten fertigungsverfahren und vorrichtung zur durchfuehrung des verfahrens.
US4619395A (en) * 1985-10-04 1986-10-28 Kulicke And Soffa Industries, Inc. Low inertia movable workstation
US4696096A (en) * 1986-02-21 1987-09-29 Micro Electronic Systems, Inc. Reworking methods and apparatus for surface mounted technology circuit boards
US5059559A (en) * 1987-11-02 1991-10-22 Hitachi, Ltd. Method of aligning and bonding tab inner leads
US4927069A (en) * 1988-07-15 1990-05-22 Sanken Electric Co., Ltd. Soldering method capable of providing a joint of reduced thermal resistance
JPH0267739A (ja) * 1988-09-01 1990-03-07 Mitsubishi Electric Corp ダイボンディング方法とその装置
US4899921A (en) * 1988-10-28 1990-02-13 The American Optical Corporation Aligner bonder
US5251266A (en) * 1990-08-27 1993-10-05 Sierra Research And Technology, Inc. System for placement and mounting of fine pitch integrated circuit devices using a split mirror assembly
US5627913A (en) * 1990-08-27 1997-05-06 Sierra Research And Technology, Inc. Placement system using a split imaging system coaxially coupled to a component pickup means
US5235407A (en) * 1990-08-27 1993-08-10 Sierra Research And Technology, Inc. System for placement and mounting of fine pitch integrated circuit devices
US5317803A (en) * 1991-05-30 1994-06-07 Sierra Research And Technology, Inc. Method of soldering an integrated circuit
US5303824A (en) * 1992-12-04 1994-04-19 International Business Machines Corporations Solder preform carrier and use
KR0163366B1 (ko) * 1993-11-26 1999-02-01 오쿠라 고이치 펠레트 본딩장치
US6137299A (en) * 1997-06-27 2000-10-24 International Business Machines Corporation Method and apparatus for testing integrated circuit chips
CH694931A5 (de) * 2000-03-17 2005-09-15 Esec Trading Sa Einrichtung fuer die Montage von Halbleiterchips auf einem Substrat.
JP2001338935A (ja) * 2000-05-26 2001-12-07 Nidec Copal Corp ダイボンディング装置
KR101603536B1 (ko) * 2012-12-21 2016-03-15 가부시키가이샤 신가와 플립 칩 본더 및 본딩 스테이지의 평탄도 및 변형량 보정 방법

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3038369A (en) * 1958-12-22 1962-06-12 Bell Telephone Labor Inc Positioning a transistor by use of the optical reflectance characteristics of the electrode stripes
GB1063818A (en) * 1963-12-23 1967-03-30 Mitsui Seiki Kogyo Co Ld Automatic positioning device for machine tool
US3466514A (en) * 1967-06-26 1969-09-09 Ibm Method and apparatus for positioning objects in preselected orientations
US3581375A (en) * 1969-03-07 1971-06-01 Ibm Method and apparatus for manufacturing integrated circuits
US3695501A (en) * 1970-05-21 1972-10-03 Automated Equipment Corp Die bonder apparatus
GB1366369A (en) * 1971-11-30 1974-09-11 Ferranti Ltd Detection of faults on surfaces
US3943359A (en) * 1973-06-15 1976-03-09 Hitachi, Ltd. Apparatus for relatively positioning a plurality of objects by the use of a scanning optoelectric microscope

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4644642A (en) * 1982-04-21 1987-02-24 U.S. Philips Corporation Method of and device for placing chip-type electrical and/or electronic components on a substrate

Also Published As

Publication number Publication date
IT1063266B (it) 1985-02-11
DE2620599C2 (de) 1984-09-20
FR2311403A1 (fr) 1976-12-10
DE2620599A1 (de) 1976-11-25
US4103814A (en) 1978-08-01
FR2311403B1 (nl) 1979-10-05
NL175958B (nl) 1984-08-16
NL175958C (nl) 1985-01-16
JPS51131274A (en) 1976-11-15
GB1528996A (en) 1978-10-18
JPS5524695B2 (nl) 1980-07-01

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Legal Events

Date Code Title Description
V4 Discontinued because of reaching the maximum lifetime of a patent

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