JPS6472816A - Molding device - Google Patents

Molding device

Info

Publication number
JPS6472816A
JPS6472816A JP22954987A JP22954987A JPS6472816A JP S6472816 A JPS6472816 A JP S6472816A JP 22954987 A JP22954987 A JP 22954987A JP 22954987 A JP22954987 A JP 22954987A JP S6472816 A JPS6472816 A JP S6472816A
Authority
JP
Japan
Prior art keywords
cavity
air
space
packed
sealingly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP22954987A
Other languages
Japanese (ja)
Inventor
Osamu Okawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Renesas Eastern Japan Semiconductor Inc
Original Assignee
Hitachi Ltd
Hitachi Tohbu Semiconductor Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Tohbu Semiconductor Ltd filed Critical Hitachi Ltd
Priority to JP22954987A priority Critical patent/JPS6472816A/en
Publication of JPS6472816A publication Critical patent/JPS6472816A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/2608—Mould seals

Abstract

PURPOSE:To prevent the occurrence of flash on the peripheral edge of a package after molding by providing the means of packing air sealingly in the peripheral space of a cavity. CONSTITUTION:A sealing 14 is nipped in between the faces of a top force 1 and a bottom force 2. When a cavity 8 is perfectly filled with resin 17, air is sealingly packed in an air sump 16, a vent path 15 and a space 12. Consequently, the resin 17 packed in the cavity 8 and apt to flow out from the space 12, is prevented from flowing out by the pressure of the air 18 sealingly packed. Accordingly, the flash occurring due to the flowing out of molding material from the peripheral edge of the cavity 8 is prevented.
JP22954987A 1987-09-16 1987-09-16 Molding device Pending JPS6472816A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22954987A JPS6472816A (en) 1987-09-16 1987-09-16 Molding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22954987A JPS6472816A (en) 1987-09-16 1987-09-16 Molding device

Publications (1)

Publication Number Publication Date
JPS6472816A true JPS6472816A (en) 1989-03-17

Family

ID=16893904

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22954987A Pending JPS6472816A (en) 1987-09-16 1987-09-16 Molding device

Country Status (1)

Country Link
JP (1) JPS6472816A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL1019514C2 (en) * 2001-12-07 2003-06-11 Fico Bv Method and device for encapsulating electronic components under the application of fluid pressure.

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL1019514C2 (en) * 2001-12-07 2003-06-11 Fico Bv Method and device for encapsulating electronic components under the application of fluid pressure.
WO2003049177A2 (en) * 2001-12-07 2003-06-12 Fico B.V. Method and device for encapsulating electronic components while exerting fluid pressure
WO2003049177A3 (en) * 2001-12-07 2003-10-16 Fico Bv Method and device for encapsulating electronic components while exerting fluid pressure

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