NL237782A - - Google Patents
Info
- Publication number
- NL237782A NL237782A NL237782DA NL237782A NL 237782 A NL237782 A NL 237782A NL 237782D A NL237782D A NL 237782DA NL 237782 A NL237782 A NL 237782A
- Authority
- NL
- Netherlands
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/02—Making non-ferrous alloys by melting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
- B30B11/00—Presses specially adapted for forming shaped articles from material in particulate or plastic state, e.g. briquetting presses, tabletting presses
- B30B11/34—Presses specially adapted for forming shaped articles from material in particulate or plastic state, e.g. briquetting presses, tabletting presses for coating articles, e.g. tablets
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/02—Alloys based on gold
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
- Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
- Y10T29/4921—Contact or terminal manufacturing by assembling plural parts with bonding
- Y10T29/49211—Contact or terminal manufacturing by assembling plural parts with bonding of fused material
- Y10T29/49213—Metal
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12528—Semiconductor component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12674—Ge- or Si-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12889—Au-base component
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
- Powder Metallurgy (AREA)
- Conductive Materials (AREA)
- Silicon Compounds (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DES0056823 | 1958-02-04 | ||
DES57723A DE1089074B (de) | 1958-02-04 | 1958-04-05 | Verfahren zur Erzeugung eines hochdotierten p-Bereiches und des zugehoerigen Kontaktes einer Halbleiteranordnung mittels Einlegieren |
Publications (1)
Publication Number | Publication Date |
---|---|
NL237782A true NL237782A (hu) | 1900-01-01 |
Family
ID=25995480
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL237782D NL237782A (hu) | 1958-02-04 | ||
NL235479D NL235479A (hu) | 1958-02-04 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL235479D NL235479A (hu) | 1958-02-04 |
Country Status (6)
Country | Link |
---|---|
US (1) | US3009840A (hu) |
CH (2) | CH369519A (hu) |
DE (2) | DE1089074B (hu) |
FR (1) | FR1228852A (hu) |
GB (2) | GB905553A (hu) |
NL (2) | NL235479A (hu) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL113840C (hu) * | 1958-06-14 | |||
BE590762A (hu) * | 1959-05-12 | |||
US3068127A (en) * | 1959-06-02 | 1962-12-11 | Siemens Ag | Method of producing a highly doped p-type zone and an appertaining contact on a semiconductor crystal |
US3211595A (en) * | 1959-11-02 | 1965-10-12 | Hughes Aircraft Co | P-type alloy bonding of semiconductors using a boron-gold alloy |
DE1133834B (de) * | 1960-09-21 | 1962-07-26 | Siemens Ag | Siliziumgleichrichter und Verfahren zu dessen Herstellung |
NL270684A (hu) * | 1960-11-01 | |||
US3177054A (en) * | 1960-12-14 | 1965-04-06 | Nippon Electric Co | Compound foil for connecting electrodes to semiconductor material |
DE1240996B (de) * | 1961-03-24 | 1967-05-24 | Siemens Ag | Verfahren zum Herstellen eines beiderseits hochdotierten pn-UEbergangs fuer Halbleiteranordnungen |
NL274788A (hu) * | 1961-05-17 | |||
US3292130A (en) * | 1961-07-28 | 1966-12-13 | Texas Instruments Inc | Resistor |
US3155064A (en) * | 1961-11-15 | 1964-11-03 | Westinghouse Electric Corp | Fusion mold fixture assembly |
DE1246129B (de) * | 1961-12-28 | 1967-08-03 | Westinghouse Electric Corp | Verfahren zum Herstellen eines Halbleiterbauelementes |
NL300210A (hu) * | 1962-11-14 | |||
US3310443A (en) * | 1963-09-06 | 1967-03-21 | Theodore E Fessler | Method of forming thin window drifted silicon charged particle detector |
DE1278016B (de) * | 1963-11-16 | 1968-09-19 | Siemens Ag | Halbleiterbauelement mit einem einkristallinen Halbleiterkoerper |
DE1231824B (de) * | 1964-07-04 | 1967-01-05 | Danfoss As | Kontaktanordnung fuer ein elektronisches Festkoerperschaltelement und Verfahren zu seiner Herstellung |
US3382054A (en) * | 1965-01-25 | 1968-05-07 | Texas Instruments Inc | Low melting point composite materials useful for brazing, soldering or the like |
CH506188A (de) * | 1970-09-02 | 1971-04-15 | Ibm | Feldeffekt-Transistor |
JPS6481130A (en) * | 1987-09-21 | 1989-03-27 | Omron Tateisi Electronics Co | Electrical contact |
GB8818050D0 (en) * | 1988-07-28 | 1988-09-01 | Lilliwyte Sa | Joining of ceramic components to metal components |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1577995A (en) * | 1925-10-28 | 1926-03-23 | Wadsworth Watch Case Co | White-gold alloy |
US2510546A (en) * | 1944-12-01 | 1950-06-06 | Joseph B Brennan | Manufacture of precision articles from powdered material |
US2791524A (en) * | 1953-04-03 | 1957-05-07 | Gen Electric | Fabrication method for p-n junctions |
BE517459A (hu) * | 1952-02-07 | |||
NL180750B (nl) * | 1952-08-20 | Bristol Myers Co | Werkwijze voor het bereiden van een 7-amino-3-cefem-4-carbonzuur derivaat door een 7-acylamino-3-cefem-4-carbonzuur derivaat om te zetten. | |
US2725288A (en) * | 1952-08-26 | 1955-11-29 | Harry W Dodds | Process and apparatus for fabricating metallic articles |
NL191674A (hu) * | 1953-10-26 | |||
AT187556B (de) * | 1954-03-05 | 1956-11-10 | Western Electric Co | Verfahren zur Herstellung eines Halbleiters mit einer PN-Verbindung |
BE548647A (hu) * | 1955-06-28 | |||
DE1012696B (de) * | 1954-07-06 | 1957-07-25 | Siemens Ag | Halbleiteruebergang zwischen Zonen verschiedenen Leitungstypus und Verfahren zur Herstellung des UEberganges |
BE544843A (hu) * | 1955-02-25 | |||
US2763822A (en) * | 1955-05-10 | 1956-09-18 | Westinghouse Electric Corp | Silicon semiconductor devices |
BE556231A (hu) * | 1956-03-30 |
-
0
- DE DENDAT1067936D patent/DE1067936B/de active Pending
- NL NL237782D patent/NL237782A/xx unknown
- NL NL235479D patent/NL235479A/xx unknown
-
1958
- 1958-04-05 DE DES57723A patent/DE1089074B/de active Pending
-
1959
- 1959-01-27 CH CH6876859A patent/CH369519A/de unknown
- 1959-02-03 FR FR785697A patent/FR1228852A/fr not_active Expired
- 1959-02-03 US US790877A patent/US3009840A/en not_active Expired - Lifetime
- 1959-02-04 GB GB4002/59A patent/GB905553A/en not_active Expired
- 1959-04-02 CH CH7147959A patent/CH375450A/de unknown
- 1959-04-03 GB GB11405/59A patent/GB907303A/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
DE1067936B (hu) | 1959-10-29 |
NL235479A (hu) | 1900-01-01 |
CH375450A (de) | 1964-02-29 |
GB907303A (en) | 1962-10-03 |
FR1228852A (fr) | 1960-09-02 |
US3009840A (en) | 1961-11-21 |
GB905553A (en) | 1962-09-12 |
CH369519A (de) | 1963-05-31 |
DE1089074B (de) | 1960-09-15 |