WO2003049177A3 - Method and device for encapsulating electronic components while exerting fluid pressure - Google Patents

Method and device for encapsulating electronic components while exerting fluid pressure Download PDF

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Publication number
WO2003049177A3
WO2003049177A3 PCT/NL2002/000797 NL0200797W WO03049177A3 WO 2003049177 A3 WO2003049177 A3 WO 2003049177A3 NL 0200797 W NL0200797 W NL 0200797W WO 03049177 A3 WO03049177 A3 WO 03049177A3
Authority
WO
WIPO (PCT)
Prior art keywords
electronic components
encapsulating
fluid pressure
encapsulating electronic
mould cavity
Prior art date
Application number
PCT/NL2002/000797
Other languages
French (fr)
Other versions
WO2003049177A2 (en
Inventor
Hendrikus Johannes Bern Peters
Wilhelmus Gerardus Jozef Gal
Johannes Lambertus Ge Venrooij
Original Assignee
Fico Bv
Hendrikus Johannes Bern Peters
Wilhelmus Gerardus Jozef Gal
Johannes Lambertus Ge Venrooij
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fico Bv, Hendrikus Johannes Bern Peters, Wilhelmus Gerardus Jozef Gal, Johannes Lambertus Ge Venrooij filed Critical Fico Bv
Priority to AU2002347678A priority Critical patent/AU2002347678A1/en
Priority to KR10-2004-7008741A priority patent/KR20040064729A/en
Priority to US10/497,721 priority patent/US20050062199A1/en
Priority to EP02783856A priority patent/EP1456878A2/en
Publication of WO2003049177A2 publication Critical patent/WO2003049177A2/en
Publication of WO2003049177A3 publication Critical patent/WO2003049177A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/1703—Introducing an auxiliary fluid into the mould
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/4824—Connecting between the body and an opposite side of the item with respect to the body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73215—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Abstract

The invention relates to a method for encapsulating electronic components, in particular semiconductors, by receiving a component for encapsulating between two mould halves displaceable relative to each other and feeding a liquid encapsulating material under overpressure by means of a transfer mechanism to at least one mould cavity arranged for this purpose, characterized in that during feeding of liquid encapsulating material to the mould cavity the part of the mould cavity not yet filled with encapsulating material is filled with a gas under overpressure. The invention also relates to a device for encapsulating electronic components.
PCT/NL2002/000797 2001-12-07 2002-12-05 Method and device for encapsulating electronic components while exerting fluid pressure WO2003049177A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
AU2002347678A AU2002347678A1 (en) 2001-12-07 2002-12-05 Method and device for encapsulating electronic components while exerting fluid pressure
KR10-2004-7008741A KR20040064729A (en) 2001-12-07 2002-12-05 Method and device for encapsulating electronics components while exerting fluid pressure
US10/497,721 US20050062199A1 (en) 2001-12-07 2002-12-05 Method and device for encapsulating electronic components while exerting fluid pressure
EP02783856A EP1456878A2 (en) 2001-12-07 2002-12-05 Method and device for encapsulating electronic components while exerting fluid pressure

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL1019514A NL1019514C2 (en) 2001-12-07 2001-12-07 Method and device for encapsulating electronic components under the application of fluid pressure.
NL1019514 2001-12-07

Publications (2)

Publication Number Publication Date
WO2003049177A2 WO2003049177A2 (en) 2003-06-12
WO2003049177A3 true WO2003049177A3 (en) 2003-10-16

Family

ID=19774372

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/NL2002/000797 WO2003049177A2 (en) 2001-12-07 2002-12-05 Method and device for encapsulating electronic components while exerting fluid pressure

Country Status (6)

Country Link
US (1) US20050062199A1 (en)
EP (1) EP1456878A2 (en)
KR (1) KR20040064729A (en)
AU (1) AU2002347678A1 (en)
NL (1) NL1019514C2 (en)
WO (1) WO2003049177A2 (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6297812A (en) * 1985-10-23 1987-05-07 Mitsubishi Electric Corp Resin molding
JPS63202417A (en) * 1987-02-18 1988-08-22 Sakae Riken Kogyo Kk Manufacture of decorative body in plastic product by simultaneous molding
JPS6472816A (en) * 1987-09-16 1989-03-17 Hitachi Ltd Molding device
JPH10146859A (en) * 1996-11-19 1998-06-02 Dowa Mining Co Ltd Resin molded product, and resin molding method and device
JPH11297731A (en) * 1998-04-15 1999-10-29 Hitachi Ltd Molding method and apparatus thereof, and manufacture of semiconductor device
EP0971401A2 (en) * 1998-07-10 2000-01-12 Apic Yamada Corporation Method of manufacturing semiconductor devices and a resin molding machine therefor

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6297812A (en) * 1985-10-23 1987-05-07 Mitsubishi Electric Corp Resin molding
JPS63202417A (en) * 1987-02-18 1988-08-22 Sakae Riken Kogyo Kk Manufacture of decorative body in plastic product by simultaneous molding
JPS6472816A (en) * 1987-09-16 1989-03-17 Hitachi Ltd Molding device
JPH10146859A (en) * 1996-11-19 1998-06-02 Dowa Mining Co Ltd Resin molded product, and resin molding method and device
JPH11297731A (en) * 1998-04-15 1999-10-29 Hitachi Ltd Molding method and apparatus thereof, and manufacture of semiconductor device
EP0971401A2 (en) * 1998-07-10 2000-01-12 Apic Yamada Corporation Method of manufacturing semiconductor devices and a resin molding machine therefor

Non-Patent Citations (5)

* Cited by examiner, † Cited by third party
Title
DATABASE WPI Section Ch Week 199832, Derwent World Patents Index; Class A32, AN 1998-370455, XP002210554 *
DATABASE WPI Section Ch Week 200005, Derwent World Patents Index; Class A32, AN 2000-056681, XP002210553 *
PATENT ABSTRACTS OF JAPAN vol. 011, no. 310 (M - 630) 9 October 1987 (1987-10-09) *
PATENT ABSTRACTS OF JAPAN vol. 012, no. 484 (M - 776) 16 December 1988 (1988-12-16) *
PATENT ABSTRACTS OF JAPAN vol. 013, no. 274 (M - 841) 23 June 1989 (1989-06-23) *

Also Published As

Publication number Publication date
KR20040064729A (en) 2004-07-19
AU2002347678A1 (en) 2003-06-17
NL1019514C2 (en) 2003-06-11
EP1456878A2 (en) 2004-09-15
WO2003049177A2 (en) 2003-06-12
US20050062199A1 (en) 2005-03-24

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