NL7402112A - - Google Patents
Info
- Publication number
- NL7402112A NL7402112A NL7402112A NL7402112A NL7402112A NL 7402112 A NL7402112 A NL 7402112A NL 7402112 A NL7402112 A NL 7402112A NL 7402112 A NL7402112 A NL 7402112A NL 7402112 A NL7402112 A NL 7402112A
- Authority
- NL
- Netherlands
- Prior art keywords
- leads
- frame
- strip
- plate
- feb
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/01—Manufacture or treatment
- H10W70/04—Manufacture or treatment of leadframes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/0198—Manufacture or treatment batch processes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/456—Materials
- H10W70/457—Materials of metallic layers on leadframes
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP48019670A JPS5144385B2 (https=) | 1973-02-16 | 1973-02-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NL7402112A true NL7402112A (https=) | 1974-08-20 |
Family
ID=12005666
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL7402112A NL7402112A (https=) | 1973-02-16 | 1974-02-15 |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JPS5144385B2 (https=) |
| DE (1) | DE2406086A1 (https=) |
| FR (1) | FR2218654A1 (https=) |
| GB (1) | GB1406207A (https=) |
| IT (1) | IT1008848B (https=) |
| NL (1) | NL7402112A (https=) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5519001Y2 (https=) * | 1975-08-15 | 1980-05-06 | ||
| JPS5299069A (en) * | 1976-02-16 | 1977-08-19 | Hitachi Ltd | Production of lead frame |
| JPS5322660U (https=) * | 1976-08-05 | 1978-02-25 | ||
| DE3040676A1 (de) * | 1980-10-29 | 1982-05-27 | Philips Patentverwaltung Gmbh, 2000 Hamburg | Verfahren zum herstellen von halbleiteranordnugen |
| JPS5832439A (ja) * | 1982-03-01 | 1983-02-25 | Nec Corp | リ−ドフレ−ム |
| US5038453A (en) * | 1988-07-22 | 1991-08-13 | Rohm Co., Ltd. | Method of manufacturing semiconductor devices, and leadframe and differential overlapping apparatus therefor |
| GB8910685D0 (en) * | 1989-05-10 | 1989-06-28 | Moran Peter | Integrated circuit package |
-
1973
- 1973-02-16 JP JP48019670A patent/JPS5144385B2/ja not_active Expired
-
1974
- 1974-02-08 DE DE19742406086 patent/DE2406086A1/de active Pending
- 1974-02-11 GB GB614574A patent/GB1406207A/en not_active Expired
- 1974-02-15 IT IT48410/74A patent/IT1008848B/it active
- 1974-02-15 NL NL7402112A patent/NL7402112A/xx unknown
- 1974-02-15 FR FR7405267A patent/FR2218654A1/fr not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| FR2218654A1 (https=) | 1974-09-13 |
| GB1406207A (en) | 1975-09-17 |
| IT1008848B (it) | 1976-11-30 |
| DE2406086A1 (de) | 1974-09-05 |
| JPS5144385B2 (https=) | 1976-11-27 |
| JPS49107674A (https=) | 1974-10-12 |
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