NL1019514C2 - Werkwijze en inrichting voor het onder uitoefening van fluïdumdruk omhullen van elektronische componenten. - Google Patents
Werkwijze en inrichting voor het onder uitoefening van fluïdumdruk omhullen van elektronische componenten. Download PDFInfo
- Publication number
- NL1019514C2 NL1019514C2 NL1019514A NL1019514A NL1019514C2 NL 1019514 C2 NL1019514 C2 NL 1019514C2 NL 1019514 A NL1019514 A NL 1019514A NL 1019514 A NL1019514 A NL 1019514A NL 1019514 C2 NL1019514 C2 NL 1019514C2
- Authority
- NL
- Netherlands
- Prior art keywords
- mold cavity
- fluid
- mold
- encapsulating material
- carrier
- Prior art date
Links
- 239000012530 fluid Substances 0.000 title claims description 63
- 238000000034 method Methods 0.000 title claims description 31
- 239000000463 material Substances 0.000 claims description 49
- 239000007789 gas Substances 0.000 claims description 28
- 239000007788 liquid Substances 0.000 claims description 19
- 239000004065 semiconductor Substances 0.000 claims description 9
- 238000012546 transfer Methods 0.000 claims description 9
- 230000007246 mechanism Effects 0.000 claims description 7
- 239000011888 foil Substances 0.000 claims description 4
- 239000011261 inert gas Substances 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 2
- 230000008901 benefit Effects 0.000 description 7
- 239000000969 carrier Substances 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 238000005538 encapsulation Methods 0.000 description 4
- 238000013022 venting Methods 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000012876 carrier material Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/1703—Introducing an auxiliary fluid into the mould
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/4824—Connecting between the body and an opposite side of the item with respect to the body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73215—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL1019514A NL1019514C2 (nl) | 2001-12-07 | 2001-12-07 | Werkwijze en inrichting voor het onder uitoefening van fluïdumdruk omhullen van elektronische componenten. |
PCT/NL2002/000797 WO2003049177A2 (en) | 2001-12-07 | 2002-12-05 | Method and device for encapsulating electronic components while exerting fluid pressure |
AU2002347678A AU2002347678A1 (en) | 2001-12-07 | 2002-12-05 | Method and device for encapsulating electronic components while exerting fluid pressure |
US10/497,721 US20050062199A1 (en) | 2001-12-07 | 2002-12-05 | Method and device for encapsulating electronic components while exerting fluid pressure |
EP02783856A EP1456878A2 (en) | 2001-12-07 | 2002-12-05 | Method and device for encapsulating electronic components while exerting fluid pressure |
KR10-2004-7008741A KR20040064729A (ko) | 2001-12-07 | 2002-12-05 | 유체 압력을 가하는 동안 전기 성분을 캡슐화하기 위한방법 및 장치 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL1019514 | 2001-12-07 | ||
NL1019514A NL1019514C2 (nl) | 2001-12-07 | 2001-12-07 | Werkwijze en inrichting voor het onder uitoefening van fluïdumdruk omhullen van elektronische componenten. |
Publications (1)
Publication Number | Publication Date |
---|---|
NL1019514C2 true NL1019514C2 (nl) | 2003-06-11 |
Family
ID=19774372
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL1019514A NL1019514C2 (nl) | 2001-12-07 | 2001-12-07 | Werkwijze en inrichting voor het onder uitoefening van fluïdumdruk omhullen van elektronische componenten. |
Country Status (6)
Country | Link |
---|---|
US (1) | US20050062199A1 (ko) |
EP (1) | EP1456878A2 (ko) |
KR (1) | KR20040064729A (ko) |
AU (1) | AU2002347678A1 (ko) |
NL (1) | NL1019514C2 (ko) |
WO (1) | WO2003049177A2 (ko) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6297812A (ja) * | 1985-10-23 | 1987-05-07 | Mitsubishi Electric Corp | 樹脂成形方法 |
JPS63202417A (ja) * | 1987-02-18 | 1988-08-22 | Sakae Riken Kogyo Kk | 同時成形によるプラスチツク製品の加飾体の製法 |
JPS6472816A (en) * | 1987-09-16 | 1989-03-17 | Hitachi Ltd | Molding device |
JPH10146859A (ja) * | 1996-11-19 | 1998-06-02 | Dowa Mining Co Ltd | 樹脂成形品並びに樹脂成形方法及び装置 |
JPH11297731A (ja) * | 1998-04-15 | 1999-10-29 | Hitachi Ltd | モールド方法およびモールド装置ならびに半導体装置の製造方法 |
EP0971401A2 (en) * | 1998-07-10 | 2000-01-12 | Apic Yamada Corporation | Method of manufacturing semiconductor devices and a resin molding machine therefor |
-
2001
- 2001-12-07 NL NL1019514A patent/NL1019514C2/nl not_active IP Right Cessation
-
2002
- 2002-12-05 WO PCT/NL2002/000797 patent/WO2003049177A2/en not_active Application Discontinuation
- 2002-12-05 US US10/497,721 patent/US20050062199A1/en not_active Abandoned
- 2002-12-05 AU AU2002347678A patent/AU2002347678A1/en not_active Abandoned
- 2002-12-05 KR KR10-2004-7008741A patent/KR20040064729A/ko not_active Application Discontinuation
- 2002-12-05 EP EP02783856A patent/EP1456878A2/en not_active Withdrawn
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6297812A (ja) * | 1985-10-23 | 1987-05-07 | Mitsubishi Electric Corp | 樹脂成形方法 |
JPS63202417A (ja) * | 1987-02-18 | 1988-08-22 | Sakae Riken Kogyo Kk | 同時成形によるプラスチツク製品の加飾体の製法 |
JPS6472816A (en) * | 1987-09-16 | 1989-03-17 | Hitachi Ltd | Molding device |
JPH10146859A (ja) * | 1996-11-19 | 1998-06-02 | Dowa Mining Co Ltd | 樹脂成形品並びに樹脂成形方法及び装置 |
JPH11297731A (ja) * | 1998-04-15 | 1999-10-29 | Hitachi Ltd | モールド方法およびモールド装置ならびに半導体装置の製造方法 |
EP0971401A2 (en) * | 1998-07-10 | 2000-01-12 | Apic Yamada Corporation | Method of manufacturing semiconductor devices and a resin molding machine therefor |
Non-Patent Citations (5)
Title |
---|
DATABASE WPI Section Ch Week 199832, Derwent World Patents Index; Class A32, AN 1998-370455, XP002210554 * |
DATABASE WPI Section Ch Week 200005, Derwent World Patents Index; Class A32, AN 2000-056681, XP002210553 * |
PATENT ABSTRACTS OF JAPAN vol. 011, no. 310 (M - 630) 9 October 1987 (1987-10-09) * |
PATENT ABSTRACTS OF JAPAN vol. 012, no. 484 (M - 776) 16 December 1988 (1988-12-16) * |
PATENT ABSTRACTS OF JAPAN vol. 013, no. 274 (M - 841) 23 June 1989 (1989-06-23) * |
Also Published As
Publication number | Publication date |
---|---|
US20050062199A1 (en) | 2005-03-24 |
AU2002347678A1 (en) | 2003-06-17 |
EP1456878A2 (en) | 2004-09-15 |
KR20040064729A (ko) | 2004-07-19 |
WO2003049177A2 (en) | 2003-06-12 |
WO2003049177A3 (en) | 2003-10-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN111403303B (zh) | 树脂封装装置以及树脂封装方法 | |
JP4519398B2 (ja) | 樹脂封止方法及び半導体装置の製造方法 | |
JP4326786B2 (ja) | 樹脂封止装置 | |
US20060186576A1 (en) | Resin sealing method for electronic part and mold used for the method | |
KR20160021240A (ko) | 수지 몰드 금형 및 수지 몰드 장치 | |
US5326243A (en) | Compression-cavity mold for plastic encapsulation of thin-package integrated circuit device | |
US8338922B1 (en) | Molded leadframe substrate semiconductor package | |
US6630374B2 (en) | Resin sealing method and resin sealing apparatus | |
US8587098B2 (en) | Integrated circuit protruding pad package system and method for manufacturing thereof | |
CN108028235B (zh) | 树脂封装装置以及树脂封装方法 | |
US6438826B2 (en) | Electronic component, method of sealing electronic component with resin, and apparatus therefor | |
TW200308066A (en) | Fabrication method of semiconductor integrated circuit device | |
EP1126516A2 (en) | Electronic component, method of sealing electronic component with resin, and apparatus therefor | |
NL1019514C2 (nl) | Werkwijze en inrichting voor het onder uitoefening van fluïdumdruk omhullen van elektronische componenten. | |
KR960019622A (ko) | 모울드방법 및 장치 | |
JP2004146556A (ja) | 樹脂封止方法、樹脂封止装置、及び樹脂シート | |
JP7029342B2 (ja) | モールド金型、樹脂モールド装置及び樹脂モールド方法 | |
JP3139981B2 (ja) | チップサイズパッケージの樹脂封止方法及び樹脂封止装置 | |
JP2008137334A (ja) | 樹脂封止装置 | |
US20080277829A1 (en) | Compression molding of an electronic device | |
JP2005225067A (ja) | 樹脂モールド方法および樹脂モールド装置 | |
KR100622173B1 (ko) | 주형, 캡슐에 넣기 위한 장치 및 캡슐에 넣는 방법 | |
NL1012488C2 (nl) | Inrichting en werkwijze voor het omhullen van op een drager bevestigde elektronische componenten. | |
JP2001168121A (ja) | 電子部品の樹脂封止成形方法 | |
JP5027451B2 (ja) | 半導体チップの樹脂封止成形方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PD2B | A search report has been drawn up | ||
VD1 | Lapsed due to non-payment of the annual fee |
Effective date: 20070701 |