NL189631B - Werkwijze voor het langs lithografische weg vervaardigen van inrichtingen. - Google Patents

Werkwijze voor het langs lithografische weg vervaardigen van inrichtingen.

Info

Publication number
NL189631B
NL189631B NLAANVRAGE8401430,A NL8401430A NL189631B NL 189631 B NL189631 B NL 189631B NL 8401430 A NL8401430 A NL 8401430A NL 189631 B NL189631 B NL 189631B
Authority
NL
Netherlands
Prior art keywords
lithographic
road
producing devices
producing
devices
Prior art date
Application number
NLAANVRAGE8401430,A
Other languages
English (en)
Other versions
NL8401430A (nl
NL189631C (nl
Original Assignee
American Telephone & Telegraph
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by American Telephone & Telegraph filed Critical American Telephone & Telegraph
Publication of NL8401430A publication Critical patent/NL8401430A/nl
Publication of NL189631B publication Critical patent/NL189631B/nl
Application granted granted Critical
Publication of NL189631C publication Critical patent/NL189631C/nl

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/62Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light
    • G01N21/63Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light optically excited
    • G01N21/64Fluorescence; Phosphorescence
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/30Imagewise removal using liquid means
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/25Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands
    • G01N21/31Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry
    • G01N21/314Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry with comparison of measurements at specific and non-specific wavelengths
    • G01N2021/3166Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry with comparison of measurements at specific and non-specific wavelengths using separate detectors and filters
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00Features of devices classified in G01N21/00
    • G01N2201/12Circuits of general importance; Signal processing
    • G01N2201/122Kinetic analysis; determining reaction rate
    • G01N2201/1222Endpoint determination; reaction time determination

Landscapes

  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Pathology (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Immunology (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Semiconductors (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Investigating, Analyzing Materials By Fluorescence Or Luminescence (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
NLAANVRAGE8401430,A 1983-05-06 1984-05-04 Werkwijze voor het langs lithografische weg vervaardigen van inrichtingen. NL189631C (nl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/492,433 US4482424A (en) 1983-05-06 1983-05-06 Method for monitoring etching of resists by monitoring the flouresence of the unetched material
US49243383 1983-05-06

Publications (3)

Publication Number Publication Date
NL8401430A NL8401430A (nl) 1984-12-03
NL189631B true NL189631B (nl) 1993-01-04
NL189631C NL189631C (nl) 1993-06-01

Family

ID=23956233

Family Applications (1)

Application Number Title Priority Date Filing Date
NLAANVRAGE8401430,A NL189631C (nl) 1983-05-06 1984-05-04 Werkwijze voor het langs lithografische weg vervaardigen van inrichtingen.

Country Status (9)

Country Link
US (1) US4482424A (nl)
JP (1) JPS59208724A (nl)
KR (1) KR930000900B1 (nl)
CA (1) CA1209723A (nl)
DE (1) DE3416819A1 (nl)
FR (1) FR2545622B1 (nl)
GB (1) GB2139151B (nl)
HK (1) HK53287A (nl)
NL (1) NL189631C (nl)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4680084A (en) * 1984-08-21 1987-07-14 American Telephone And Telegraph Company, At&T Bell Laboratories Interferometric methods and apparatus for device fabrication
US4599134A (en) * 1985-06-10 1986-07-08 Ibm Corporation Plasma etching with tracer
DE4016211A1 (de) * 1990-05-19 1991-11-21 Convac Gmbh Verfahren zur ueberwachung und steuerung eines aetzvorgangs und vorrichtung hierfuer
US5227001A (en) * 1990-10-19 1993-07-13 Integrated Process Equipment Corporation Integrated dry-wet semiconductor layer removal apparatus and method
DE4106313A1 (de) * 1991-02-28 1992-09-03 Heidelberger Druckmasch Ag Verfahren und vorrichtung zur ermittlung der menge beziehungsweise der schichtdicke eines fluids
JP3010395B2 (ja) * 1991-09-04 2000-02-21 日本シイエムケイ株式会社 プリント配線板の製造方法
US5254502A (en) * 1992-03-27 1993-10-19 Principia Optics, Inc. Method for making a laser screen for a cathode-ray tube
US5264328A (en) * 1992-04-24 1993-11-23 International Business Machines Corporation Resist development endpoint detection for X-ray lithography
TW260857B (nl) * 1993-03-04 1995-10-21 Tokyo Electron Co Ltd
US7102737B2 (en) * 1997-11-04 2006-09-05 Micron Technology, Inc. Method and apparatus for automated, in situ material detection using filtered fluoresced, reflected, or absorbed light
US5969805A (en) 1997-11-04 1999-10-19 Micron Technology, Inc. Method and apparatus employing external light source for endpoint detection
US6704107B1 (en) 1997-11-04 2004-03-09 Micron Technology, Inc. Method and apparatus for automated, in situ material detection using filtered fluoresced, reflected, or absorbed light
US6174407B1 (en) 1998-12-03 2001-01-16 Lsi Logic Corporation Apparatus and method for detecting an endpoint of an etching process by transmitting infrared light signals through a semiconductor wafer
US6335531B1 (en) * 1999-04-06 2002-01-01 Micron Technology, Inc. Modification of resist and/or resist processing with fluorescence detection
US6136719A (en) * 1999-04-30 2000-10-24 Lsi Logic Corporation Method and arrangement for fabricating a semiconductor device
US6218203B1 (en) * 1999-06-28 2001-04-17 Advantest Corp. Method of producing a contact structure
US6809809B2 (en) * 2000-11-15 2004-10-26 Real Time Metrology, Inc. Optical method and apparatus for inspecting large area planar objects
US6630996B2 (en) 2000-11-15 2003-10-07 Real Time Metrology, Inc. Optical method and apparatus for inspecting large area planar objects
US6849859B2 (en) * 2001-03-21 2005-02-01 Euv Limited Liability Corporation Fabrication of precision optics using an imbedded reference surface
US20060154180A1 (en) * 2005-01-07 2006-07-13 Kannurpatti Anandkumar R Imaging element for use as a recording element and process of using the imaging element
US7846639B2 (en) * 2006-06-30 2010-12-07 E. I. Du Pont De Nemours And Company Imaging element having a photoluminescent tag and process of using the imaging element to form a recording element
JP5499504B2 (ja) * 2009-03-24 2014-05-21 凸版印刷株式会社 薄膜検査方法及び薄膜検査装置
JPWO2011027882A1 (ja) * 2009-09-07 2013-02-04 東洋合成工業株式会社 パターン形成用光硬化性組成物及びこれを用いた膜厚測定方法
CN111578908A (zh) 2019-02-15 2020-08-25 维蒂克影像国际无限责任公司 检测材料贴花的正确朝向的方法
TWI790591B (zh) * 2021-04-12 2023-01-21 環球晶圓股份有限公司 晶圓加工系統及其重工方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS513173A (ja) * 1974-06-25 1976-01-12 Matsushita Electric Ind Co Ltd Hakumakupataanseizosochi
CA1071579A (en) * 1976-09-13 1980-02-12 Northern Telecom Limited End point control in plasma etching
JPS5345180A (en) * 1976-10-06 1978-04-22 Hitachi Ltd Photoetching method
DE2728361C2 (de) * 1977-06-23 1981-09-24 Ibm Deutschland Gmbh, 7000 Stuttgart Verfahren zum Feststellen eines vorgebbaren Endzustands eines Entwicklungs- oder Ätzvorgangs
JPS6019138B2 (ja) * 1977-09-22 1985-05-14 株式会社日立製作所 フオトエツチングにおける現像状態検査方法
US4244799A (en) * 1978-09-11 1981-01-13 Bell Telephone Laboratories, Incorporated Fabrication of integrated circuits utilizing thick high-resolution patterns
US4246060A (en) * 1979-01-02 1981-01-20 Motorola, Inc. Plasma development process controller
JPS5613730A (en) * 1979-07-13 1981-02-10 Fujitsu Ltd Etching method
JPS56108234A (en) * 1980-01-31 1981-08-27 Fujitsu Ltd Etching treatment method
US4377436A (en) * 1980-05-13 1983-03-22 Bell Telephone Laboratories, Incorporated Plasma-assisted etch process with endpoint detection
JPS5726438A (en) * 1980-07-23 1982-02-12 Hitachi Ltd Etching measuring apparatus
JPS5747874A (en) * 1980-09-02 1982-03-18 Fujitsu Ltd Detection of end point of dry etching reaction
JPS5772147A (en) * 1980-10-22 1982-05-06 Mitsubishi Electric Corp Method and device for development
JPS57138634A (en) * 1981-02-20 1982-08-27 Hitachi Ltd X-ray sensitive resin and formation of ultrathin line pattern using this resin
US4415402A (en) * 1981-04-02 1983-11-15 The Perkin-Elmer Corporation End-point detection in plasma etching or phosphosilicate glass
US4394237A (en) * 1981-07-17 1983-07-19 Bell Telephone Laboratories, Incorporated Spectroscopic monitoring of gas-solid processes

Also Published As

Publication number Publication date
JPS59208724A (ja) 1984-11-27
HK53287A (en) 1987-07-24
KR930000900B1 (ko) 1993-02-11
US4482424A (en) 1984-11-13
NL8401430A (nl) 1984-12-03
GB2139151A (en) 1984-11-07
KR840009174A (ko) 1984-12-24
GB8411122D0 (en) 1984-06-06
FR2545622B1 (fr) 1987-04-17
CA1209723A (en) 1986-08-12
DE3416819C2 (nl) 1991-02-14
NL189631C (nl) 1993-06-01
GB2139151B (en) 1986-07-30
DE3416819A1 (de) 1984-11-08
FR2545622A1 (fr) 1984-11-09

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Legal Events

Date Code Title Description
A85 Still pending on 85-01-01
BA A request for search or an international-type search has been filed
BB A search report has been drawn up
BC A request for examination has been filed
V1 Lapsed because of non-payment of the annual fee

Effective date: 20001201