NL2000930C2 - Werkwijze en inrichting voor het omhullen van elektronische componenten met vloeibaar geportioneerd omhulmateriaal. - Google Patents

Werkwijze en inrichting voor het omhullen van elektronische componenten met vloeibaar geportioneerd omhulmateriaal. Download PDF

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Publication number
NL2000930C2
NL2000930C2 NL2000930A NL2000930A NL2000930C2 NL 2000930 C2 NL2000930 C2 NL 2000930C2 NL 2000930 A NL2000930 A NL 2000930A NL 2000930 A NL2000930 A NL 2000930A NL 2000930 C2 NL2000930 C2 NL 2000930C2
Authority
NL
Netherlands
Prior art keywords
encapsulating material
portioned
encapsulating
mold
liquefied
Prior art date
Application number
NL2000930A
Other languages
English (en)
Dutch (nl)
Inventor
Albertus Franciscus Gerardus Van Driel
Joannes Leonardus Jurrian Zijl
Original Assignee
Fico Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fico Bv filed Critical Fico Bv
Priority to NL2000930A priority Critical patent/NL2000930C2/nl
Priority to PCT/NL2008/050643 priority patent/WO2009048330A1/fr
Application granted granted Critical
Publication of NL2000930C2 publication Critical patent/NL2000930C2/nl

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
    • B29C70/78—Moulding material on one side only of the preformed part
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
    • B29B9/00—Making granules
    • B29B9/10—Making granules by moulding the material, i.e. treating it in the molten state
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/18—Feeding the material into the injection moulding apparatus, i.e. feeding the non-plastified material into the injection unit
    • B29C45/1808—Feeding measured doses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
NL2000930A 2007-10-12 2007-10-12 Werkwijze en inrichting voor het omhullen van elektronische componenten met vloeibaar geportioneerd omhulmateriaal. NL2000930C2 (nl)

Priority Applications (2)

Application Number Priority Date Filing Date Title
NL2000930A NL2000930C2 (nl) 2007-10-12 2007-10-12 Werkwijze en inrichting voor het omhullen van elektronische componenten met vloeibaar geportioneerd omhulmateriaal.
PCT/NL2008/050643 WO2009048330A1 (fr) 2007-10-12 2008-10-09 Procédé et dispositif d'encapsulation de composants électroniques avec un matériau d'encapsulation liquide en portions

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL2000930A NL2000930C2 (nl) 2007-10-12 2007-10-12 Werkwijze en inrichting voor het omhullen van elektronische componenten met vloeibaar geportioneerd omhulmateriaal.
NL2000930 2007-10-12

Publications (1)

Publication Number Publication Date
NL2000930C2 true NL2000930C2 (nl) 2009-04-15

Family

ID=39535478

Family Applications (1)

Application Number Title Priority Date Filing Date
NL2000930A NL2000930C2 (nl) 2007-10-12 2007-10-12 Werkwijze en inrichting voor het omhullen van elektronische componenten met vloeibaar geportioneerd omhulmateriaal.

Country Status (2)

Country Link
NL (1) NL2000930C2 (fr)
WO (1) WO2009048330A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2928670B1 (fr) * 2012-12-06 2016-05-25 Materialise N.V. Systèmes et procédés de commande d'un différentiel de température dans la fabrication d'objets
CN103395165B (zh) * 2013-08-18 2016-04-06 苏忠杰 矽钢片包塑全自动装料设备
CN107244036B (zh) * 2017-06-27 2023-03-28 昆山鑫泰利智能科技股份有限公司 一种多片金属件同时埋入成型治具

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2227707A (en) * 1988-12-24 1990-08-08 T & K Int Kenkyusho Kk High density resin tablet and its use in seal moulding
WO2000047391A1 (fr) * 1999-02-10 2000-08-17 Cookson Semiconductor Packaging Materials Procede et appareil de production de preformes a semiconducteur

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2227707A (en) * 1988-12-24 1990-08-08 T & K Int Kenkyusho Kk High density resin tablet and its use in seal moulding
WO2000047391A1 (fr) * 1999-02-10 2000-08-17 Cookson Semiconductor Packaging Materials Procede et appareil de production de preformes a semiconducteur

Also Published As

Publication number Publication date
WO2009048330A1 (fr) 2009-04-16

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Legal Events

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PD2B A search report has been drawn up
V1 Lapsed because of non-payment of the annual fee

Effective date: 20110501