NL1036349A1 - Scanning EUV interference imaging for extremely high resolution patterning. - Google Patents
Scanning EUV interference imaging for extremely high resolution patterning. Download PDFInfo
- Publication number
- NL1036349A1 NL1036349A1 NL1036349A NL1036349A NL1036349A1 NL 1036349 A1 NL1036349 A1 NL 1036349A1 NL 1036349 A NL1036349 A NL 1036349A NL 1036349 A NL1036349 A NL 1036349A NL 1036349 A1 NL1036349 A1 NL 1036349A1
- Authority
- NL
- Netherlands
- Prior art keywords
- high resolution
- extremely high
- interference imaging
- resolution patterning
- scanning
- Prior art date
Links
- 238000003384 imaging method Methods 0.000 title 1
- 238000000059 patterning Methods 0.000 title 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70258—Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system
- G03F7/70266—Adaptive optics, e.g. deformable optical elements for wavefront control, e.g. for aberration adjustment or correction
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70408—Interferometric lithography; Holographic lithography; Self-imaging lithography, e.g. utilizing the Talbot effect
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/2004—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light
- G03F7/2006—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light using coherent light; using polarised light
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US618507P | 2007-12-28 | 2007-12-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
NL1036349A1 true NL1036349A1 (nl) | 2009-06-30 |
Family
ID=40549356
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL1036349A NL1036349A1 (nl) | 2007-12-28 | 2008-12-22 | Scanning EUV interference imaging for extremely high resolution patterning. |
Country Status (7)
Country | Link |
---|---|
US (1) | US8623588B2 (nl) |
JP (1) | JP5351900B2 (nl) |
KR (1) | KR101541395B1 (nl) |
CN (1) | CN101910951B (nl) |
NL (1) | NL1036349A1 (nl) |
TW (1) | TWI436169B (nl) |
WO (1) | WO2009083229A1 (nl) |
Families Citing this family (25)
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EP2545406B1 (en) * | 2010-03-09 | 2015-02-11 | SI-Ware Systems | A technique to determine mirror position in optical interferometers |
CN102141736A (zh) * | 2011-01-05 | 2011-08-03 | 中国科学院半导体研究所 | 紫外激光干涉条纹的辅助检测装置及方法 |
JP2013145863A (ja) * | 2011-11-29 | 2013-07-25 | Gigaphoton Inc | 2光束干渉装置および2光束干渉露光システム |
US9476764B2 (en) | 2013-09-10 | 2016-10-25 | Taiwan Semiconductor Manufacturing Co., Ltd. | Wavefront adjustment in extreme ultra-violet (EUV) lithography |
US9405204B2 (en) | 2013-09-18 | 2016-08-02 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method of overlay in extreme ultra-violet (EUV) lithography |
US9034665B2 (en) * | 2013-10-11 | 2015-05-19 | Taiwan Semiconductor Manufacturing Co., Ltd. | Tool configuration and method for extreme ultra-violet (EUV) patterning with a deformable reflective surface |
JP6221849B2 (ja) * | 2014-03-07 | 2017-11-01 | ウシオ電機株式会社 | 露光方法、微細周期構造体の製造方法、グリッド偏光素子の製造方法及び露光装置 |
WO2016018004A1 (en) * | 2014-07-31 | 2016-02-04 | Samsung Electronics Co., Ltd. | Method, apparatus, and system for providing translated content |
JP6609917B2 (ja) * | 2014-12-02 | 2019-11-27 | ウシオ電機株式会社 | 蛍光光源用発光素子の製造方法 |
JP2016111058A (ja) * | 2014-12-02 | 2016-06-20 | ウシオ電機株式会社 | 半導体発光素子の製造方法及び半導体発光素子 |
US10101652B2 (en) * | 2015-09-24 | 2018-10-16 | Ushio Denki Kabushiki Kaisha | Exposure method, method of fabricating periodic microstructure, method of fabricating grid polarizing element and exposure apparatus |
TWI561939B (en) * | 2015-11-03 | 2016-12-11 | Univ Nat Sun Yat Sen | Interference lithography device |
JP2019514078A (ja) * | 2016-03-10 | 2019-05-30 | ヴィズビット インコーポレイテッド | 時間多重化プログラム可能な視野撮像 |
WO2017153085A1 (en) | 2016-03-10 | 2017-09-14 | Asml Netherlands B.V. | Measurement system, lithographic apparatus and device manufacturing method |
US11067900B2 (en) | 2016-05-19 | 2021-07-20 | Nikon Corporation | Dense line extreme ultraviolet lithography system with distortion matching |
US10712671B2 (en) | 2016-05-19 | 2020-07-14 | Nikon Corporation | Dense line extreme ultraviolet lithography system with distortion matching |
US10295911B2 (en) | 2016-05-19 | 2019-05-21 | Nikon Corporation | Extreme ultraviolet lithography system that utilizes pattern stitching |
US11099483B2 (en) * | 2016-05-19 | 2021-08-24 | Nikon Corporation | Euv lithography system for dense line patterning |
JP2019518246A (ja) * | 2016-06-20 | 2019-06-27 | 株式会社ニコン | 歪み整合のための密集ライン極紫外線リソグラフィシステム |
US10481408B2 (en) * | 2016-09-30 | 2019-11-19 | Christie Digital Systems (Usa), Inc. | Apparatus for reducing coherence of a laser beam |
US10527956B2 (en) | 2017-03-24 | 2020-01-07 | Nikon Corporation | Temperature controlled heat transfer frame for pellicle |
KR102140675B1 (ko) * | 2018-05-08 | 2020-08-05 | 한국생산기술연구원 | 광간섭을 이용한 준결정 표면 격자 패턴 형성방법 및 이로 형성된 준결정 표면 격자 패턴 |
KR20210068890A (ko) | 2019-12-02 | 2021-06-10 | 삼성전자주식회사 | Cdi 기반 검사 장치 및 방법 |
CN111354500B (zh) * | 2020-03-16 | 2022-03-22 | 中国科学院高能物理研究所 | 一种同步辐射x射线双反射镜 |
CA3183829A1 (en) * | 2021-03-19 | 2022-09-22 | Hongji Ren | Performing structured illumination microscopy on a patterned substrate |
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US4596467A (en) * | 1984-03-16 | 1986-06-24 | Hughes Aircraft Company | Dissimilar superimposed grating precision alignment and gap measurement systems |
JP3115389B2 (ja) | 1991-12-25 | 2000-12-04 | 沖電気工業株式会社 | 位相差露光法 |
JPH06204124A (ja) * | 1993-01-06 | 1994-07-22 | Nippon Telegr & Teleph Corp <Ntt> | 軟x線像露光法 |
JPH06300909A (ja) * | 1993-04-13 | 1994-10-28 | Canon Inc | ホログラフィック干渉露光法を用いた回折格子作成方法及びこれを用いた光半導体装置 |
JPH11354014A (ja) * | 1998-06-08 | 1999-12-24 | Ricoh Co Ltd | 電界放射型電子源の作製方法 |
JP2000223400A (ja) | 1999-02-01 | 2000-08-11 | Canon Inc | パターン形成方法及びそれを用いた露光装置 |
US6882477B1 (en) * | 1999-11-10 | 2005-04-19 | Massachusetts Institute Of Technology | Method and system for interference lithography utilizing phase-locked scanning beams |
JP4514317B2 (ja) * | 2000-11-27 | 2010-07-28 | 株式会社ミツトヨ | 露光装置 |
JP2004014866A (ja) * | 2002-06-07 | 2004-01-15 | Nikon Corp | 多光子干渉露光装置 |
US6766671B2 (en) * | 2002-07-19 | 2004-07-27 | Master Lock Company | Shackleless lock |
JP2004343082A (ja) * | 2003-04-17 | 2004-12-02 | Asml Netherlands Bv | 凹面および凸面を含む集光器を備えたリトグラフ投影装置 |
US20050073671A1 (en) * | 2003-10-07 | 2005-04-07 | Intel Corporation | Composite optical lithography method for patterning lines of substantially equal width |
CN100480863C (zh) * | 2004-08-25 | 2009-04-22 | 精工爱普生株式会社 | 微细结构体的制造方法、曝光装置、电子仪器 |
US7492442B2 (en) * | 2004-08-27 | 2009-02-17 | Asml Holding N.V. | Adjustable resolution interferometric lithography system |
US7184124B2 (en) * | 2004-10-28 | 2007-02-27 | Asml Holding N.V. | Lithographic apparatus having an adjustable projection system and device manufacturing method |
US20060109532A1 (en) * | 2004-11-19 | 2006-05-25 | Savas Timothy A | System and method for forming well-defined periodic patterns using achromatic interference lithography |
US7751030B2 (en) * | 2005-02-01 | 2010-07-06 | Asml Holding N.V. | Interferometric lithographic projection apparatus |
US20070153249A1 (en) * | 2005-12-20 | 2007-07-05 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method using multiple exposures and multiple exposure types |
US7440078B2 (en) * | 2005-12-20 | 2008-10-21 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method using interferometric and maskless exposure units |
US7561252B2 (en) * | 2005-12-29 | 2009-07-14 | Asml Holding N.V. | Interferometric lithography system and method used to generate equal path lengths of interfering beams |
US8264667B2 (en) * | 2006-05-04 | 2012-09-11 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method using interferometric and other exposure |
US8934084B2 (en) * | 2006-05-31 | 2015-01-13 | Asml Holding N.V. | System and method for printing interference patterns having a pitch in a lithography system |
US7768627B2 (en) * | 2007-06-14 | 2010-08-03 | Asml Netherlands B.V. | Illumination of a patterning device based on interference for use in a maskless lithography system |
-
2008
- 2008-12-22 NL NL1036349A patent/NL1036349A1/nl active Search and Examination
- 2008-12-23 CN CN200880123284.6A patent/CN101910951B/zh not_active Expired - Fee Related
- 2008-12-23 WO PCT/EP2008/011057 patent/WO2009083229A1/en active Application Filing
- 2008-12-23 US US12/810,994 patent/US8623588B2/en not_active Expired - Fee Related
- 2008-12-23 KR KR1020107016870A patent/KR101541395B1/ko active IP Right Grant
- 2008-12-23 JP JP2010540069A patent/JP5351900B2/ja not_active Expired - Fee Related
- 2008-12-26 TW TW097151090A patent/TWI436169B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
WO2009083229A1 (en) | 2009-07-09 |
TWI436169B (zh) | 2014-05-01 |
US20100284015A1 (en) | 2010-11-11 |
KR20100112599A (ko) | 2010-10-19 |
JP5351900B2 (ja) | 2013-11-27 |
TW200935191A (en) | 2009-08-16 |
US8623588B2 (en) | 2014-01-07 |
KR101541395B1 (ko) | 2015-08-03 |
CN101910951A (zh) | 2010-12-08 |
JP2011508443A (ja) | 2011-03-10 |
CN101910951B (zh) | 2013-09-18 |
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