NL6817115A - - Google Patents

Info

Publication number
NL6817115A
NL6817115A NL6817115A NL6817115A NL6817115A NL 6817115 A NL6817115 A NL 6817115A NL 6817115 A NL6817115 A NL 6817115A NL 6817115 A NL6817115 A NL 6817115A NL 6817115 A NL6817115 A NL 6817115A
Authority
NL
Netherlands
Prior art keywords
strip
transistor
strips
encapsulant
transistors
Prior art date
Application number
NL6817115A
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of NL6817115A publication Critical patent/NL6817115A/xx

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/461—Leadframes specially adapted for cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
    • Y10T29/49171—Assembling electrical component directly to terminal or elongated conductor with encapsulating
    • Y10T29/49172—Assembling electrical component directly to terminal or elongated conductor with encapsulating by molding of insulating material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining
    • Y10T29/49828—Progressively advancing of work assembly station or assembled portion of work
    • Y10T29/49829—Advancing work to successive stations [i.e., assembly line]

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Thyristors (AREA)
NL6817115A 1967-11-29 1968-11-29 NL6817115A (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US68658967A 1967-11-29 1967-11-29

Publications (1)

Publication Number Publication Date
NL6817115A true NL6817115A (enExample) 1969-06-02

Family

ID=24756931

Family Applications (1)

Application Number Title Priority Date Filing Date
NL6817115A NL6817115A (enExample) 1967-11-29 1968-11-29

Country Status (5)

Country Link
US (1) US3581387A (enExample)
DE (1) DE1801073B2 (enExample)
FR (1) FR1592313A (enExample)
GB (1) GB1181336A (enExample)
NL (1) NL6817115A (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1157498B (de) * 1959-09-29 1963-11-14 Stig Martin Lindblad Loesbare Befestigungseinrichtung fuer Kraftfahrzeug-Sicherheitsgurte u. dgl.
US3763403A (en) * 1972-03-01 1973-10-02 Gen Electric Isolated heat-sink semiconductor device
US4012765A (en) * 1975-09-24 1977-03-15 Motorola, Inc. Lead frame for plastic encapsulated semiconductor assemblies
DE2608250C3 (de) * 1976-02-28 1985-06-05 Telefunken electronic GmbH, 7100 Heilbronn Verfahren zum Thermokompressions-Verbinden von auf Halbleiterkörpern befindlichen Metall-Anschlußkontakten mit zugeordneten Gehäuseanschlußteilen und Vorrichtung zur Durchführung des Verfahrens
DE2714145C2 (de) * 1976-03-31 1985-01-10 Mitsubishi Denki K.K., Tokio/Tokyo Gestanzte Metallträgerplatte für die Herstellung von kunststoffummantelten Halbleiterbauelementen
JPS58209147A (ja) * 1982-05-31 1983-12-06 Toshiba Corp 樹脂封止型半導体装置
IT1213139B (it) * 1984-02-17 1989-12-14 Ates Componenti Elettron Componente elettronico integrato di tipo "single-in-line" eprocedimento per la sua fabbricazione.
US6159770A (en) * 1995-11-08 2000-12-12 Fujitsu Limited Method and apparatus for fabricating semiconductor device
US7446383B2 (en) * 2003-09-16 2008-11-04 Koninklijke Philips Electronics N.V. Electronic device mountable onto a substrate using surface mount techniques, and method
US7602054B2 (en) * 2005-10-05 2009-10-13 Semiconductor Components Industries, L.L.C. Method of forming a molded array package device having an exposed tab and structure

Also Published As

Publication number Publication date
DE1801073B2 (de) 1973-04-19
FR1592313A (enExample) 1970-05-11
GB1181336A (en) 1970-02-11
US3581387A (en) 1971-06-01
DE1801073A1 (de) 1970-03-26

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