NL1003444A1 - Werkwijze en inrichting voor het doorsnijden van een vlak werkstuk. - Google Patents

Werkwijze en inrichting voor het doorsnijden van een vlak werkstuk.

Info

Publication number
NL1003444A1
NL1003444A1 NL1003444A NL1003444A NL1003444A1 NL 1003444 A1 NL1003444 A1 NL 1003444A1 NL 1003444 A NL1003444 A NL 1003444A NL 1003444 A NL1003444 A NL 1003444A NL 1003444 A1 NL1003444 A1 NL 1003444A1
Authority
NL
Netherlands
Prior art keywords
cutting
flat workpiece
workpiece
flat
Prior art date
Application number
NL1003444A
Other languages
English (en)
Other versions
NL1003444C2 (nl
Inventor
Tomonori Konya
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Publication of NL1003444A1 publication Critical patent/NL1003444A1/nl
Application granted granted Critical
Publication of NL1003444C2 publication Critical patent/NL1003444C2/nl

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00865—Multistep processes for the separation of wafers into individual elements
    • B81C1/00888—Multistep processes involving only mechanical separation, e.g. grooving followed by cleaving
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P25/00—Auxiliary treatment of workpieces, before or during machining operations, to facilitate the action of the tool or the attainment of a desired final condition of the work, e.g. relief of internal stress
    • B23P25/003—Auxiliary treatment of workpieces, before or during machining operations, to facilitate the action of the tool or the attainment of a desired final condition of the work, e.g. relief of internal stress immediately preceding a cutting tool
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H01L21/3043—Making grooves, e.g. cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1082—Partial cutting bonded sandwich [e.g., grooving or incising]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/02—Other than completely through work thickness
    • Y10T83/0333—Scoring
    • Y10T83/0385—Rotary scoring blade
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/04—Processes
    • Y10T83/0405—With preparatory or simultaneous ancillary treatment of work

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Dicing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
NL1003444A 1995-06-28 1996-06-27 Werkwijze en inrichting voor het doorsnijden van een vlak werkstuk. NL1003444C2 (nl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP16250795 1995-06-28
JP7162507A JPH0917752A (ja) 1995-06-28 1995-06-28 偏平な被切削物の切断方法及びその装置

Publications (2)

Publication Number Publication Date
NL1003444A1 true NL1003444A1 (nl) 1996-12-31
NL1003444C2 NL1003444C2 (nl) 1997-02-12

Family

ID=15755942

Family Applications (1)

Application Number Title Priority Date Filing Date
NL1003444A NL1003444C2 (nl) 1995-06-28 1996-06-27 Werkwijze en inrichting voor het doorsnijden van een vlak werkstuk.

Country Status (3)

Country Link
US (1) US5972154A (nl)
JP (1) JPH0917752A (nl)
NL (1) NL1003444C2 (nl)

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NL1011077C2 (nl) * 1999-01-19 2000-07-20 Meco Equip Eng Werkwijze en inrichting voor het langs een snijlijn(en) van elkaar scheiden van met een gemeenschappelijke drager gevormde producten.
US7387742B2 (en) 2002-03-11 2008-06-17 Becton, Dickinson And Company Silicon blades for surgical and non-surgical use
EP1490191B1 (en) 2002-03-11 2012-07-04 Beaver-Visitec International (US), Inc. Method for the manufacture of surgical blades
EP1662970A2 (en) 2003-09-17 2006-06-07 Becton, Dickinson and Company System and method for creating linear and non-linear trenches in silicon and other crystalline materials with a router
US7396484B2 (en) 2004-04-30 2008-07-08 Becton, Dickinson And Company Methods of fabricating complex blade geometries from silicon wafers and strengthening blade geometries
US8426293B2 (en) * 2004-07-09 2013-04-23 Semiconductor Energy Laboratory Co., Ltd. IC chip and its manufacturing method
WO2006008829A1 (ja) * 2004-07-22 2006-01-26 Renesas Technology Corp. 半導体装置の製造方法
JP4560391B2 (ja) * 2004-12-08 2010-10-13 キヤノン株式会社 液体吐出ヘッドの製造方法
JP4617150B2 (ja) * 2004-12-09 2011-01-19 キヤノン株式会社 ウエハのダイシング方法
US7531432B2 (en) * 2007-02-14 2009-05-12 Texas Instruments Incorporated Block-molded semiconductor device singulation methods and systems
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US8647966B2 (en) * 2011-06-09 2014-02-11 National Semiconductor Corporation Method and apparatus for dicing die attach film on a semiconductor wafer
TWI488231B (zh) * 2012-01-18 2015-06-11 Xintec Inc 半導體封裝件及其製法與製作其系統
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CN103560081A (zh) * 2013-11-13 2014-02-05 崔庆珑 晶圆切割和研磨用膜的加工工艺
JP6289886B2 (ja) * 2013-12-03 2018-03-07 株式会社ディスコ ウエーハの切削方法
CN104526891B (zh) * 2014-12-18 2017-01-11 浙江中纳晶微电子科技有限公司 采用机械刀具切割晶圆的方法
AU2016208585A1 (en) 2015-01-22 2017-08-03 BASF Agro B.V. Ternary herbicidal combination comprising saflufenacil
JP2016192494A (ja) * 2015-03-31 2016-11-10 株式会社ディスコ ウエーハの分割方法
AU2016292677B2 (en) 2015-07-10 2020-09-24 BASF Agro B.V. Herbicidal composition comprising cinmethylin and specific quinolinecarboxylic acids
HUE044213T2 (hu) 2015-07-10 2019-10-28 Basf Agro Bv Cinmetilint és petoxamidot tartalmazó herbicid készítmény
US10813356B2 (en) 2015-07-10 2020-10-27 BASF Agro B.V. Herbicidal composition comprising cinmethylin and dimethenamid
JP6875368B2 (ja) 2015-07-10 2021-05-26 ビーエーエスエフ アグロ ベー．ブイ． シンメチリン及びアセトクロール又はプレチラクロールを含む除草剤組成物
PL3319437T3 (pl) 2015-07-10 2020-03-31 BASF Agro B.V. Kompozycja chwastobójcza zawierająca cynmetylinę i piroksasulfon
US11219215B2 (en) 2015-07-10 2022-01-11 BASF Agro B.V. Herbicidal composition comprising cinmethylin and specific inhibitors of protoporphyrinogen oxidase
EP3162209A1 (en) 2015-10-27 2017-05-03 BASF Agro B.V. Herbicidal composition comprising cinmethylin and imazamox
WO2017009142A1 (en) 2015-07-10 2017-01-19 BASF Agro B.V. Herbicidal composition comprising cinmethylin and specific pigment synthesis inhibitors
CN107846893B (zh) 2015-07-10 2024-02-20 巴斯夫农业公司 包含环庚草醚和苯嘧磺草胺的除草组合物
US11219212B2 (en) 2015-07-10 2022-01-11 BASF Agro B.V. Herbicidal composition comprising cinmethylin and imazamox
JP7130912B2 (ja) * 2018-04-20 2022-09-06 株式会社東京精密 テープ付きウェーハの加工装置及びその加工方法
JP7333499B2 (ja) * 2018-04-20 2023-08-25 株式会社東京精密 テープ付きウェーハの加工装置及びその加工方法

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Also Published As

Publication number Publication date
JPH0917752A (ja) 1997-01-17
US5972154A (en) 1999-10-26
NL1003444C2 (nl) 1997-02-12

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Effective date: 20030101